Texas Instruments TLV77125PDQNR

Overview

TLV77125PDQNR from Texas Instruments is a 150mA, fixed 2.5V output low-dropout linear regulator in a 1mm × 1mm X2SON-4 package. It delivers high PSRR (55dB at 1MHz), operates from 1.4V to 5.5V input, achieves ±2% output accuracy, and maintains regulation with only 113mV dropout at 150mA - enabling use in space-constrained portable power rails for core logic or I/O supplies.

For engineers reviewing the TLV77125PDQNR datasheet, TLV77125PDQNR pinout, TLV77125PDQNR application, or TLV77125PDQNR equivalent, key selection criteria include its ultra-small footprint, active output discharge, foldback current limiting, thermal shutdown behavior, and compatibility with 0.47µF–40µF ceramic output capacitors without external compensation.

Technical Context

The TLV77125PDQNR implements a CMOS-based pass transistor architecture with internal soft-start and an active pulldown circuit tied to the EN pin. Its feedback loop is optimized for stability with minimal 1µF input and 0.47µF output ceramic capacitors, eliminating need for ESR tuning.

Functional modes include normal regulation (VIN ≥ VOUT + VDO), dropout tracking (VIN < VOUT + VDO), and disabled state with automatic output discharge. Enable thresholds are VEN(HI) = 0.9V and VEN(LOW) = 0.3V, supporting direct interfacing with 1.8V/3.3V logic without level-shifting.

Key Specifications

Pinout & Package

The TLV77125PDQNR is housed in a 1mm × 1mm, 4-pin X2SON (DQN) package with exposed thermal pad. This ultra-compact leadless package supports high-density PCB layouts and provides enhanced thermal performance when the thermal pad is soldered to a ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TLS850F25BXTMA1 and MCP1826T-2502E/DB, the TLV77125PDQNR offers the smallest footprint (1mm²), integrated active discharge, and optimal PSRR for portable consumer electronics - trading off automotive qualification and raw current capacity for size, integration, and noise performance.

Availability

TLV77125PDQNR is available at Aetrix Electronics and suitable for smartphone power management, camera module biasing, gaming peripheral interface, and streaming media player audio codec applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TLV77125PDQNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs and precision analog solutions.

The TLV771 family is designed for space-constrained, battery-powered applications demanding high PSRR, low quiescent current, and fast transient response - targeting portable consumer electronics and industrial edge sensors.

FAQ

What is the maximum input voltage rating for TLV77125PDQNR?

The absolute maximum input voltage for TLV77125PDQNR is 6.5V, but the recommended operating range is 1.4V to 5.5V. Exceeding 5.5V may cause permanent damage or degrade long-term reliability, even if within absolute maximum limits. For robust design, maintain VIN ≤ 5.5V under all conditions including transients and ripple.

Does TLV77125PDQNR require an input capacitor for stability?

No, TLV77125PDQNR does not require an input capacitor for stability, but a 1µF ceramic capacitor is strongly recommended between IN and GND to improve transient response, reduce input impedance, and suppress high-frequency noise. Without it, line transients or source inductance may induce ringing or instability in sensitive systems.

What is the purpose of the thermal pad on the TLV77125PDQNR package?

The thermal pad on TLV77125PDQNR is a non-electrical mechanical feature designed to enhance heat dissipation from the silicon die to the PCB ground plane. It must be soldered to a large-area GND copper pour using multiple thermal vias - not left floating or connected to any other potential - to maintain junction temperature within the –40°C to +125°C operating range.

Can TLV77125PDQNR be used with output capacitors smaller than 0.47µF?

No - TLV77125PDQNR requires a minimum effective output capacitance of 0.47µF for guaranteed stability across temperature, voltage, and process variation. Due to ceramic capacitor derating (often 50%), a nominal 1µF X7R capacitor is recommended to ensure ≥0.47µF effective value under bias and temperature extremes.

How does the foldback current limit behave during a short-circuit event on TLV77125PDQNR?

During a short-circuit event, TLV77125PDQNR transitions from brick-wall current limiting (~200–460mA) to foldback mode, reducing output current to ~42mA as VOUT drops below VFOLDBACK. This reduces power dissipation and mitigates thermal runaway, allowing the device to remain operational or enter thermal shutdown only under sustained fault conditions.