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Texas Instruments TLV9002IDR

Part No.:
TLV9002IDR
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixTLV9002IDR.pdf
Description:
IC OPAMP GP 2 CIRCUIT 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,611

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Product details

Overview

TLV9002IDR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, cost-sensitive systems operating from 1.8 V to 5.5 V supply. It delivers 1 MHz unity-gain bandwidth, ±0.4 mV input offset voltage, 60 µA per channel quiescent current, and 27 nV/√Hz broadband noise-enabling precision signal conditioning in space-constrained smoke detectors and wearable electronics.

For engineers reviewing the TLV9002IDR datasheet, TLV9002IDR pinout, TLV9002IDR application, or TLV9002IDR equivalent, key selection criteria include its capacitive-load drive capability (500 pF), resistive open-loop output impedance for stable high-capacitance interfacing, integrated RFI/EMI filtering, and extended –40°C to 125°C temperature range compliance.

Technical Context

The TLV9002IDR implements a scalable CMOS architecture designed specifically for low-voltage operation with rail-to-rail input common-mode range extending 100 mV beyond rails and rail-to-rail output swing within 10 mV of supply rails. Its unity-gain stable design eliminates external compensation requirements across all gain configurations.

Internal EMI/RFI rejection filtering suppresses high-frequency interference without external components, while the resistive open-loop output impedance enables stable operation into ≥500 pF capacitive loads-critical for driving long traces or ADC input capacitance in sensor front-ends.

Key Specifications

ParameterValue and Actual Design Meaning
ChannelsDual-channel amplifier enabling independent signal paths in compact layouts
Supply Voltage Range1.8 V to 5.5 V-supports single-cell Li-ion, coin-cell, and 3.3 V/5 V system rails
Unity-Gain Bandwidth1 MHz-sufficient for DC–100 kHz sensor signal amplification and active filter implementation
Input Offset Voltage±0.4 mV-minimizes DC error in low-side current sensing and precision instrumentation
Quiescent Current per Channel60 µA-enables battery-powered operation with multi-year runtime in wearables and smoke detectors
Input Bias Current5 pA-preserves signal integrity when interfacing high-impedance sources like thermistors or photodiodes
Output Drive Capability500 pF capacitive load-eliminates need for isolation resistors when driving SAR ADC inputs or long PCB traces

Pinout & Package

TLV9002IDR is packaged in an 8-pin SOIC (D) package measuring 3.91 mm × 4.90 mm with standard lead pitch and thermal performance suitable for industrial ambient conditions.

Pin/TerminalCircuit RoleDesign Meaning
OUT1 (Pin 1)Output, Channel 1Amplified signal output referenced to V–; rail-to-rail swing supports full dynamic range utilization
IN1– (Pin 2)Inverting Input, Channel 1Differential input node accepting feedback network for inverting configuration
IN1+ (Pin 3)Noninverting Input, Channel 1Differential input node for noninverting configuration; rail-to-rail common-mode range allows ground-referenced sensing
V– (Pin 4)Negative Supply / GroundReference return path; accepts single-supply operation down to 1.8 V with V+ as sole positive rail
IN2+ (Pin 5)Noninverting Input, Channel 2Independent second channel input; enables dual-sensor interfaces or differential pair processing
IN2– (Pin 6)Inverting Input, Channel 2Second channel inverting input; supports matched gain-setting networks for consistent channel performance
OUT2 (Pin 7)Output, Channel 2Second independent output; identical AC/DC specs to OUT1 enable synchronized dual-path signal chains
V+ (Pin 8)Positive SupplyPrimary power input; operates over full 1.8–5.5 V range with no external regulation required

Key Features

FeatureDesign Value
Rail-to-rail I/OEnables full-scale signal capture in single-supply systems without level-shifting circuitry
Resistive open-loop output impedanceAllows stable operation into >500 pF loads-reduces need for output isolation resistors in ADC driver applications
Integrated RFI/EMI filterSuppresses high-frequency interference from switching regulators or RF sources without external RC filters
Extended temperature range–40°C to 125°C operation supports deployment in HVAC control modules and motor-drive feedback circuits
Low input bias current5 pA enables accurate amplification of signals from high-impedance sensors (e.g., pH electrodes, piezoelectric elements)

Applications

Smoke DetectorsWearable Devices

Use Scenario: Amplifying weak ionization chamber currents in battery-powered residential smoke alarms.

IC Role / Device Role / Timing Role: Precision low-noise transimpedance amplifier converting picoamp-level sensor current to measurable voltage.

Use Value: 60 µA/channel quiescent current extends battery life to 10+ years; ±0.4 mV offset ensures reliable alarm triggering across temperature extremes.

Use Scenario: Conditioning biopotential signals (ECG, EMG) in compact fitness trackers.

IC Role / Device Role / Timing Role: First-stage instrumentation amplifier with rail-to-rail input enabling direct connection to dry-electrode sensors.

Use Value: 27 nV/√Hz noise floor preserves signal fidelity; 1.8 V minimum supply supports direct coin-cell operation without boost converters.

Motor Control: AC InductionLow-Side Current Sensing

Use Scenario: Isolating and scaling shunt voltage in inverter phase-leg current feedback loops.

IC Role / Device Role / Timing Role: High-accuracy differential amplifier rejecting common-mode noise from PWM switching edges.

Use Value: Rail-to-rail output swing ensures full ADC utilization; 1 MHz bandwidth captures fast transient current events during fault conditions.

Use Scenario: Measuring load current in smart appliance power modules using inline shunt resistors.

IC Role / Device Role / Timing Role: Single-supply difference amplifier referenced to system ground for bidirectional current detection.

Use Value: ±0.4 mV input offset minimizes zero-current error; 5 pA input bias prevents shunt resistor loading errors at microamp-level standby currents.

Equivalent & Alternatives

The following parts are listed as comparable options for similar operational amplifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TLV9002IPWRSame electrical specs; 8-pin TSSOP (PW) package (3.00 mm × 4.40 mm) instead of SOIC (D)Better thermal performance in high-density layouts due to smaller footprint and exposed pad optionSelect TLV9002IPWR when board space is constrained or thermal dissipation exceeds SOIC limits
LMV358IDRHigher quiescent current (150 µA/ch), lower bandwidth (1 MHz same), wider offset (±3 mV), no integrated EMI filterLimited suitability for ultra-low-power or EMI-prone environments like wearable RF co-locationChoose LMV358IDR only if legacy compatibility or cost sensitivity outweighs low-power and noise advantages

Compared with TLV9002IDR, TLV9002IPWR offers identical performance in a smaller TSSOP package ideal for space-constrained designs, while LMV358IDR trades off power efficiency and EMI robustness for broader legacy support-making TLV9002IDR optimal for next-generation battery-powered and noise-sensitive applications.

Availability

TLV9002IDR is available at Aetrix Electronics and suitable for smoke detectors, wearable devices, and low-side current sensing requiring stable component supply across automotive, industrial, and consumer production programs.

Supply support for TLV9002IDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision amplifiers, power management, and signal chain solutions.

The TLV900x product line was engineered for cost-sensitive, space-constrained systems demanding low-voltage operation, rail-to-rail performance, and robust EMI immunity-targeting applications including safety-critical sensors and portable electronics.

FAQ

What is the maximum capacitive load the TLV9002IDR can drive stably?

The TLV9002IDR is characterized to drive up to 500 pF capacitive load stably without external compensation, thanks to its resistive open-loop output impedance. This specification is verified per TI's SBOS833R datasheet Section 7.10 and enables direct interfacing with SAR ADC inputs and long PCB traces in sensor signal chains. The TLV9002IDR maintains phase margin >45° under this condition.

Does the TLV9002IDR support single-supply operation?

Yes, the TLV9002IDR supports true single-supply operation from 1.8 V to 5.5 V, with rail-to-rail input common-mode range extending 100 mV beyond both supply rails and rail-to-rail output swing within 10 mV of V– and V+. This allows ground-referenced sensor interfaces-such as low-side current shunts-without level-shifting circuitry, as confirmed in the Electrical Characteristics table of the TLV9002IDR datasheet.

What is the input offset voltage specification for TLV9002IDR over temperature?

The TLV9002IDR has a maximum input offset voltage of ±0.4 mV at room temperature (25°C), with a typical drift of ±0.15 µV/°C over the full –40°C to 125°C operating range. This low drift ensures minimal baseline error in precision applications like smoke detector ionization current measurement, where long-term stability directly impacts false-alarm rate.

Is the TLV9002IDR pin-compatible with other devices in the TLV900x family?

No-the TLV9002IDR (8-pin SOIC) shares pinout compatibility only with other TLV9002 variants in SOIC, VSSOP, TSSOP, SOT-23, and WSON packages, as defined in Table 6-3 of the SBOS833R datasheet. It is not pin-compatible with TLV9001 (5-pin) or TLV9004 (14-/16-pin) packages due to differing channel count and pin assignments.

What ESD protection does the TLV9002IDR provide?

The TLV9002IDR provides ±2000 V HBM (Human Body Model) and ±1500 V CDM (Charged Device Model) ESD ratings per JEDEC standards JS-001 and JESD22-C101. These values apply to the SOIC (D) package variant and ensure robust handling during automated assembly and field operation in industrial environments, as specified in Section 7.2 of the official datasheet.

TLV9002IDR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Amplifier Type:
General Purpose
Number of Circuits:
2
Output Type:
Rail-to-Rail
Slew Rate:
2V/µs
Gain Bandwidth Product:
1 MHz
-3db Bandwidth:
-
Current - Input Bias:
5 pA
Voltage - Input Offset:
400 µV
Current - Supply:
60µA
Current - Output / Channel:
40 mA
Voltage - Supply Span (Min):
1.8 V
Voltage - Supply Span (Max):
5.5 V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

TLV9002IDR FAQ

1.How can I place an order for TLV9002IDR through Aetrix?

Please submit a Request for Quotation (RFQ) for TLV9002IDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TLV9002IDR reliable?

The price and inventory of TLV9002IDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV9002IDR is usually 5 days.

3.What payment methods are accepted for TLV9002IDR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV9002IDR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TLV9002IDR?

TLV9002IDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TLV9002IDR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TLV9002IDR?

For technical support, including TLV9002IDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV9002IDR requirements.

6.How does Aetrix verify that TLV9002IDR is sourced from the original manufacturer or authorized distributors?

All TLV9002IDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV9002IDR meets industry standards.

7.What is the process for return or replacement of TLV9002IDR?

All TLV9002IDR units undergo pre-shipment inspection (PSI). If there is an issue with TLV9002IDR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TLV9002IDR part is unused and in its original packaging.

Return procedure for TLV9002IDR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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