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Texas Instruments TLV9002IDSGR
- Part No.:
- TLV9002IDSGR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
TLV9002IDSGR.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:7,865
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Product details
Overview
TLV9002IDSGR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, cost-sensitive systems operating from 1.8 V to 5.5 V supply. It delivers ±0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 60 µA per channel quiescent current, and 27 nV/√Hz broadband noise-enabling precision signal conditioning in space-constrained smoke detectors and wearable electronics.
For engineers reviewing the TLV9002IDSGR datasheet, TLV9002IDSGR pinout, TLV9002IDSGR application, or TLV9002IDSGR equivalent, key selection criteria include capacitive-load drive capability (500 pF), resistive open-loop output impedance for stable high-capacitance operation, EMI/RFI filtering, and –40°C to 125°C extended temperature range compliance.
Technical Context
The TLV9002IDSGR implements a scalable CMOS architecture with unity-gain stability and no phase reversal under overdrive. Its integrated RFI/EMI rejection filter enhances immunity in noisy environments such as motor control and HVAC sensor interfaces.
Designed specifically for low-voltage operation, it maintains rail-to-rail swing across 1.8 V–5.5 V supplies while delivering consistent performance-including 5 pA input bias current and 500 pF capacitive-load drive-without requiring external compensation components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | Dual-channel: enables compact dual-signal paths in sensor front-ends and differential amplification without discrete duplication. |
| Supply Voltage Range | 1.8 V to 5.5 V: supports direct integration into single-cell Li-ion, coin-cell, and 3.3 V/5 V industrial logic rails. |
| Unity-Gain Bandwidth | 1 MHz: sufficient for anti-aliasing, active filtering, and low-speed sensor signal conditioning up to ~100 kHz closed-loop. |
| Input Offset Voltage | ±0.4 mV max: reduces DC error in current sensing and bridge amplifier applications without trimming. |
| Quiescent Current | 60 µA per channel: allows battery-powered wearables and smoke detectors to achieve multi-year operation on small cells. |
| Input Bias Current | 5 pA typical: minimizes voltage drop across high-impedance sources like thermistors and photodiodes. |
| Capacitive Load Drive | 500 pF: permits direct driving of ADC input capacitors or long PCB traces without oscillation risk. |
Pinout & Package
TLV9002IDSGR uses an 8-pin WSON (DSG) package with 2.00 mm × 2.00 mm body size and exposed thermal pad (connected to V–). This ultra-compact, leadless package supports high-density PCB layouts and improved thermal dissipation in thermally constrained modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1 | Output, Channel 1 | Amplified signal output for first op-amp; rail-to-rail swing supports full dynamic range utilization. |
| IN1– | Inverting Input, Channel 1 | Differential input node for channel 1; 5 pA bias current preserves accuracy with high-Z sensors. |
| IN1+ | Noninverting Input, Channel 1 | Reference-side input for channel 1; rail-to-rail common-mode range accepts signals down to V–. |
| V– | Negative Supply / Ground | Low-side supply rail or ground reference; thermal pad must be connected here for optimal thermal performance. |
| IN2+ | Noninverting Input, Channel 2 | Independent input for second op-amp; enables dual-path signal processing in same footprint. |
| IN2– | Inverting Input, Channel 2 | Second differential input; matched offset and bias enable consistent dual-channel behavior. |
| OUT2 | Output, Channel 2 | Second independent output; identical AC/DC specs to OUT1 support matched gain stages. |
| V+ | Positive Supply | High-side supply rail; operates down to 1.8 V, enabling compatibility with modern low-voltage MCUs. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O | Enables full supply-range signal swing-critical for maximizing SNR in low-voltage ADC interfaces. |
| Resistive open-loop output impedance | Reduces peaking and simplifies stability with >500 pF loads-eliminates need for isolation resistors in capacitive-driven stages. |
| Integrated RFI/EMI filter | Suppresses high-frequency interference from switching regulators and RF transceivers without external RC networks. |
| Extended temperature range | –40°C to 125°C operation ensures reliability in automotive cabin modules and industrial HVAC controllers. |
| Low quiescent current | 60 µA/ch allows continuous monitoring in always-on smoke detectors without compromising battery life. |
Applications
| Smoke Detectors | Wearable Devices |
|---|---|
Use Scenario: Amplifying weak ionization chamber or photoelectric sensor currents in residential/commercial fire alarms. IC Role / Device Role / Timing Role: Precision low-noise transimpedance amplifier converting pA-level photocurrents into measurable voltage. Use Value: ±0.4 mV offset and 27 nV/√Hz noise preserve signal integrity at sub-mV levels, improving false-alarm immunity. | Use Scenario: Conditioning biosensor outputs (ECG, PPG) in compact fitness trackers and smartwatches. IC Role / Device Role / Timing Role: Dual-channel signal conditioner for simultaneous analog front-end paths with shared power domain. Use Value: 60 µA/ch quiescent current extends battery runtime; rail-to-rail I/O maximizes dynamic range from 1.8 V supply. |
| Motor Control: AC Induction | HVAC Systems |
Use Scenario: Low-side current sensing in inverter gate drivers for variable-speed fans and compressors. IC Role / Device Role / Timing Role: High-accuracy, low-drift amplifier for shunt-based current feedback in closed-loop torque control. Use Value: 5 pA input bias avoids error from high-value gain-setting resistors; 125°C rating survives near-motor thermal zones. | Use Scenario: Signal conditioning for temperature, humidity, and airflow sensors in thermostats and air handlers. IC Role / Device Role / Timing Role: Dual op-amp supporting both sensor excitation and measurement path in compact environmental modules. Use Value: Dual configuration reduces component count; 1.8 V minimum supply enables direct MCU I/O rail interfacing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV9002IDR | Same electrical specs; SOIC-8 package (3.91 mm × 4.90 mm), no exposed thermal pad. | Better suited for prototyping and manual soldering; lower thermal performance than WSON. | Select TLV9002IDR for breadboarding or legacy board compatibility where thermal density is not critical. |
| LMV358IDR | Higher quiescent current (150 µA/ch), wider offset (±3 mV), lower bandwidth (1.4 MHz), no EMI filter. | Acceptable for non-critical consumer appliances but lacks precision and noise performance for smoke detection. | Choose LMV358IDR only when cost is primary constraint and extended temperature or low-noise operation is unnecessary. |
Compared with TLV9002IDSGR, TLV9002IDR offers identical functionality in a larger, easier-to-handle package-ideal for development-but sacrifices thermal efficiency. LMV358IDR trades precision, power, and EMI robustness for legacy compatibility and broader distributor availability.
Availability
TLV9002IDSGR is available at Aetrix Electronics and suitable for smoke detectors, wearable electronics, and HVAC sensor modules requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for TLV9002IDSGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision amplifiers and low-power signal chain solutions.
The TLV900x product line was engineered for cost-sensitive, space-constrained systems demanding rail-to-rail performance at ultra-low supply voltages-targeting smoke detectors, wearables, and appliance control units.
FAQ
What is the maximum capacitive load the TLV9002IDSGR can drive without instability?
The TLV9002IDSGR is characterized to drive up to 500 pF capacitive load while maintaining stability. Its resistive open-loop output impedance eliminates the need for external isolation resistors commonly required with other op-amps, making it ideal for direct connection to ADC inputs or long PCB traces in sensor interfaces.
Does the TLV9002IDSGR include EMI/RFI filtering, and how does it affect system design?
Yes, the TLV9002IDSGR integrates an internal RFI and EMI rejection filter. This feature suppresses high-frequency interference from nearby switching regulators or wireless transceivers, reducing the need for external ferrite beads or RC filters-and simplifying layout in compact, noise-prone environments like wearable devices.
Can the TLV9002IDSGR operate from a single 1.8 V supply, and what performance is guaranteed at that voltage?
Yes, the TLV9002IDSGR is fully specified from 1.8 V to 5.5 V supply. At 1.8 V, it maintains rail-to-rail input/output swing, 1 MHz unity-gain bandwidth, ±0.4 mV input offset voltage, and 60 µA per channel quiescent current-enabling reliable operation in energy-harvesting and coin-cell-powered systems.
What is the thermal pad connection requirement for the TLV9002IDSGR WSON package?
The exposed thermal pad on the TLV9002IDSGR's WSON package must be connected to the V– (ground or negative supply) plane. This connection is essential for achieving specified thermal resistance and ensuring reliable operation at elevated ambient temperatures up to 125°C in applications like HVAC control modules.
Is the TLV9002IDSGR pin-compatible with other members of the TLV900x family, such as the TLV9002IDR?
No-TLV9002IDSGR (WSON-8) and TLV9002IDR (SOIC-8) share identical pin functions but differ in physical layout and thermal pad presence. While electrical pin mapping matches (e.g., Pin 1 = OUT1, Pin 2 = IN1–), PCB footprints are not interchangeable due to package geometry and thermal pad requirements.
TLV9002IDSGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 2V/µs
- Gain Bandwidth Product:
- 1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 5 pA
- Voltage - Input Offset:
- 400 µV
- Current - Supply:
- 60µA
- Current - Output / Channel:
- 40 mA
- Voltage - Supply Span (Min):
- 1.8 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (2x2)
TLV9002IDSGR FAQ
1.How can I place an order for TLV9002IDSGR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV9002IDSGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV9002IDSGR reliable?
The price and inventory of TLV9002IDSGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV9002IDSGR is usually 5 days.
3.What payment methods are accepted for TLV9002IDSGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV9002IDSGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV9002IDSGR?
TLV9002IDSGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV9002IDSGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV9002IDSGR?
For technical support, including TLV9002IDSGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV9002IDSGR requirements.
6.How does Aetrix verify that TLV9002IDSGR is sourced from the original manufacturer or authorized distributors?
All TLV9002IDSGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV9002IDSGR meets industry standards.
7.What is the process for return or replacement of TLV9002IDSGR?
All TLV9002IDSGR units undergo pre-shipment inspection (PSI). If there is an issue with TLV9002IDSGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV9002IDSGR part is unused and in its original packaging.
Return procedure for TLV9002IDSGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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