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Texas Instruments TLV9002SIDGSR
- Part No.:
- TLV9002SIDGSR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TLV9002SIDGSR.pdf
- Description:
- IC OPAMP GP 2 CIRCUIT 10VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:17,877
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Product details
Overview
TLV9002SIDGSR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, cost-sensitive systems operating from 1.8 V to 5.5 V supply. It delivers ±0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 60 µA per channel quiescent current, and stable operation into 500 pF capacitive loads-enabling precision sensor signal conditioning in wearable devices and smoke detectors.
For engineers reviewing the TLV9002SIDGSR datasheet, TLV9002SIDGSR pinout, TLV9002SIDGSR application, or TLV9002SIDGSR equivalent, key selection criteria include low-voltage rail-to-rail performance, EMI/RFI filtering, shutdown capability, extended temperature range (–40°C to 125°C), and compatibility with high-capacitive-load interfaces in space-constrained industrial and consumer electronics.
Technical Context
The TLV9002SIDGSR implements a scalable CMOS architecture designed for single-supply operation down to 1.8 V, with resistive open-loop output impedance that simplifies stabilization under heavy capacitive loading. Its internal RFI/EMI filter and no-phase-reversal behavior during overdrive enhance robustness in noisy environments like HVAC control and motor drive feedback paths.
This dual op-amp features unity-gain stability without external compensation and supports shutdown mode (SHDN1/SHDN2) with typical standby current <1 µA per channel. The device operates across –40°C to 125°C and maintains specified performance over its full 1.8 V–5.5 V supply range-critical for battery-powered and thermally demanding applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | Dual independent amplifiers for differential sensing or signal splitting |
| Supply Voltage Range | 1.8 V to 5.5 V - enables direct integration with Li-ion, coin-cell, and 3.3 V logic rails |
| Unity-Gain Bandwidth | 1 MHz - supports medium-speed active filters and sensor interface bandwidths up to ~100 kHz |
| Input Offset Voltage | ±0.4 mV - ensures ≤0.1% gain error in 100× gain configurations at room temperature |
| Quiescent Current / Ch | 60 µA - allows continuous operation for >1 year on a CR2032 battery in low-duty-cycle systems |
| Capacitive Load Drive | 500 pF - eliminates need for isolation resistors when driving ADC inputs or long PCB traces |
| Input Bias Current | 5 pA - minimizes voltage error in high-impedance pH or photodiode sensor interfaces |
| Operating Temperature | –40°C to 125°C - qualified for automotive cabin modules and industrial motor controllers |
Pinout & Package
TLV9002SIDGSR is packaged in an 8-pin WSON (DSG) package with 2.00 mm × 2.00 mm body size and exposed thermal pad connected to V–. This leadless, space-saving package supports high-density layouts and improved thermal dissipation in compact designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1 | Output, Channel 1 | Amplified signal output with rail-to-rail swing; connects directly to ADC input or next-stage buffer |
| IN1– | Inverting Input, Channel 1 | High-impedance node for feedback network or inverting configuration; accepts signals down to V– – 0.5 V |
| IN1+ | Noninverting Input, Channel 1 | High-impedance node for reference or sensor input; common-mode range extends to rails |
| V– | Negative Supply / Ground | Reference for single-supply operation; thermal pad must be soldered to this net for thermal reliability |
| IN2+ | Noninverting Input, Channel 2 | Independent input for second signal path; electrically isolated from Channel 1 except shared supplies |
| IN2– | Inverting Input, Channel 2 | Supports differential pair configuration with IN2+; same ESD and common-mode specs as Channel 1 |
| OUT2 | Output, Channel 2 | Second rail-to-rail output; usable for dual-sensor monitoring or signal redundancy |
| V+ | Positive Supply | Primary power rail; must be decoupled locally with ≥0.1 µF ceramic capacitor near pin |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail I/O | Enables full dynamic range utilization in 1.8 V–3.3 V systems without level-shifting circuitry |
| Internal RFI/EMI Filter | Reduces susceptibility to GSM, Wi-Fi, and switching regulator noise without external RC filters |
| Resistive Open-Loop Output Impedance | Allows stable operation into >1 nF loads-ideal for driving SAR ADC sample capacitors directly |
| Shutdown Mode (SHDN1/SHDN2) | Independent control of each amplifier reduces system-level power by >99% during idle periods |
| No Phase Reversal in Overdrive | Prevents latch-up or false triggering in comparator-like configurations during input saturation |
| Extended Temperature Range | Guarantees parametric performance across automotive and industrial ambient conditions |
Applications
| Smoke Detectors | Wearable Health Monitors |
|---|---|
Use Scenario: Amplifying weak ionization chamber currents (<100 pA) in battery-powered residential smoke alarms. IC Role / Device Role / Timing Role: Low-noise, low-IQ transimpedance amplifier converting current to measurable voltage. Use Value: 5 pA input bias current prevents signal loss; 60 µA/channel enables multi-year CR123A battery life. | Use Scenario: Conditioning photoplethysmography (PPG) signals from green LEDs in wrist-worn pulse oximeters. IC Role / Device Role / Timing Role: Dual-channel signal conditioner: one channel for AC-coupled PPG, one for DC ambient light subtraction. Use Value: Rail-to-rail output drives 12-bit SAR ADC directly; 1 MHz bandwidth preserves pulse shape fidelity. |
| Motor Control Feedback | HVAC Sensor Interface |
Use Scenario: Amplifying low-side shunt voltage in BLDC motor inverters for real-time current regulation. IC Role / Device Role / Timing Role: Precision current-sense amplifier with fast settling for PWM cycle-by-cycle control. Use Value: ±0.4 mV offset ensures <1% current measurement error at 1 A; 125°C rating survives near-motor placement. | Use Scenario: Signal conditioning for NTC thermistors and humidity sensors in smart thermostats. IC Role / Device Role / Timing Role: Dual op-amp implementing ratiometric bridge excitation and linearization amplifier. Use Value: Dual-channel integration reduces BOM count; 1.8 V operation matches MCU I/O voltage for direct ADC interfacing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TLV9002IDR | Same electrical specs, SOIC-8 package (3.91 mm × 4.90 mm); no exposed thermal pad | Preferred for through-hole prototyping or legacy board compatibility; lower thermal performance than WSON | Select when mechanical mounting or hand-soldering is required; avoid in thermally constrained spaces |
| LMV358IDR | Higher IQ (150 µA/ch), wider VS range (2.7–5.5 V), no shutdown, no EMI filter, 1.2 MHz GBW | Better for cost-driven 3.3 V/5 V systems where ultra-low power is not critical | Choose when existing LMV358 design needs drop-in replacement with minor layout changes |
Compared with TLV9002IDR, TLV9002SIDGSR offers superior thermal management and smaller footprint; compared with LMV358IDR, it delivers 60% lower quiescent current, integrated EMI filtering, and true 1.8 V operation-making it optimal for next-generation portable and energy-harvested systems.
Availability
TLV9002SIDGSR is available at Aetrix Electronics and suitable for smoke detectors, wearable health monitors, and HVAC sensor interfaces requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for TLV9002SIDGSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of op-amp innovation and automotive-grade qualification expertise.
The TLV900x product line was engineered specifically for cost-sensitive, space-constrained applications requiring low-voltage operation, rail-to-rail performance, and robust noise immunity-including battery-powered safety and sensing systems.
FAQ
What is the maximum capacitive load the TLV9002SIDGSR can drive while maintaining stability?
The TLV9002SIDGSR is characterized to drive up to 500 pF capacitively without external compensation. Its resistive open-loop output impedance enables stable operation into significantly higher loads-verified up to 1 nF in application circuits-making it suitable for direct connection to ADC sample-and-hold capacitors and long PCB traces without isolation resistors.
Does the TLV9002SIDGSR support true single-supply operation from 1.8 V?
Yes, the TLV9002SIDGSR operates fully specified from 1.8 V to 5.5 V supply. Its rail-to-rail input common-mode range extends from V– – 0.5 V to V+ + 0.5 V, and rail-to-rail output swing reaches within 10 mV of both rails at 1.8 V, enabling accurate signal acquisition in ultra-low-voltage microcontroller-based systems.
How does the shutdown function work on the TLV9002SIDGSR?
The TLV9002SIDGSR includes two independent shutdown pins (SHDN1 and SHDN2) referenced to V+. Driving either pin low disables its respective amplifier channel, reducing quiescent current to <1 µA per channel. Both channels remain enabled when SHDN1 and SHDN2 are high or left floating (internal pull-up ensures default active state).
Is the TLV9002SIDGSR pin-compatible with other packages in the TLV9002 family?
No-TLV9002SIDGSR uses the 8-pin WSON (DSG) package with exposed thermal pad, while TLV9002IDR uses SOIC-8 and TLV9002IPWR uses TSSOP-8. Pin numbering and thermal pad requirements differ; PCB layout must be redesigned for package substitution. Electrical functionality remains identical across all TLV9002 variants.
What is the input voltage range specification for the TLV9002SIDGSR?
The TLV9002SIDGSR supports a common-mode input voltage range from V– – 0.5 V to V+ + 0.5 V, verified across its full supply range (1.8 V–5.5 V). This rail-to-rail input capability allows direct interfacing with sensors and DACs operating at the supply rails, including ground-referenced thermistors and 1.8 V logic outputs.
TLV9002SIDGSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 2V/µs
- Gain Bandwidth Product:
- 1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 5 pA
- Voltage - Input Offset:
- 400 µV
- Current - Supply:
- 60µA
- Current - Output / Channel:
- 40 mA
- Voltage - Supply Span (Min):
- 1.8 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-VSSOP
TLV9002SIDGSR FAQ
1.How can I place an order for TLV9002SIDGSR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV9002SIDGSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV9002SIDGSR reliable?
The price and inventory of TLV9002SIDGSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV9002SIDGSR is usually 5 days.
3.What payment methods are accepted for TLV9002SIDGSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV9002SIDGSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV9002SIDGSR?
TLV9002SIDGSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV9002SIDGSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV9002SIDGSR?
For technical support, including TLV9002SIDGSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV9002SIDGSR requirements.
6.How does Aetrix verify that TLV9002SIDGSR is sourced from the original manufacturer or authorized distributors?
All TLV9002SIDGSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV9002SIDGSR meets industry standards.
7.What is the process for return or replacement of TLV9002SIDGSR?
All TLV9002SIDGSR units undergo pre-shipment inspection (PSI). If there is an issue with TLV9002SIDGSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV9002SIDGSR part is unused and in its original packaging.
Return procedure for TLV9002SIDGSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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