Texas Instruments TLV9002SIRUGR

Overview

TLV9002SIRUGR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, cost-sensitive systems operating from 1.8 V to 5.5 V supply. It delivers ±0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 60 µA per channel quiescent current, and 27 nV/√Hz broadband noise - enabling precision signal conditioning in space-constrained smoke detectors and wearable electronics.

For engineers reviewing the TLV9002SIRUGR datasheet, TLV9002SIRUGR pinout, TLV9002SIRUGR application, or TLV9002SIRUGR equivalent, key selection criteria include its 10-pin X2QFN (1.5 mm × 2.0 mm) package with integrated shutdown pins per channel, resistive open-loop output impedance for stable capacitive-load drive up to 500 pF, and operation across –40°C to +125°C.

Technical Context

The TLV9002SIRUGR implements a scalable CMOS architecture designed specifically for low-voltage, low-cost applications requiring rail-to-rail swing and robust EMI/RFI rejection. Its dual independent amplifiers each feature dedicated SHDN1 and SHDN2 inputs, allowing selective channel disablement with typical standby current <1 µA per channel.

Unlike standard op-amps, the TLV9002SIRUGR uses a resistive open-loop output impedance topology that simplifies stabilization with high capacitive loads - eliminating need for external isolation resistors in sensor interface and active filter designs where load capacitance exceeds 100 pF.

Key Specifications

Pinout & Package

TLV9002SIRUGR is housed in a 10-pin X2QFN package (1.50 mm × 2.00 mm, 0.4 mm pitch) with wettable flanks and an exposed thermal pad connected to V– for improved thermal dissipation in compact layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel, low-power op-amp applications.

Compared with TLV9002DRGR, TLV9002SIRUGR saves 2.5 mm² board area and adds independent channel shutdown; compared with OPA2313IDR, it trades 0.8 MHz bandwidth for 40% lower quiescent current and built-in EMI filtering - making TLV9002SIRUGR optimal for size- and power-constrained cost-sensitive systems.

Availability

TLV9002SIRUGR is available at Aetrix Electronics and suitable for smoke detectors, wearable devices, and HVAC control systems requiring stable component supply across extended product lifecycles.

Supply support for TLV9002SIRUGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 50 years of innovation in precision amplifiers and low-power signal chain solutions.

The TLV900x product line was engineered for cost-sensitive, space-constrained applications demanding rail-to-rail operation at 1.8 V - targeting markets including consumer electronics, industrial safety sensors, and portable medical devices.

FAQ

What is the maximum capacitive load the TLV9002SIRUGR can drive without instability?

The TLV9002SIRUGR is characterized to drive up to 500 pF capacitive load while maintaining phase margin >45°, thanks to its resistive open-loop output impedance design. This eliminates need for external isolation resistors in applications like piezoelectric sensor interfaces or long-trace PCB routing - verified across –40°C to +125°C and 1.8 V to 5.5 V supply range per TI SBOS833R datasheet Section 7.10.

Does the TLV9002SIRUGR support single-supply operation?

Yes, the TLV9002SIRUGR supports true single-supply operation from 1.8 V to 5.5 V, with rail-to-rail input common-mode range extending 100 mV beyond both supply rails and rail-to-rail output swing. This enables direct interfacing with 3.3 V microcontrollers and 12-bit ADCs in battery-powered smoke detectors without level-shifting circuitry - confirmed in Section 7.3 Recommended Operating Conditions.

How does the shutdown functionality work on the TLV9002SIRUGR?

The TLV9002SIRUGR features two independent shutdown pins: SHDN1 (pin 5) controls channel 1, and SHDN2 (pin 6) controls channel 2. Driving either pin low disables its respective amplifier with typical standby current <1 µA; driving high enables normal operation. Both channels must be high for full functionality - detailed in Section 8.5 and Table 6-4 of the SBOS833R datasheet.

Is the TLV9002SIRUGR pin-compatible with other TLV9002 variants?

No, the TLV9002SIRUGR is not pin-compatible with non-S variants (e.g., TLV9002DRGR) or other TLV9002S packages (e.g., VSSOP DGS). Its 10-pin X2QFN (RUG) layout is unique, with dedicated SHDN1/SHDN2 pins and different pin numbering versus 8-pin SOIC or VSSOP versions - confirmed by Figure 6-9 and Table 6-4 in the datasheet.

What thermal performance can be expected from the TLV9002SIRUGR in a 2-layer PCB layout?

In a standard 2-layer PCB with 1 oz copper and minimal thermal relief, the TLV9002SIRUGR's θ_JA is 220°C/W (per Section 7.7 Thermal Information), resulting in ~13°C junction rise at 120 µA total quiescent power. The exposed thermal pad (connected to V–) significantly improves dissipation - adding two 10-mil thermal vias beneath the pad reduces θ_JA by ~35°C/W per TI application note SLVA748.