Texas Instruments TLV9002SIYCKR

Overview

TLV9002SIYCKR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for low-power, cost-sensitive systems operating from 1.8 V to 5.5 V supply. It delivers ±0.4 mV input offset voltage, 1 MHz unity-gain bandwidth, 60 µA per channel quiescent current, and robust 500 pF capacitive-load drive-enabling precision sensor signal conditioning in wearable devices and smoke detectors.

For engineers reviewing the TLV9002SIYCKR datasheet, TLV9002SIYCKR pinout, TLV9002SIYCKR application, or TLV9002SIYCKR equivalent, key selection criteria include its resistive open-loop output impedance (simplifying stability with high capacitive loads), integrated RFI/EMI filter, extended –40°C to 125°C temperature range, and shutdown capability with <1 µA standby current.

Technical Context

The TLV9002SIYCKR implements a scalable CMOS architecture designed specifically for low-voltage, space-constrained applications. Its rail-to-rail input stage supports common-mode voltages from V– to V+, while the rail-to-rail output delivers full swing across the supply range-critical for single-supply 1.8 V systems.

It features unity-gain stability without external compensation and no phase reversal under overdrive. The resistive open-loop output impedance enables stable operation into ≥500 pF loads, unlike conventional op amps requiring isolation resistors or complex compensation networks.

Key Specifications

Pinout & Package

TLV9002SIYCKR is housed in a 9-pin DSBGA (WCSP) package measuring 1.00 mm × 1.00 mm with 0.4 mm pitch, optimized for ultra-compact wearable and portable electronics. The bottom-side ball layout includes exposed thermal pad connected internally to V–.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel, low-power op amp applications.

Compared with TLV9002IDR, TLV9002SIYCKR saves >80% board area and adds shutdown control, while OPA2313IDR trades EMI robustness for marginal speed and power gains-making TLV9002SIYCKR optimal for miniaturized, safety-critical sensing.

Availability

TLV9002SIYCKR is available at Aetrix Electronics and suitable for wearable electronics, smoke detectors, and HVAC controllers requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for TLV9002SIYCKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision amplifiers and low-power signal conditioning.

The TLV900x product line was engineered for cost-sensitive, space-constrained systems demanding rail-to-rail performance at 1.8 V-targeting consumer wearables, smart home safety devices, and industrial edge sensors.

FAQ

What is the maximum capacitive load TLV9002SIYCKR can drive without oscillation?

The TLV9002SIYCKR is characterized to drive up to 500 pF capacitive load stably in unity-gain configuration due to its resistive open-loop output impedance. This eliminates the need for external series isolation resistors typically required with conventional op amps-simplifying layout and reducing component count in sensor interface circuits.

Does TLV9002SIYCKR support true single-supply operation down to 1.8 V?

Yes, TLV9002SIYCKR operates from 1.8 V to 5.5 V supply with rail-to-rail input and output swing. At 1.8 V, it maintains ±0.4 mV input offset voltage and 1 MHz bandwidth-enabling direct interfacing with low-voltage MCUs and energy-harvesting power sources without level-shifting circuitry.

How does the shutdown function work on TLV9002SIYCKR?

The SHDN pin (B2) on TLV9002SIYCKR is active-low and internally pulled up. Driving it low disables both amplifiers, reducing total supply current to <1 µA. No external pull-up resistor is required. The device resumes normal operation within 15 µs after SHDN returns high-ideal for duty-cycled sensor wake-up schemes.

Is TLV9002SIYCKR pin-compatible with other TLV9002 variants?

No-TLV9002SIYCKR uses a 9-pin DSBGA (WCSP) package with unique bottom-side ball layout (A1, A2, A3, B1, B2, B3, C1, C2, C3). It is not pin-compatible with SOIC-8 (TLV9002IDR), VSSOP-8 (TLV9002DGKR), or WSON-8 (TLV9002DSGR) variants. PCB redesign is required for migration.

What thermal considerations apply to TLV9002SIYCKR in a 1.0 mm × 1.0 mm DSBGA package?

TLV9002SIYCKR's DSBGA package relies on soldering the exposed thermal pad (connected to V–) directly to a solid PCB ground plane for effective heat dissipation. With proper thermal land design (≥4 vias to internal ground layers), junction-to-board thermal resistance is minimized-supporting continuous operation at 125°C ambient in compact enclosures like smoke detector housings.