Texas Instruments TLV9104SIRTER

Overview

TLV9104SIRTER from Texas Instruments is a quad-channel, rail-to-rail input/output operational amplifier optimized for low-power, precision signal conditioning in space-constrained industrial and communications systems. It delivers 1.1-MHz gain-bandwidth, ±300 µV max input offset voltage, 120 µA per amplifier quiescent current, and operates from 2.7 V to 16 V supply. It serves as a high-accuracy, low-noise buffer and active filter stage in macro remote radio units (RRUs) and baseband units (BBUs).

For engineers reviewing the TLV9104SIRTER datasheet, TLV9104SIRTER pinout, TLV9104SIRTER application, or TLV9104SIRTER equivalent, this page provides verified package mapping (WQFN-16), confirmed shutdown control logic (SHDN12/SHDN34 active-high disable), exact channel count (4), and real-world performance boundaries including 4.5 V/µs slew rate, 28 nV/√Hz noise at 10 kHz, and –40°C to +125°C operation.

Technical Context

The TLV9104SIRTER integrates four independent amplifiers with matched AC/DC specifications across temperature. Its input stage supports rail-to-rail common-mode range (V– –0.2 V to V+ +0.2 V), enabling direct interfacing with ADCs and DACs operating near supply rails. The output stage drives ±80 mA and swings within 3 mV of rails under no-load conditions at 16 V.

It features dual independent shutdown controls: SHDN12 disables channels 1 and 2, SHDN34 disables channels 3 and 4 - each with 11 µs enable and 2.5 µs disable timing. The WQFN-16 package includes an exposed thermal pad connected to V–, reducing RθJA to 53.5°C/W and supporting stable operation at full ambient temperature range.

Key Specifications

Pinout & Package

The TLV9104SIRTER is housed in a 3.0 mm × 3.0 mm, 16-pin WQFN package (RTE variant) with an exposed thermal pad soldered to V– for enhanced thermal dissipation. Pin 1 is marked by a dot; pin numbering follows standard counter-clockwise convention from top-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad op-amp applications.

Compared with TLV9104SIRTER, OPA491IDR trades shutdown flexibility and rail-to-rail output for higher speed, while LMV984MAX/NOPB sacrifices supply range and output swing to reduce cost and IQ - making TLV9104SIRTER the sole option meeting 2.7–16 V, shutdown, rail-to-rail, and –40°C to +125°C requirements simultaneously.

Availability

TLV9104SIRTER is available at Aetrix Electronics and suitable for optical module manufacturing, portable test equipment production, and macro RRU/BBU deployment requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for TLV9104SIRTER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op-amps and high-reliability industrial ICs.

The TLV910x family was designed specifically for low-power, high-precision signal conditioning in harsh-environment industrial, telecom, and instrumentation systems - emphasizing rail-to-rail operation, robust EMI immunity, and extended temperature qualification.

FAQ

What is the function of the SHDN12 and SHDN34 pins on the TLV9104SIRTER?

The SHDN12 pin controls power state for amplifier channels 1 and 2, while SHDN34 independently controls channels 3 and 4. Both are active-high inputs: applying a logic high (>V– + 1.1 V) disables the respective pair, reducing quiescent current to 20–30 µA per disabled amplifier. The TLV9104SIRTER achieves fast enable (11 µs) and disable (2.5 µs) transitions, enabling dynamic power management in multi-channel systems without disrupting adjacent channels.

Does the TLV9104SIRTER support true rail-to-rail output swing?

Yes, the TLV9104SIRTER delivers rail-to-rail output swing: at 16 V supply and no load, output voltage reaches within 3 mV of either rail; with 10-kΩ load, headroom increases to 45–60 mV. This capability allows direct interfacing with ADCs and digital logic without external level-shifting, preserving signal fidelity in single-supply industrial sensor nodes and data acquisition systems using the TLV9104SIRTER.

What is the maximum capacitive load the TLV9104SIRTER can drive stably?

The TLV9104SIRTER is characterized for stable operation with up to 20 pF capacitive load in unity-gain configuration, as verified by phase margin (≥60°) and overshoot measurements. Driving larger loads (e.g., >50 pF) requires isolation resistor or gain adjustment per TI's layout guidelines. This specification directly impacts TLV9104SIRTER use in PCB traces longer than 5 cm or when buffering multiple downstream inputs in analog signal distribution networks.

How does the TLV9104SIRTER handle electromagnetic interference in RF-dense environments?

The TLV9104SIRTER features 77 dB EMIRR (Electromagnetic Interference Rejection Ratio) at 1.8 GHz, meaning it attenuates cellular/WiFi band RF signals by 77 dB before they demodulate into DC offset errors. This is achieved via internal input-stage shielding and layout optimization - critical for TLV9104SIRTER deployment in optical modules and RRUs co-located with high-power RF transmitters where unmitigated EMI would corrupt precision analog measurements.

Is the thermal pad on the TLV9104SIRTER's WQFN package required to be connected?

Yes, the exposed thermal pad on the TLV9104SIRTER's WQFN-16 package must be soldered to the V– net on the PCB. Doing so reduces junction-to-board thermal resistance to 28.6°C/W and enables full 4-channel operation at 125°C ambient. Leaving the pad floating degrades thermal performance by >2×, risking thermal shutdown or parametric shift - a mandatory design requirement explicitly stated in TI's datasheet for reliable TLV9104SIRTER implementation.