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Texas Instruments TLV9162IDSGR
- Part No.:
- TLV9162IDSGR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
TLV9162IDSGR.pdf
- Description:
- DUAL, 16-V, 10-MHZ, RAIL-TO-RAIL
- Quantity:
- Payment:
- Shipping:
Inventory:2,698
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Product details
Overview
TLV9162IDSGR from Texas Instruments is a dual-channel, rail-to-rail input/output operational amplifier optimized for precision analog signal conditioning in industrial and test equipment. It delivers ±210 µV offset voltage, 11 MHz gain-bandwidth product, 33 V/µs slew rate, 6.8 nV/√Hz input voltage noise at 1 kHz, and operates from 2.7 V to 16 V supply. It is used in high-side/low-side current sensing and multiplexed data acquisition systems.
For engineers reviewing the TLV9162IDSGR datasheet, TLV9162IDSGR pinout, TLV9162IDSGR application, or TLV9162IDSGR equivalent, key selection criteria include its dual-channel WSON-8 package, low drift (±0.25 µV/°C), robust EMIRR performance, MUX-friendly inputs enabling comparator-mode operation, and guaranteed operation from –40°C to +125°C.
Technical Context
The TLV9162IDSGR employs a precision bipolar-input architecture with rail-to-rail input stage capable of accepting differential signals up to the supply rails, supporting open-loop comparator use without external clamping. Its output stage delivers ±73 mA short-circuit current and achieves 6 mV rail headroom under no-load conditions at 16 V supply.
It features unity-gain stable compensation, 64° phase margin into 20 pF load, and maintains >110 dB common-mode rejection across 2.7–16 V supply range. The device integrates robust electromagnetic interference rejection (EMIRR > 100 dB at 100 MHz) and supports wide common-mode input range (V– to V+).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | Dual - enables compact two-stage signal conditioning or differential pair implementation in single-package layout. |
| Supply Voltage Range | 2.7 V to 16 V (±1.35 V to ±8 V) - supports single-supply sensor interfaces and dual-supply precision instrumentation. |
| Gain-Bandwidth Product | 11 MHz - allows stable closed-loop operation up to ~10 MHz at G = +1, suitable for fast-settling data acquisition front-ends. |
| Input Offset Voltage | ±0.21 mV (typ) - reduces DC error in current-sense amplifiers and bridge sensor interfaces without trimming. |
| Slew Rate | 33 V/µs - ensures faithful reproduction of ≥3-Vpp signals at ≥10 MHz without slew-induced distortion. |
| Input Voltage Noise | 6.8 nV/√Hz @ 1 kHz - preserves SNR in microphone preamps and low-level sensor amplification stages. |
| Quiescent Current | 2.4 mA per amplifier - balances performance and power efficiency in battery-backed or thermally constrained modules. |
Pinout & Package
TLV9162IDSGR is housed in an 8-pin WSON package (DSG) with 2.00 mm × 2.00 mm footprint and exposed thermal pad connected to V–. The package supports high-density PCB layouts and enhanced thermal dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: OUT1 | Output, Channel 1 | Amplified output node for first op-amp; rail-to-rail swing supports full dynamic range utilization. |
| 2: IN1– | Inverting Input, Channel 1 | Differential input terminal; accepts voltages from V– to V+, enabling true rail-to-rail common-mode operation. |
| 3: IN1+ | Noninverting Input, Channel 1 | Differential input terminal; same rail-to-rail common-mode range as IN1–; usable in comparator mode. |
| 4: V– | Negative Supply | Reference for both channels; thermal pad must be soldered to PCB ground plane for optimal thermal performance. |
| 5: IN2+ | Noninverting Input, Channel 2 | Independent input for second amplifier; electrically isolated from Channel 1 except via shared supplies. |
| 6: IN2– | Inverting Input, Channel 2 | Second differential input; supports independent gain configuration and MUX-driven signal routing. |
| 7: OUT2 | Output, Channel 2 | Second rail-to-rail output; enables dual-path signal processing or differential driver configurations. |
| 8: V+ | Positive Supply | Highest potential supply rail; decoupling capacitor required within 1 cm for stability at high frequencies. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables direct interfacing with ADCs, DACs, and sensors operating at supply extremes without level-shifting circuitry. |
| MUX-friendly/comparator inputs | Allows use in open-loop configurations (e.g., window comparators) or multiplexed sensor arrays without input clamping diodes. |
| Low offset voltage drift | ±0.25 µV/°C ensures <±1.5 µV total drift over –40°C to +125°C, critical for uncalibrated industrial temperature ranges. |
| High CMRR (110 dB) | Maintains accuracy in noisy factory automation environments where common-mode transients exceed 1 V peak. |
| Robust EMIRR performance | Rejects >100 dB of RF interference at 100 MHz, preventing corruption in wireless test equipment near RF sources. |
| Wide bandwidth & fast settling | 0.70 µs to 0.1% for 10-V step ensures accurate digitization in 1-MSPS data acquisition systems with minimal dead time. |
Applications
| Professional Microphones & Wireless Systems | Multiplexed Data-Acquisition Systems |
|---|---|
|
Use Scenario: Low-noise preamplification of condenser microphone capsules in battery-powered wireless audio transmitters. IC Role / Device Role / Timing Role: Dual-channel op-amp providing gain and buffering; one channel conditions mic signal, the other drives RF modulator bias or AGC control path. Use Value: 6.8 nV/√Hz input noise preserves acoustic fidelity; 2.4 mA per channel enables >10-hour runtime on coin-cell batteries. |
Use Scenario: Signal conditioning front-end for 16-channel industrial DAQ module scanning thermocouples and RTDs. IC Role / Device Role / Timing Role: Dual op-amp per channel: one as precision buffer for sensor output, the other as programmable-gain stage before SAR ADC. Use Value: ±210 µV offset and ±0.25 µV/°C drift eliminate need for per-channel calibration; rail-to-rail I/O maximizes ADC utilization. |
| Test and Measurement Equipment | High-Side and Low-Side Current Sensing |
|
Use Scenario: Active filtering and level-shifting in portable oscilloscope vertical input stages handling ±5 V signals. IC Role / Device Role / Timing Role: Dual op-amp configured as DC-coupled gain stage and AC-coupled high-pass filter for baseline restoration. Use Value: 11 MHz GBW supports flat response to 5 MHz; 33 V/µs slew rate prevents distortion on fast edge capture. |
Use Scenario: Bidirectional current monitoring in 48-V battery management systems using shunt resistors. IC Role / Device Role / Timing Role: Dual op-amp implementing high-side sense amplifier (IN1±) and low-side reference buffer (IN2±). Use Value: Rail-to-rail inputs accept common-mode voltages up to 48 V (with proper level translation); ±73 mA output drives heavy loads directly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar precision dual op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OPA2182IDR | Lower offset (±4 µV), lower noise (5.7 nV/√Hz), higher IQ (650 µA per amp), SOIC-8 only | Better DC precision but higher power; unsuitable for space-constrained WSON layouts | Select when ultra-low offset dominates over size and quiescent current constraints |
| AD8602ARMZ | Lower bandwidth (9.5 MHz), higher offset (±250 µV), same WSON-8 package, wider temp range (–40°C to +125°C) | Compatible footprint replacement but reduced AC performance and higher drift (±1 µV/°C) | Select when board space and thermal profile match but 11 MHz GBW is not required |
Compared with OPA2182IDR and AD8602ARMZ, TLV9162IDSGR uniquely balances 11 MHz bandwidth, 2.4 mA quiescent current, and WSON-8 footprint-making it optimal for space-limited, medium-speed precision applications where power and size are co-constrained.
Availability
TLV9162IDSGR is available at Aetrix Electronics and suitable for professional audio systems, industrial data acquisition modules, and battery-powered test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for TLV9162IDSGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op-amp design and high-volume manufacturing reliability.
The TLV916x family was engineered for industrial-grade signal conditioning-emphasizing low drift, rail-to-rail operation, and EMI resilience in harsh electromagnetic environments like factory floors and field-deployed instrumentation.
FAQ
What is the maximum supply voltage for TLV9162IDSGR?
The absolute maximum supply voltage (V+ to V–) for TLV9162IDSGR is 20 V, but the recommended operating range is 2.7 V to 16 V. Operation beyond 16 V risks exceeding safe junction temperature and degrading long-term reliability, especially at elevated ambient temperatures. Always observe derating curves in the thermal section of the datasheet.
Does TLV9162IDSGR support true rail-to-rail input common-mode range?
Yes, TLV9162IDSGR supports a common-mode input voltage range from V– to V+, verified across its full –40°C to +125°C operating temperature range. This allows direct connection to sensors or DAC outputs referenced to either supply rail without external level-shifting circuitry.
Can TLV9162IDSGR be used as a comparator?
Yes, TLV9162IDSGR is explicitly designed for MUX-friendly and comparator-mode operation. Its inputs tolerate differential voltages up to the supply rails, and its output swings rail-to-rail-enabling reliable open-loop use in window detectors or zero-crossing circuits without external clamping diodes.
What is the thermal pad connection requirement for TLV9162IDSGR?
The exposed thermal pad on TLV9162IDSGR must be soldered to the V– (ground) net on the PCB. TI's datasheet specifies this connection to ensure proper heat dissipation and electrical stability. Failure to connect the pad may result in thermal shutdown or degraded PSRR and CMRR performance.
How does TLV9162IDSGR perform in high-EMI environments?
TLV9162IDSGR features robust electromagnetic interference rejection ratio (EMIRR) exceeding 100 dB at 100 MHz, validated per industry-standard test methods. This makes it suitable for deployment in proximity to switching power supplies, motor drives, and RF transceivers without signal corruption or false triggering.
TLV9162IDSGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TLV916x
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 2
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 33V/µs
- Gain Bandwidth Product:
- 11 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 10 pA
- Voltage - Input Offset:
- 210 µV
- Current - Supply:
- 2.4mA (x2 Channels)
- Current - Output / Channel:
- 73 mA
- Voltage - Supply Span (Min):
- 2.7 V
- Voltage - Supply Span (Max):
- 16 V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (2x2)
TLV9162IDSGR FAQ
1.How can I place an order for TLV9162IDSGR through Aetrix?
Please submit a Request for Quotation (RFQ) for TLV9162IDSGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TLV9162IDSGR reliable?
The price and inventory of TLV9162IDSGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TLV9162IDSGR is usually 5 days.
3.What payment methods are accepted for TLV9162IDSGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TLV9162IDSGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TLV9162IDSGR?
TLV9162IDSGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TLV9162IDSGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TLV9162IDSGR?
For technical support, including TLV9162IDSGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TLV9162IDSGR requirements.
6.How does Aetrix verify that TLV9162IDSGR is sourced from the original manufacturer or authorized distributors?
All TLV9162IDSGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TLV9162IDSGR meets industry standards.
7.What is the process for return or replacement of TLV9162IDSGR?
All TLV9162IDSGR units undergo pre-shipment inspection (PSI). If there is an issue with TLV9162IDSGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TLV9162IDSGR part is unused and in its original packaging.
Return procedure for TLV9162IDSGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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