Texas Instruments TM124BBK32-80
- Part No.:
- TM124BBK32-80
- Manufacturer:
- Texas Instruments
- Category:
- Controllers
- Package:
- -
- Datasheet:
-
TM124BBK32-80.pdf
- Description:
- DRAM MODULE, 1MX32
- Quantity:
- Payment:

- Shipping:

Inventory:1,407
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TM124BBK32-80 from Texas Instruments is a 72-pin single in-line memory module (SIMM) implementing 1,048,576 × 32-bit dynamic RAM using eight TMS44400 4-Mbit DRAMs in plastic SOJ packages. It operates on a single 5-V ±10% supply, supports TTL-compatible I/O, and delivers 80 ns RAS access time for use in legacy PC memory subsystems requiring standardized 32-bit data width.
For engineers reviewing the TM124BBK32-80 datasheet, TM124BBK32-80 pinout, TM124BBK32-80 application, or TM124BBK32-80 equivalent, key selection criteria include its 16 ms distributed refresh period, presence detect pins (PD1–PD4), common CAS control across four blocks, and compatibility with socketed 72-pin SIMM slots in industrial computing and embedded systems of the early 1990s.
Technical Context
The TM124BBK32-80 implements a 4×(1048576 × 8)-bit organization via eight parallel TMS44400 DRAMs, each configured as 1048576 × 4-bit with shared A0–A9 addressing and independent RAS0–RAS3/CAS0–CAS3 strobes. Its common I/O architecture requires early write cycles to avoid D/Q bus contention.
It uses distributed refresh over 16 ms (1024 rows), with CAS held high during refresh to reduce power. All inputs and outputs are fully TTL-compatible, and the module features 3-state output drivers with VCC = 4.5–5.5 V and operating temperature range of 0°C to 70°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 1,048,576 × 32-bit (4 MiB total) |
| RAS Access Time (tRAC) | 80 ns - defines maximum latency from RAS assertion to valid data |
| Refresh Period | 16 ms - mandates full row refresh every 16 ms to retain data integrity |
| Supply Voltage | 4.5 V to 5.5 V - supports standard 5-V TTL logic rails with ±10% tolerance |
| Operating Temperature | 0°C to 70°C - qualified for commercial/industrial ambient environments |
| Package Type | 72-pin leadless SIMM - designed for socketed mounting with gold-plated contacts |
| Input Compatibility | TTL-compatible - accepts standard 0.8 V / 2.4 V logic thresholds without level translation |
Pinout & Package
TM124BBK32-80 is housed in a 72-pin single in-line memory module (SIMM) with gold-plated nickel-underplate contacts on a 1.27 mm thick PCB substrate. The module is single-sided (BK type) and uses plastic SOJ-packaged TMS44400 DRAMs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A9 | Address Inputs | 10-bit row/column address bus shared across all DRAMs; enables 1024-row addressing |
| CAS0–CAS3 | Column-Address Strobe | Four independent CAS lines controlling column access in four 8-bit data blocks |
| RAS0–RAS3 | Row-Address Strobe | Four independent RAS lines enabling segmented row activation across DRAM banks |
| DQ0–DQ31 | Data In/Data Out | 32-bit bidirectional data bus with 3-state output drivers for bus sharing |
| W | Write Enable | Active-low signal controlling write cycle initiation and timing relative to CAS/RAS |
| PD1–PD4 | Presence Detect | Four dedicated pins (pins 67–70) used by host system to auto-detect module insertion and capacity |
| VCC | Power Supply | +5 V supply input (pins 31, 43, 55); decoupled internally with multilayer ceramic capacitors |
| VSS | Ground | System ground reference (pins 1, 36, 48, 72); multiple connections ensure low-impedance return path |
Key Features
| Feature | Design Value |
|---|---|
| Common I/O Architecture | Shared DQ0–DQ31 lines reduce pin count and simplify board routing but require early-write protocol to prevent bus contention |
| Distributed Refresh | 16 ms refresh window with 1024 RAS strobes allows interleaved refresh without halting CPU access |
| Presence Detect Pins | PD1–PD4 provide hardware-level module identification and capacity verification at boot time |
| TTL-Compatible Signaling | Eliminates need for external level shifters when interfacing with 5-V microprocessor buses |
| Low Standby Current | 16 mA (TTL mode) or 8 mA (CMOS mode) in standby reduces system power during idle periods |
Applications
| Industrial Control Panel Memory | Legacy PC Expansion Slot |
|---|---|
Use Scenario: Memory expansion for programmable logic controllers (PLCs) and human-machine interface (HMI) terminals built on ISA-bus architectures. IC Role / Device Role / Timing Role: Provides 4 MiB of volatile working memory for real-time task buffers and configuration storage. Use Value: Enables deterministic 80 ns RAS access and 16 ms refresh compliance within 0°C–70°C operating range required for factory-floor deployment. |
Use Scenario: Upgrading memory in 486-based workstations and servers using 72-pin SIMM sockets. IC Role / Device Role / Timing Role: Acts as drop-in 32-bit-wide main memory module compatible with standard BIOS memory detection. Use Value: Presence detect pins (PD1–PD4) allow automatic capacity recognition, while TTL compatibility ensures plug-and-play integration without glue logic. |
| Medical Imaging Data Buffer | Telecom Baseband Processing |
Use Scenario: Frame buffer for analog-to-digital conversion pipelines in ultrasound and X-ray digitizers. IC Role / Device Role / Timing Role: Stores transient image frames prior to compression or transmission; relies on page-mode timing (tPC = 50 ns). Use Value: 50 ns page-mode cycle time supports burst transfers of pixel data, reducing bus arbitration overhead during high-throughput acquisition. |
Use Scenario: Temporary storage for channelized voice packet buffering in T1/E1 line cards. IC Role / Device Role / Timing Role: Serves as shared memory between DSP and host controller for packet assembly/disassembly. Use Value: Common CAS control across four 8-bit blocks simplifies memory mapping for multi-channel time-division multiplexing (TDM) data streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DRAM module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM124BBK32-70 | 70 ns tRAC, 130 ns cycle time - faster access but higher power consumption (ICC1 = 720 mA vs. 640 mA) | Preferred where tighter timing margins are required in high-clock-rate 486 systems | Select TM124BBK32-70 only if system timing budget permits lower latency and thermal design accommodates increased current draw. |
| TM124BBK32-60 | 60 ns tRAC, 110 ns cycle time - highest speed grade with ICC1 = 840 mA and stricter setup/hold requirements | Suitable for overclocked or performance-critical embedded controllers demanding minimal memory wait states | Choose TM124BBK32-60 only when validated timing margins support 60 ns access and board layout meets tighter signal integrity constraints. |
Compared with TM124BBK32-70 and TM124BBK32-60, the TM124BBK32-80 offers the lowest power consumption (640 mA active current) and widest timing margin (80 ns tRAC), making it optimal for thermally constrained or cost-sensitive legacy systems where absolute peak bandwidth is not required.
Availability
TM124BBK32-80 is available at Aetrix Electronics and suitable for industrial control panel memory, legacy PC expansion slot upgrades, medical imaging data buffering, and telecom baseband processing requiring stable component supply across long-lifecycle programs.
Supply support for TM124BBK32-80 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company founded in 1930, specializing in analog, embedded processing, and memory solutions for industrial, automotive, and communications markets.
The TM124BBK32-80 belongs to TI's legacy DRAM module product line designed specifically for socketed 72-pin SIMM systems in the early 1990s, targeting cost-effective, reliable memory expansion in commercial and industrial computing platforms.
FAQ
What is the memory organization of the TM124BBK32-80?
The TM124BBK32-80 is organized as four times 1,048,576 × 8-bit banks, totaling 1,048,576 × 32-bit (4 MiB). It achieves this using eight TMS44400 4-Mbit DRAMs, each configured as 1048576 × 4-bit, mounted on a single-sided substrate with integrated decoupling capacitors. This structure enables efficient 32-bit data transfers aligned with ISA and early PCI bus widths.
Does the TM124BBK32-80 support automatic presence detection?
Yes, the TM124BBK32-80 includes four dedicated presence detect pins - PD1 (pin 67), PD2 (pin 68), PD3 (pin 69), and PD4 (pin 70) - which provide hardwired identification signals to the host system. These pins enable BIOS or firmware to automatically detect module insertion, verify capacity, and configure memory mapping without manual jumper settings or software calibration.
What is the significance of the "-80" suffix in TM124BBK32-80?
The "-80" suffix in TM124BBK32-80 denotes the device's RAS access time rating: 80 ns maximum tRAC. This distinguishes it from the -60 (60 ns) and -70 (70 ns) speed grades within the same family. All three variants share identical pinout, package, and functional architecture - only timing parameters and corresponding current consumption differ, allowing direct substitution where system timing margins permit.
Can the TM124BBK32-80 operate with a 3.3-V supply?
No, the TM124BBK32-80 is specified exclusively for single 5-V ±10% operation (4.5 V to 5.5 V). Its input thresholds, output drive strength, and internal DRAM core voltage are designed for TTL-compatible 5-V logic levels. Applying 3.3 V will result in non-compliant VIH/VIL margins, unreliable read/write cycles, and potential data corruption - no 3.3-V operation mode or dual-voltage support is documented.
How does the TM124BBK32-80 handle memory refresh?
The TM124BBK32-80 implements distributed refresh over a 16 ms interval, requiring exactly 1024 RAS strobes - one per row - within that window. Address lines A0–A9 must be cycled through all 1024 combinations during refresh, while CAS may remain high to minimize power. This scheme avoids full memory stall and is managed externally by the memory controller, consistent with TMS44400 DRAM specifications.
TM124BBK32-80 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Controller Type:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
TM124BBK32-80 FAQ
1.How can I place an order for TM124BBK32-80 through Aetrix?
Please submit a Request for Quotation (RFQ) for TM124BBK32-80 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TM124BBK32-80 reliable?
The price and inventory of TM124BBK32-80 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TM124BBK32-80 is usually 5 days.
3.What payment methods are accepted for TM124BBK32-80?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TM124BBK32-80 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TM124BBK32-80?
TM124BBK32-80 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TM124BBK32-80 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TM124BBK32-80?
For technical support, including TM124BBK32-80 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TM124BBK32-80 requirements.
6.How does Aetrix verify that TM124BBK32-80 is sourced from the original manufacturer or authorized distributors?
All TM124BBK32-80 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TM124BBK32-80 meets industry standards.
7.What is the process for return or replacement of TM124BBK32-80?
All TM124BBK32-80 units undergo pre-shipment inspection (PSI). If there is an issue with TM124BBK32-80, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TM124BBK32-80 part is unused and in its original packaging.
Return procedure for TM124BBK32-80:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TM124BBK32-80 Tags

-
BQ2201SN-N
Texas Instruments

-
DS1314S+
Analog Devices Inc./Maxim Integrated
-
BQ2205LYPW
Texas Instruments
-
MXD1210CSA+
Analog Devices Inc./Maxim Integrated

-
MXD1210CPA+
Analog Devices Inc./Maxim Integrated

-
4RCD0232KC1ATG
Renesas Electronics Corporation
-
DS1312S-2+
Analog Devices Inc./Maxim Integrated
-
DS1314S-2+T&R
Analog Devices Inc./Maxim Integrated

-
DS1321S+
Analog Devices Inc./Maxim Integrated

-
DS1312S+
Analog Devices Inc./Maxim Integrated
-
MXD1210ESA+
Analog Devices Inc./Maxim Integrated

-
DS1321E+
Analog Devices Inc./Maxim Integrated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
