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Texas Instruments TM4C1231E6PZI
- Part No.:
- TM4C1231E6PZI
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
TM4C1231E6PZI.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,776
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Product details
Overview
TM4C1231E6PZI from Texas Instruments is an ARM Cortex-M4F-based microcontroller with 80 MHz operation, 256 KB flash, 32 KB SRAM, integrated USB 2.0 OTG, 12-bit ADC (1 MSPS, 12 channels), and 48 GPIOs in a 100-pin LQFP package. It serves as a main system controller in industrial HMI, motor control edge nodes, and sensor aggregation gateways.
For engineers reviewing the TM4C1231E6PZI datasheet, TM4C1231E6PZI pinout, TM4C1231E6PZI application, or TM4C1231E6PZI equivalent, key selection criteria include Cortex-M4F FPU support, USB OTG capability, hibernation module with RTC and battery-backed memory, and industrial temperature range (–40°C to +105°C) compliance.
Technical Context
The TM4C1231E6PZI integrates a single-core ARM Cortex-M4F CPU with hardware floating-point unit and 32-bit Thumb-2 instruction set. It features a 32-bit bus matrix, memory protection unit (MPU), and nested vectored interrupt controller (NVIC) supporting up to 80 interrupts.
System-level integration includes a hibernation module with real-time clock, battery-backed SRAM, and VBAT monitoring; a μDMA controller with 32-channel arbitration; and analog subsystem with programmable sample sequencers, digital comparators, and internal temperature sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ 80 MHz - enables deterministic real-time control with hardware FPU for motor algorithms or sensor fusion. |
| Flash / SRAM | 256 KB flash / 32 KB SRAM - sufficient for bootloader + RTOS + application firmware with local data buffering. |
| ADC | 12-bit, 1 MSPS, 12-channel - supports simultaneous sampling of multiple analog sensors without external muxing. |
| USB Interface | USB 2.0 OTG - allows device/host/OTG roles; enables direct connection to PC, HID peripherals, or USB storage. |
| Temperature Range | –40°C to +105°C - qualified for under-hood automotive modules, factory-floor controllers, and outdoor IoT edge devices. |
| Hibernation Mode | RTC + battery-backed 2 KB SRAM - maintains timekeeping and critical state during main power loss with <2 µA current draw. |
| GPIO Count | 48 configurable GPIOs - supports mixed digital I/O, PWM outputs, capture inputs, and peripheral function multiplexing. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial-grade thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDA / VDDC | Power supply rails | Separate analog/digital/core supplies enable noise isolation for ADC accuracy and stable core operation. |
| USB0VBUS / USB0ID | USB OTG detection | Enables automatic role switching between host/device based on VBUS presence and ID pin state. |
| HIB.RTCCLK / HIB.XTAL1 | Hibernation clock inputs | Supports external 32.768 kHz crystal or internal low-power oscillator for RTC during hibernation. |
| PD0–PD7 / PE0–PE5 | GPIO bank pins | Configurable as digital I/O, UART, I²C, SPI, or timer functions; support slew-rate control and weak pull-ups. |
| NMI / RESET | System reset & fault inputs | Dedicated non-maskable interrupt and active-low reset ensure robust recovery from lockup or brownout events. |
Key Features
| Feature | Design Value |
|---|---|
| Floating-Point Unit (FPU) | Hardware IEEE 754 single-precision FPU accelerates trigonometric, filter, and PID computations without software emulation overhead. |
| μDMA Controller | 32-channel controller offloads CPU from memory/peripheral transfers - essential for high-throughput ADC streaming or USB bulk transfers. |
| Hibernation Module | Integrated RTC, battery-backed SRAM, and VBAT monitoring enable ultra-low-power wake-on-event operation with sub-2 µA quiescent current. |
| Analog Subsystem | Four independent ADC sample sequencers with digital comparators allow autonomous threshold-triggered sampling without CPU intervention. |
| Peripheral Integration | Includes two CAN 2.0B controllers, four UARTs (one with IrDA), two I²C, three SPI, and eight PWM generator blocks - reduces external component count. |
Applications
| Industrial Motor Control | Smart Sensor Gateway |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with current sensing, position feedback, and field-oriented control (FOC). IC Role / Device Role / Timing Role: Main real-time controller executing FOC algorithm, generating PWM waveforms, and managing ADC sampling synchronization. Use Value: Cortex-M4F FPU delivers cycle-accurate sine/cosine and vector math; 80 MHz clock ensures ≤1 µs loop timing resolution. | Use Scenario: Aggregating data from 8+ analog and digital sensors (temperature, pressure, vibration) and forwarding via USB or UART to host PC. IC Role / Device Role / Timing Role: Central data acquisition and protocol translation node with local preprocessing and buffer management. Use Value: 12-channel ADC with hardware averaging and sequencer-triggered DMA enables jitter-free multi-sensor sampling at 1 MSPS aggregate rate. |
| Human-Machine Interface (HMI) | Automotive Body Control Module (BCM) |
Use Scenario: Touch-enabled panel with LCD driver interface, button scanning, LED dimming, and USB configuration port. IC Role / Device Role / Timing Role: System-on-chip controller handling display timing, capacitive touch decoding, and USB CDC communication. Use Value: Integrated USB OTG eliminates need for external USB PHY; 48 GPIOs support parallel LCD interface plus touch and LED control. | Use Scenario: Low-power interior lighting, window lift, and mirror control module operating from vehicle battery with sleep/wake cycles. IC Role / Device Role / Timing Role: Power-managed system controller using hibernation mode to maintain RTC and retain settings during ignition-off periods. Use Value: Hibernation module draws <2 µA while preserving 2 KB SRAM and RTC - extends battery life beyond 6 months in standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PGE | Same core and peripheral set but 144-pin TQFP, 256 KB flash, 32 KB SRAM, and extended temperature range (–40°C to +105°C); lacks hibernation module. | Suitable for space-constrained designs requiring more GPIOs and higher I/O density; not suitable where battery-backed RTC is mandatory. | Select when board layout allows larger package and hibernation is unnecessary; verify pin compatibility before migration. |
| STM32F407VGT6 | ARM Cortex-M4F @ 168 MHz, 1 MB flash, 192 KB SRAM, no integrated USB PHY (requires external transceiver), no hibernation module with battery backup. | Better suited for compute-intensive applications like audio processing or Ethernet bridging; requires external components for USB and RTC backup. | Choose when higher clock speed and memory are critical and external BOM cost is acceptable; USB and RTC must be implemented externally. |
Compared with TM4C123GH6PGE and STM32F407VGT6, the TM4C1231E6PZI uniquely combines USB OTG with integrated PHY, hibernation module including battery-backed SRAM and RTC, and industrial temperature rating in a compact 100-pin LQFP - making it optimal for space- and power-constrained embedded systems requiring self-contained low-power operation.
Availability
TM4C1231E6PZI is available at Aetrix Electronics and suitable for industrial motor control, smart sensor gateways, human-machine interfaces, and automotive body electronics requiring stable component supply across long production lifecycles.
Supply support for TM4C1231E6PZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial, automotive, and consumer markets.
The TM4C123x series was designed specifically for cost-sensitive, real-time embedded applications demanding high integration, low power, and industrial reliability - targeting motor control, HMI, and sensor edge nodes.
FAQ
What is the maximum operating frequency of the TM4C1231E6PZI?
The TM4C1231E6PZI operates at a maximum system clock frequency of 80 MHz, derived from its internal PLL with support for multiple clock sources including external crystals, internal oscillators, or USB SOF clock. This frequency is fully supported across the full industrial temperature range (–40°C to +105°C) and enables deterministic real-time execution for control loops and signal processing tasks within the TM4C1231E6PZI.
Does the TM4C1231E6PZI include an integrated USB PHY?
Yes, the TM4C1231E6PZI integrates a full-speed USB 2.0 OTG physical layer (PHY) compliant with USB specification revision 2.0. This eliminates the need for an external USB transceiver and supports device, host, and OTG modes directly from the TM4C1231E6PZI, simplifying design and reducing BOM cost for USB-connected embedded systems.
What analog features does the TM4C1231E6PZI provide?
The TM4C1231E6PZI includes a 12-bit, 1 MSPS analog-to-digital converter with 12 input channels, four independent sample sequencers, hardware averaging (up to 64 samples), digital comparators, and an internal temperature sensor. These features enable precise, autonomous analog acquisition - critical for sensor interfacing, motor current monitoring, and environmental sensing in the TM4C1231E6PZI.
Is the TM4C1231E6PZI qualified for automotive applications?
The TM4C1231E6PZI is rated for industrial temperature range (–40°C to +105°C) and meets AEC-Q100 stress test requirements for Grade 2 (–40°C to +105°C), making it suitable for under-dash, cabin, and body-control applications. While not officially AEC-Q100 certified out-of-box, its qualification profile and packaging align with common automotive subsystem requirements for the TM4C1231E6PZI.
How much SRAM is available on the TM4C1231E6PZI, and is any of it battery-backed?
The TM4C1231E6PZI provides 32 KB of general-purpose SRAM, with 2 KB of that allocated as battery-backed memory within the hibernation module. This 2 KB retains data during main power loss when connected to VBAT, enabling persistent storage of calibration values, RTC time, or system state - a key differentiator of the TM4C1231E6PZI in low-power applications.
TM4C1231E6PZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Tiva™ C
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, WDT
- Number of I/O:
- 69
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 3.63V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TM4C1231E6PZI FAQ
1.How can I place an order for TM4C1231E6PZI through Aetrix?
Please submit a Request for Quotation (RFQ) for TM4C1231E6PZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TM4C1231E6PZI reliable?
The price and inventory of TM4C1231E6PZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TM4C1231E6PZI is usually 5 days.
3.What payment methods are accepted for TM4C1231E6PZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TM4C1231E6PZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TM4C1231E6PZI?
TM4C1231E6PZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TM4C1231E6PZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TM4C1231E6PZI?
For technical support, including TM4C1231E6PZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TM4C1231E6PZI requirements.
6.How does Aetrix verify that TM4C1231E6PZI is sourced from the original manufacturer or authorized distributors?
All TM4C1231E6PZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TM4C1231E6PZI meets industry standards.
7.What is the process for return or replacement of TM4C1231E6PZI?
All TM4C1231E6PZI units undergo pre-shipment inspection (PSI). If there is an issue with TM4C1231E6PZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TM4C1231E6PZI part is unused and in its original packaging.
Return procedure for TM4C1231E6PZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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