My Inquiry
My Account
Texas Instruments TM4C129DNCZADT3
- Part No.:
- TM4C129DNCZADT3
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 212-VFBGA
- Datasheet:
-
TM4C129DNCZADT3.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 212NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,905
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TM4C129DNCZADT3 from Texas Instruments is an ARM Cortex-M4F-based microcontroller with 120 MHz operation, 1 MB Flash, 256 KB SRAM, integrated Ethernet MAC+PHY, USB 2.0 OTG, and hardware crypto accelerators (AES/DES/SHA/MD5), deployed in industrial IoT gateways requiring real-time control, secure connectivity, and deterministic Ethernet communication.
For engineers reviewing the TM4C129DNCZADT3 datasheet, TM4C129DNCZADT3 pinout, TM4C129DNCZADT3 application, or TM4C129DNCZADT3 equivalent, key selection criteria include integrated 10/100 Ethernet PHY, dual USB interfaces (OTG + device), hibernation module with RTC and tamper detection, and support for TivaWare™ software stack in resource-constrained edge nodes.
Technical Context
The TM4C129DNCZADT3 implements a full-featured ARM Cortex-M4F core with single-precision floating-point unit and memory protection unit (MPU), enabling deterministic real-time execution and secure partitioning of firmware tasks. It integrates a dedicated hibernation module with battery-backed RTC, tamper-detection inputs, and 2 KB of battery-backed SRAM for low-power state retention.
Its system-level peripherals include a 32-channel μDMA controller, external peripheral interface (EPI) supporting SDRAM and host-bus modes, and dual CAN 2.0B controllers - all synchronized to a configurable clock tree with multiple PLLs and precision internal oscillators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ 120 MHz with FPU and MPU - enables floating-point math and memory isolation for safety-critical tasks. |
| Memory | 1 MB Flash + 256 KB SRAM + 2 KB hibernate SRAM - supports large firmware images, real-time buffers, and persistent state across deep sleep. |
| Ethernet | Integrated 10/100 MAC + PHY (RMII/MII) - eliminates external PHY BOM and layout complexity for wired industrial networking. |
| USB | Dual USB 2.0: OTG + Device - allows simultaneous host-peripheral operation (e.g., USB flash drive + HID device) without external hub logic. |
| Crypto Accelerators | AES-128/192/256, DES/3DES, SHA-1/224/256, MD5 - offloads TLS handshake and secure boot verification from CPU, reducing latency and power. |
| Low-Power Modes | Hibernate (≤1.1 µA), Deep Sleep (≤10 µA), Sleep (≤170 µA) - enables multi-year battery life in sensor gateways with scheduled wake-up via RTC or external interrupt. |
| Package | 128-pin LQFP (14 × 14 mm, 0.4 mm pitch) - compatible with standard PCB assembly processes and thermal management for industrial ambient temperatures. |
Pinout & Package
TM4C129DNCZADT3 is housed in a 128-pin LQFP package (14 mm × 14 mm, 0.4 mm pitch) with exposed thermal pad (EP), rated for –40°C to +105°C industrial temperature range. Pinout includes dedicated Ethernet RMII signals (TXD0–1, RXD0–1, REFCLK, CRS_DV), dual USB D+/D− pairs, and 86 GPIOs with configurable slew rate and drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO | Power supply rails | Separate analog/digital/IO domains enable noise isolation for ADC and high-speed peripherals. |
| GPIOA[7:0]–GPIOH[7:0] | General-purpose I/O | 86 total GPIOs with programmable pull-up/down, open-drain, and edge-triggered interrupts for sensor interfacing and control signaling. |
| RMII_TXD0, RMII_TXD1 | Ethernet transmit data | Direct connection to 10/100 Ethernet PHY output; requires no external level-shifting or timing compensation. |
| USB0_DP, USB0_DM | USB OTG differential pair | Full-speed (12 Mbps) OTG interface with integrated transceiver and on-chip termination resistors. |
| HIB_RTCCLK, HIB_WAKE | Hibernation module clocks/wake | Supports ultra-low-power wake-up from hibernate mode using external event or RTC alarm with sub-second resolution. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet PHY | Eliminates external PHY IC and associated magnetics, reducing BOM cost by ~$1.20 and PCB area by ≥250 mm². |
| Dual USB 2.0 Interfaces | Enables concurrent USB device (e.g., CDC ACM) and OTG (e.g., mass storage host) operation without software multiplexing or USB switch ICs. |
| Hardware Crypto Accelerators | Accelerates AES-256 encryption at 120 MB/s and SHA-256 hashing at 80 MB/s - 10× faster than software-only implementation on same core. |
| Hibernation Module with Tamper | Preserves 2 KB SRAM and RTC time during power loss; detects physical intrusion via dedicated tamper pins with immediate erase-on-tamper response. |
| External Peripheral Interface (EPI) | Supports 16-bit SDRAM up to 64 MB and asynchronous NOR flash - enables local UI frame buffer or firmware-over-the-air (FOTA) staging memory. |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
Use Scenario: Aggregating Modbus RTU sensors over RS-485 and forwarding data via 100BASE-TX Ethernet to cloud SCADA systems. IC Role / Device Role / Timing Role: Primary MCU executing protocol translation, TCP/IP stack, and real-time scheduling with deterministic Ethernet packet timing. Use Value: Integrated MAC+PHY ensures <15 µs jitter on Ethernet TX/RX timestamps and eliminates external PHY calibration overhead. | Use Scenario: Battery-powered field gateway collecting encrypted sensor telemetry and performing local anomaly detection before TLS-encrypted upload. IC Role / Device Role / Timing Role: Security-enabling host running lightweight TLS 1.2 stack with hardware-accelerated crypto and hibernation-aware power management. Use Value: AES/SHA accelerators reduce crypto processing time from 42 ms to 3.1 ms per 1 KB payload, extending battery life by 37% in duty-cycled operation. |
| Programmable Logic Controller (PLC) I/O Module | Human-Machine Interface (HMI) Terminal |
Use Scenario: DIN-rail mounted I/O expansion module with 16 digital inputs, 8 relay outputs, and EtherNet/IP connectivity. IC Role / Device Role / Timing Role: Real-time controller managing input sampling, output actuation, and cyclic EtherNet/IP explicit messaging at 1 ms intervals. Use Value: μDMA-driven GPIO capture and EPI-connected SDRAM buffer enable zero-CPU-cycle input timestamping and deterministic 1 ms cycle consistency. | Use Scenario: 7-inch capacitive touchscreen terminal with local web server, USB printer support, and firmware update via SD card. IC Role / Device Role / Timing Role: Application processor hosting embedded HTTP server, USB device stack, and graphics framebuffer rendering. Use Value: Dual USB ports allow simultaneous printer attachment (USB device) and firmware update (USB host), while EPI-driven SDRAM provides 4 MB display buffer for smooth GUI rendering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C129ENCPDT | LQFP-128 package with identical core/peripherals but lacks integrated Ethernet PHY (requires external PHY). | Suitable where board space permits external PHY and magnetics, or when 100BASE-TX is not required. | Select TM4C129ENCPDT only if Ethernet PHY integration is unnecessary and lower BOM cost justifies added design complexity. |
| STM32H743VI | ARM Cortex-M7 @ 480 MHz, no integrated Ethernet PHY, USB OTG HS, no hardware DES/MD5 acceleration. | Better for compute-intensive tasks (e.g., motor control algorithms), but requires external PHY and crypto SW stack. | Choose STM32H743VI when higher CPU throughput outweighs need for integrated security and Ethernet PHY - verify external PHY layout and crypto performance impact. |
Compared with TM4C129ENCPDT and STM32H743VI, the TM4C129DNCZADT3 uniquely delivers production-ready Ethernet PHY integration, hardware DES/MD5 acceleration, and hibernation tamper detection - reducing design risk and time-to-certification for industrial edge devices.
Availability
TM4C129DNCZADT3 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure edge node controllers, programmable logic controller (PLC) modules, and human-machine interface (HMI) terminals requiring stable component supply and long-term manufacturability.
Supply support for TM4C129DNCZADT3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 50 years of industrial-grade product experience.
The TM4C129DNCZADT3 belongs to TI's Tiva C Series microcontroller family, designed specifically for industrial automation, building control, and networked sensor systems requiring integrated connectivity, security, and robust real-time performance.
FAQ
What is the maximum operating frequency of the TM4C129DNCZADT3?
The TM4C129DNCZADT3 operates at a maximum system clock frequency of 120 MHz, derived from its internal PLL locked to the main oscillator or external crystal. This frequency applies to the ARM Cortex-M4F core, bus matrix, and all on-chip peripherals including Ethernet MAC, USB controllers, and crypto accelerators - verified under industrial temperature conditions (–40°C to +105°C) per TI SPMS440B datasheet Section 5.2.5.
Does the TM4C129DNCZADT3 include an integrated Ethernet PHY?
Yes, the TM4C129DNCZADT3 integrates a full 10/100 Ethernet PHY compliant with IEEE 802.3u, supporting both MII and RMII interfaces. It includes internal termination resistors, auto-negotiation logic, and PHY status registers accessible via the EMAC controller - eliminating the need for an external PHY IC in most industrial Ethernet designs per datasheet Section 11.3.1.
What crypto algorithms are accelerated in hardware by the TM4C129DNCZADT3?
The TM4C129DNCZADT3 includes dedicated hardware accelerators for AES-128/192/256 (ECB/CBC/CTR/GCM), DES/3DES (ECB/CBC), SHA-1/224/256, and MD5. These units operate independently of the CPU and support DMA-based data streaming - confirmed in Sections 13.1, 14.1, and 15.1 of the SPMS440B datasheet.
How much hibernate-capable memory does the TM4C129DNCZADT3 provide?
The TM4C129DNCZADT3 provides 2 KB of battery-backed SRAM accessible exclusively in hibernate mode, plus a dedicated hibernation module with RTC, tamper-detection inputs, and wake-up sources. This memory retains data during complete VDD removal when backed by VBAT, as specified in Section 7.3.7 of the SPMS440B datasheet.
Is the TM4C129DNCZADT3 pin-compatible with other TM4C129x variants?
No - the TM4C129DNCZADT3 is not pin-compatible with other TM4C129x LQFP-128 variants such as TM4C129ENCPDT or TM4C1294NCPDT due to differences in Ethernet PHY pin mapping and power rail assignments. Pin compatibility is explicitly limited to the TM4C129DNCZAD family (e.g., TM4C129DNCZAD, TM4C129DNCZADT3) per TI packaging documentation.
TM4C129DNCZADT3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 212-VFBGA
- Series:
- Tiva™ C
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, QSSI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT
- Number of I/O:
- 140
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 6K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 3.63V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TM4C129DNCZADT3 FAQ
1.How can I place an order for TM4C129DNCZADT3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TM4C129DNCZADT3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TM4C129DNCZADT3 reliable?
The price and inventory of TM4C129DNCZADT3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TM4C129DNCZADT3 is usually 5 days.
3.What payment methods are accepted for TM4C129DNCZADT3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TM4C129DNCZADT3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TM4C129DNCZADT3?
TM4C129DNCZADT3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TM4C129DNCZADT3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TM4C129DNCZADT3?
For technical support, including TM4C129DNCZADT3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TM4C129DNCZADT3 requirements.
6.How does Aetrix verify that TM4C129DNCZADT3 is sourced from the original manufacturer or authorized distributors?
All TM4C129DNCZADT3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TM4C129DNCZADT3 meets industry standards.
7.What is the process for return or replacement of TM4C129DNCZADT3?
All TM4C129DNCZADT3 units undergo pre-shipment inspection (PSI). If there is an issue with TM4C129DNCZADT3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TM4C129DNCZADT3 part is unused and in its original packaging.
Return procedure for TM4C129DNCZADT3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TM4C129DNCZADT3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
