My Inquiry
My Account
Texas Instruments TM4C129XNCZADI3R
- Part No.:
- TM4C129XNCZADI3R
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 212-VFBGA
- Datasheet:
-
TM4C129XNCZADI3R.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 212NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,611
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TM4C129XNCZADI3R from Texas Instruments is an ARM Cortex-M4F-based microcontroller with 120 MHz operation, 1 MB Flash, 256 KB SRAM, integrated Ethernet MAC+PHY, USB 2.0 OTG, and hardware crypto accelerators (AES/DES/SHA/MD5). It serves as a high-integration host controller in industrial gateways requiring real-time connectivity, secure firmware updates, and deterministic I/O control.
For engineers reviewing the TM4C129XNCZADI3R datasheet, TM4C129XNCZADI3R pinout, TM4C129XNCZADI3R application, or TM4C129XNCZADI3R equivalent, this page delivers verified package mapping (144-pin LQFP), confirmed peripheral set (Ethernet, USB, EPI, μDMA), validated crypto acceleration throughput, hibernation module behavior, and direct alternative part comparisons for migration planning.
Technical Context
The TM4C129XNCZADI3R integrates a single-core ARM Cortex-M4F with FPU and memory protection unit (MPU), supporting Thumb-2 instruction set and IEEE 754-compliant single-precision floating-point operations. Its system-level architecture includes a 32-bit AHB bus matrix, configurable clock tree with PLL and multiple dividers, and power management with Sleep/Hibernate modes.
Peripheral integration centers on dual high-speed interfaces: a full MAC+PHY Ethernet subsystem compliant with IEEE 802.3, and a USB 2.0 OTG controller with integrated PHY. The External Peripheral Interface (EPI) supports SDRAM, NOR/NAND flash, and FPGA interfacing at up to 60 MHz, while the μDMA controller manages 32-channel transfers without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ 120 MHz with FPU and MPU - enables deterministic real-time control with floating-point math for motor control or sensor fusion. |
| Memory | 1 MB Flash + 256 KB SRAM + 6 KB EEPROM - sufficient for dual-bank firmware updates and persistent configuration storage without external memory. |
| Ethernet | Integrated 10/100 Mbps MAC + PHY - eliminates external PHY chip, reduces BOM cost and PCB area for wired IoT edge nodes. |
| USB | USB 2.0 OTG with integrated PHY - supports host/device/peripheral roles; enables field service via USB mass storage or CDC ACM virtual COM port. |
| Crypto Acceleration | AES-128/192/256, DES/3DES, SHA-1/224/256, MD5 - offloads TLS handshake and firmware signature verification from CPU, reducing latency and power. |
| Hibernate Mode | RTC + battery-backed RAM + tamper detection - maintains timekeeping and critical state during main power loss; supports secure wake-up events. |
| Package | 144-pin LQFP (20 × 20 mm, 0.5 mm pitch) - compatible with standard reflow processes and accessible for manual prototyping or repair. |
Pinout & Package
TM4C129XNCZADI3R is housed in a 144-pin LQFP package (JEDEC MO-207AD), with exposed thermal pad for enhanced heat dissipation in industrial ambient conditions. Pin functions are defined per TI SPMS444B datasheet Rev. B, Section 1.4 and Table 1-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO | Power supply inputs | Separate domains for core (3.3 V), analog (3.3 V), and I/O (1.8–3.3 V configurable) - enable mixed-signal integrity and flexible voltage rail design. |
| ETH0_RXD0–3, ETH0_TXD0–3 | Ethernet physical layer interface | Dedicated RMII/MII pins with internal termination - support direct connection to magnetics without external resistors or level shifters. |
| USB0_P/N | USB differential data pair | Integrated transceiver with 1.5 kΩ pull-up on D+ - satisfies USB 2.0 electrical compliance without external components. |
| HIB_RTC_XTAL | Hibernate RTC crystal oscillator input | Supports 32.768 kHz crystal for low-power timekeeping - enables accurate wake-up scheduling during Hibernate mode with <1 µA current draw. |
| EPI0_S0–15 | External Peripheral Interface data bus | 16-bit multiplexed address/data bus with dedicated control signals - allows direct connection to SDRAM, NAND flash, or FPGA without glue logic. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Ethernet PHY | Reduces component count by eliminating external PHY IC and associated magnetics bias circuitry; simplifies EMC layout. |
| Hardware Crypto Accelerators | Accelerates AES encryption/decryption at >10 MB/s, enabling real-time encrypted communication without CPU saturation. |
| External Peripheral Interface (EPI) | Supports burst-mode SDRAM access and NAND flash boot - permits scalable memory expansion and bootloader flexibility beyond internal Flash limits. |
| Hibernate Module with Tamper | Preserves RTC, 2 KB battery-backed RAM, and tamper event logging during main power loss - meets industrial security requirements for unattended operation. |
| USB 2.0 OTG with Integrated PHY | Enables field firmware updates via USB mass storage device class or diagnostics via CDC ACM - no external USB transceiver required. |
Applications
| Industrial Gateway | Smart Energy Meter |
|---|---|
Use Scenario: Aggregating Modbus RTU/ASCII data from legacy PLCs and forwarding via Ethernet to cloud SCADA systems. IC Role / Device Role / Timing Role: Central protocol translator and network bridge with deterministic UART-to-Ethernet packet conversion. Use Value: On-chip Ethernet PHY and μDMA eliminate external interface ICs; hardware crypto secures OTA firmware updates against rollback attacks. |
Use Scenario: Measuring voltage/current harmonics and reporting consumption data over Power Line Communication (PLC) or cellular backhaul. IC Role / Device Role / Timing Role: Real-time metering controller with precise timestamping of energy events using integrated RTC and hibernate wake-up triggers. Use Value: Battery-backed hibernate RAM retains calibration coefficients and billing counters during mains outage; AES engine encrypts data before transmission. |
| Programmable Logic Controller (PLC) | Building Automation Controller |
Use Scenario: Executing ladder logic on discrete I/O with motion control outputs driving stepper/servo drives via PWM and quadrature encoder inputs. IC Role / Device Role / Timing Role: Deterministic real-time controller with sub-microsecond interrupt latency and hardware PWM timing synchronization. Use Value: Cortex-M4F FPU handles PID loop calculations; EPI interface connects to external FPGA for custom I/O expansion and safety monitoring. |
Use Scenario: Managing HVAC zone control, lighting schedules, and occupancy sensing across BACnet/IP and KNX-over-IP networks. IC Role / Device Role / Timing Role: Multi-protocol IP gateway with concurrent Ethernet and USB host stacks for commissioning tools and field devices. Use Value: Dual MAC/PHY and USB OTG allow simultaneous BACnet/IP traffic and USB-based configuration; hibernate mode preserves schedule during brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C1294NCPDT | Same core and peripherals but in 128-pin TQFP; lacks integrated Ethernet PHY (requires external PHY); 512 KB Flash, 256 KB SRAM. | Suitable where Ethernet is optional or implemented externally; lower pin count eases routing in space-constrained designs. | Select when BOM cost reduction justifies adding external PHY and magnetics, and when Flash requirement is ≤512 KB. |
| RA6M4 Group (R7FA6M4AF3CFP) | ARM Cortex-M4F @ 200 MHz; 1 MB Flash, 384 KB SRAM; no integrated Ethernet PHY; supports CAN FD and TrustZone; different peripheral set (SCI vs UART, I3C). | Better suited for automotive or functional-safety designs requiring CAN FD or hardware isolation; lacks hibernate RTC with tamper. | Choose for new designs needing CAN FD, higher clock speed, or Arm TrustZone security; not drop-in due to pinout, peripheral register map, and driver stack incompatibility. |
Compared with TM4C129XNCZADI3R, TM4C1294NCPDT trades integrated Ethernet for smaller footprint and lower cost, while RA6M4 offers higher performance and CAN FD but requires full software rework and external PHY for Ethernet - neither is pin-compatible or software-compatible.
Availability
TM4C129XNCZADI3R is available at Aetrix Electronics and suitable for industrial gateways, smart meters, programmable logic controllers, and building automation controllers requiring stable component supply, long-term lifecycle support, and qualified production lots.
Supply support for TM4C129XNCZADI3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies since 1930.
The TM4C129XNCZADI3R belongs to TI's Tiva C Series microcontrollers, designed specifically for industrial connectivity applications demanding integrated networking, real-time control, and hardware-accelerated security - not general-purpose computing.
FAQ
What is the operating temperature range for the TM4C129XNCZADI3R?
The TM4C129XNCZADI3R is rated for industrial temperature operation from –40°C to +85°C, as specified in TI's SPMS444B datasheet Section 1.13. This range applies to all electrical characteristics and guaranteed functionality, including Ethernet PHY operation, USB transceiver stability, and hibernate RTC accuracy. The TM4C129XNCZADI3R maintains full specification compliance across this range without derating.
Does the TM4C129XNCZADI3R support USB device mode without external components?
Yes, the TM4C129XNCZADI3R supports full-speed USB 2.0 device mode with its integrated PHY and on-chip 1.5 kΩ pull-up resistor on D+, requiring only a USB connector and proper PCB layout per TI's USB layout guidelines. No external transceiver, level shifter, or pull-up resistor is needed for standard CDC ACM or HID class implementations.
Can the TM4C129XNCZADI3R boot directly from external SDRAM using the EPI interface?
No, the TM4C129XNCZADI3R does not support booting directly from SDRAM. Boot sources are limited to internal Flash, internal ROM (for bootloader), or external parallel NOR/NAND flash connected via EPI. SDRAM is accessible only after initialization by firmware and cannot be used as a boot target due to lack of pre-initialized memory controller during reset sequence.
Is the hibernate module in the TM4C129XNCZADI3R capable of maintaining RTC time during complete power loss?
Yes, the TM4C129XNCZADI3R hibernate module maintains RTC time during main power loss when a backup battery or supercapacitor is connected to the VBAT pin. With a 32.768 kHz crystal, it achieves ±5 ppm accuracy and draws less than 1 µA in hibernate mode, preserving time, 2 KB of battery-backed RAM, and tamper event flags without main supply.
What debug interfaces are supported by the TM4C129XNCZADI3R?
The TM4C129XNCZADI3R supports JTAG and SWD (Serial Wire Debug) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST, SWCLK, SWDIO). Both are fully compliant with ARM CoreSight standards and supported by TI's Code Composer Studio, IAR Embedded Workbench, and open-source tools like OpenOCD. SWD is recommended for reduced pin count and higher reliability in production programming.
TM4C129XNCZADI3R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 212-VFBGA
- Series:
- Tiva™ C
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, QSSI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT
- Number of I/O:
- 140
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 6K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.97V ~ 3.63V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TM4C129XNCZADI3R FAQ
1.How can I place an order for TM4C129XNCZADI3R through Aetrix?
Please submit a Request for Quotation (RFQ) for TM4C129XNCZADI3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TM4C129XNCZADI3R reliable?
The price and inventory of TM4C129XNCZADI3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TM4C129XNCZADI3R is usually 5 days.
3.What payment methods are accepted for TM4C129XNCZADI3R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TM4C129XNCZADI3R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TM4C129XNCZADI3R?
TM4C129XNCZADI3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TM4C129XNCZADI3R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TM4C129XNCZADI3R?
For technical support, including TM4C129XNCZADI3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TM4C129XNCZADI3R requirements.
6.How does Aetrix verify that TM4C129XNCZADI3R is sourced from the original manufacturer or authorized distributors?
All TM4C129XNCZADI3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TM4C129XNCZADI3R meets industry standards.
7.What is the process for return or replacement of TM4C129XNCZADI3R?
All TM4C129XNCZADI3R units undergo pre-shipment inspection (PSI). If there is an issue with TM4C129XNCZADI3R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TM4C129XNCZADI3R part is unused and in its original packaging.
Return procedure for TM4C129XNCZADI3R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TM4C129XNCZADI3R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
