Texas Instruments TMDS171RGZR

Overview

TMDS171RGZR from Texas Instruments is a 3.4 Gbps HDMI/DVI retimer IC supporting four TMDS channels, ARC, SPDIF, DDC, and HPD interfaces. It operates with dual supplies (1.2 V VDD / 3.3 V VCC), delivers adaptive or fixed receive equalization up to 14 dB, compensates inter-pair skew by ≥5 bits, and supports 4k2k30p at 24 bpp in digital TV and projector applications.

For engineers reviewing the TMDS171RGZR datasheet, TMDS171RGZR pinout, TMDS171RGZR application, or TMDS171RGZR equivalent, this page provides verified functional identity, validated 48-pin VQFN package mapping, confirmed retimer/redriver auto-switching behavior at 0.75–1.25 Gbps crossover, real-world power consumption values (675–875 mW at 3.4 Gbps retimer mode), and two field-validated alternative parts with documented technical and application differences.

Technical Context

The TMDS171RGZR implements a CDR-based retiming architecture with automatic mode selection: redriver below 1 Gbps and retimer above 1.2 Gbps, with hysteresis-controlled crossover between 0.75–1.25 Gbps. Its PLL bandwidth is factory-set to 0.4–1 MHz, and it supports both adaptive and pin-strapped fixed EQ (7.5 dB or 14 dB) on all three data lanes and clock lane.

It integrates dual-domain I²C control (source/sink DDC + local SCL_CTL/SDA_CTL), independent HPD signaling (HPD_SRC output / HPD_SNK input), and failsafe TMDS input termination (90–115 Ω). The device features programmable de-emphasis (–2 dB / 0 dB), VSADJ-adjustable output swing (400–600 mV single-ended), and inter-pair skew compensation up to 1.8 ns.

Key Specifications

Pinout & Package

TMDS171RGZR uses a 48-pin VQFN package (RGZR suffix) with 7.00 mm × 7.00 mm body size and 0.5 mm pitch. The exposed thermal pad must be soldered to PCB ground for thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar HDMI retimer applications.

Compared with TMDS181RGZR and PS8409BQ, TMDS171RGZR uniquely balances HDMI 1.4b compliance, integrated ARC/SPDIF, dual-domain DDC, and auto-switching retimer/redriver operation - making it the most functionally complete solution for mid-tier 4K source extension without HDCP 2.x or HDMI 2.0 bandwidth demands.

Availability

TMDS171RGZR is available at Aetrix Electronics and suitable for digital TV, projector, and active cable applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for TMDS171RGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with broad industrial, automotive, and consumer design expertise.

The TMDS171 product line delivers HDMI/DVI signal integrity solutions for video interface extension, targeting cost-optimized 4K source-sink links with integrated ARC, DDC, and HPD functionality.

FAQ

What is the primary function of the TMDS171RGZR in an HDMI system?

The TMDS171RGZR functions as an intelligent HDMI/DVI retimer that automatically switches between redriver mode (<1 Gbps) and retimer mode (>1.2 Gbps) to restore signal integrity. It equalizes attenuated inputs, cleans jitter via CDR, regenerates TMDS clocks and data, and supports ARC, SPDIF, DDC, and HPD - all within a single 48-pin VQFN package. This makes TMDS171RGZR ideal for extending HDMI reach in TVs, projectors, and active cables.

Does the TMDS171RGZR support HDMI 2.0 or higher data rates?

No, the TMDS171RGZR is specified for up to 3.4 Gbps per lane, aligning with HDMI 1.4b (10.2 Gbps aggregate) but not HDMI 2.0 (18 Gbps) or HDMI 2.1 (48 Gbps). Its maximum data rate of 3.4 Gbps supports 4k2k30p at 24 bpp and WUXGA at 12-bit color depth. For HDMI 2.0 compliance, TI recommends the TMDS181RGZR, which supports up to 6 Gbps per lane and includes HDCP 2.2.

How does the TMDS171RGZR handle power management across its dual supplies?

The TMDS171RGZR uses separate 1.2 V (VDD) and 3.3 V (VCC) rails to optimize power: VDD powers core logic and CDR circuitry (286–325 mA at 3.4 Gbps), while VCC supplies I/O drivers and DDC/HPD interfaces (80–140 mA). It offers four power states - active retimer (675–875 mW), active redriver (400–600 mW), standby (50–100 mW), and power-down (10–30 mW) - controlled via the OE pin and signal-detect logic.

Can the TMDS171RGZR be configured entirely via pins, or is I²C required?

The TMDS171RGZR supports full pin-strapped configuration without I²C: EQ type (adaptive/fixed 7.5/14 dB), de-emphasis level (–2 dB / 0 dB), and transmit termination are set via EQ_SEL/A0, PRE_SEL, and TX_TERM_CTL. I²C (via SCL_CTL/SDA_CTL) is optional and used only when I2C_EN/PIN = H - enabling dynamic reconfiguration during operation. Pin-strapping remains active and prioritized when I2C_EN/PIN = L.

What are the key thermal considerations for the TMDS171RGZR in a compact PCB layout?

The TMDS171RGZR has a junction-to-board thermal resistance (RθJB) of 8.1°C/W and requires proper thermal pad soldering to a solid copper pour tied to internal ground planes. At 3.4 Gbps retimer operation, power dissipation reaches 875 mW - necessitating ≥4 thermal vias under the exposed pad and avoidance of nearby heat sources. Case temperature must remain ≤92.7°C; derating is recommended above 70°C ambient in sealed enclosures.