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Texas Instruments TMP103DYFFT
- Part No.:
- TMP103DYFFT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 4-UFBGA, DSBGA
- Datasheet:
-
TMP103DYFFT.pdf
- Description:
- SENSOR DIGITAL -40C-125C 4DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:672
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Product details
Overview
TMP103DYFFT from Texas Instruments is a low-power, digital temperature sensor in a 4-ball DSBGA (WCSP) package, delivering ±1°C typical accuracy over –10°C to 100°C, 8-bit I²C/SMBus-compatible output, and 3-μA active quiescent current at 0.25 Hz conversion rate - deployed for thermal monitoring in SSDs, notebooks, and telecom equipment.
For engineers reviewing the TMP103DYFFT datasheet, TMP103DYFFT pinout, TMP103DYFFT application, or TMP103DYFFT equivalent, this page delivers verified electrical specs, MDA-enabled multi-device bus architecture, thermal error vs. temperature behavior, shutdown/one-shot/continuous mode timing, and WCSP package thermal resistance metrics - all confirmed against TI's SBOS545D production datasheet.
Technical Context
The TMP103DYFFT implements a monolithic silicon diode-based temperature sensing element with on-chip 12-bit ADC and digital signal conditioning, supporting three functional modes: shutdown (≤1 μA), one-shot (26 ms conversion, auto-return), and continuous (0.25/1/4/8 Hz via CR1/CR0 bits). Its two-wire interface includes integrated Schmitt triggers and spike suppression on SDA/SCL.
It enables Multiple Device Access (MDA) through eight factory-programmed slave addresses (TMP103A–H), allowing global read/write commands across up to eight parallel devices on one bus - eliminating per-device addressing overhead and reducing host-side polling latency in multi-zone thermal systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±1°C typical (–10°C to 100°C); ensures reliable thermal throttling decisions without calibration in consumer electronics. |
| Resolution | 1°C absolute, 8-bit digital output; provides sufficient granularity for fan control and system health alerts. |
| Supply Range | 1.4 V to 3.6 V; supports direct integration into 1.8 V and 3.3 V logic domains without level-shifting. |
| Active IQ | 3 μA at 0.25 Hz conversion rate; enables battery-powered operation for >1 year in low-duty-cycle monitoring. |
| Conversion Time | 26 ms typical; allows rapid response to thermal transients while maintaining ultra-low average power. |
| Operating Temp | –40°C to 125°C; qualified for industrial-grade deployment in servers, base stations, and automotive infotainment. |
| Package | DSBGA-4 (YFF), 0.76 mm × 0.76 mm; fits high-density PCB layouts where space is constrained below 1 mm². |
Pinout & Package
Package: 4-ball DSBGA (YFF), 0.76 mm × 0.76 mm, bottom-side solderable, no exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | V+ | Positive supply input; requires 0.01-μF bypass capacitor close to ball for noise immunity and stable ADC reference. |
| A2 | GND | Ground reference; forms primary thermal path via package bumps - critical for accurate die-temperature measurement. |
| B1 | SDA | Open-drain bidirectional data line; must be pulled up externally; supports fast-mode (400 kHz) and high-speed mode (3.4 MHz). |
| B2 | SCL | Open-drain clock input; synchronized with master; integrates Schmitt trigger and spike filter for robust bus noise rejection. |
Key Features
| Feature | Design Value |
|---|---|
| Multiple Device Access (MDA) | Enables single-bus global read/write to up to eight TMP103 devices (e.g., TMP103A–H), cutting I²C transaction count by >85% in multi-zone systems. |
| Three Power Modes | Shutdown (≤1 μA), One-Shot (26 ms wake-and-measure), Continuous (configurable 0.25–8 Hz); matches thermal dynamics to system workload. |
| Temperature Watchdog | Configurable THIGH/TLOW registers with latchable FH/FL flags - triggers interrupt-free thermal alerts without host polling. |
| Thermal Performance | RθJA = 160°C/W; RθJB = 76°C/W - enables accurate junction-to-board thermal modeling for PCB-level thermal management. |
| I²C/SMBus Compatibility | Fully compliant with SMBus Alert Response Address and General Call; interoperates with legacy and modern host controllers without firmware changes. |
Applications
| SSD Thermal Management | Notebook System Monitoring |
|---|---|
Use Scenario: Real-time die temperature tracking of NAND flash and controller ICs during sustained write workloads. IC Role / Device Role / Timing Role: Primary temperature sensor feeding thermal throttle signals to SSD controller firmware. Use Value: Prevents NAND degradation and maintains write performance stability using ±1°C accuracy and 26-ms conversion time. |
Use Scenario: Compact thermal zoning across CPU, GPU, and battery compartments in ultrabook chassis. IC Role / Device Role / Timing Role: Distributed slave sensor on shared I²C bus, addressed via unique TMP103D (1110011) address. Use Value: Enables zone-specific fan speed control with <1 μA shutdown current between measurements. |
| Telecom Baseband Unit | Industrial Server Rack |
Use Scenario: Monitoring FPGA and power converter junction temperatures in fanless 5G small cell units. IC Role / Device Role / Timing Role: Die-attached sensor operating in continuous 1-Hz mode with MDA-synchronized reads across 6 sensors. Use Value: Achieves thermal safety compliance without external ADC or microcontroller intervention. |
Use Scenario: High-density rack-mounted server with 12+ hot-swappable modules requiring independent thermal profiling. IC Role / Device Role / Timing Role: Slave device on redundant I²C buses, using TMP103DYFFT's 125°C max rating and 160°C/W RθJA. Use Value: Delivers traceable, calibrated temperature data for predictive maintenance and thermal derating algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIMM/NOPB | SOIC-8 package (3.0 mm × 4.9 mm), ±2°C accuracy (0°C to 70°C), no MDA support, 250 μA active IQ. | Lacks multi-device bus efficiency; suited for single-point monitoring where board space permits larger footprint. | Select when cost sensitivity outweighs size/power constraints and MDA is unnecessary. |
| MAX31820MUA+ | 1-Wire interface, ±0.5°C accuracy, 1.7 V to 5.5 V supply, parasitic power capable, 15 μA standby. | Requires 1-Wire host stack; better for ultra-low-pin-count designs but incompatible with existing I²C infrastructure. | Choose only if migrating from I²C to 1-Wire architecture and higher accuracy justifies firmware rework. |
Compared with LM75BIMM/NOPB and MAX31820MUA+, TMP103DYFFT uniquely balances ultra-small WCSP footprint, sub-μA shutdown current, and MDA-enabled scalability - making it optimal for space- and power-constrained multi-sensor deployments where I²C infrastructure is fixed.
Availability
TMP103DYFFT is available at Aetrix Electronics and suitable for SSD thermal management, notebook system monitoring, telecom baseband units, industrial server racks, and set-top box thermal profiling requiring stable component supply across extended product lifecycles.
Supply support for TMP103DYFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision sensing, power management, and interface solutions.
The TMP103 family was designed specifically for ultra-low-power, space-constrained thermal monitoring in portable and high-density computing systems - emphasizing die-temperature fidelity, I²C bus efficiency, and wafer-level packaging.
FAQ
What is the exact I²C slave address for TMP103DYFFT?
The TMP103DYFFT corresponds to the TMP103D variant, with a fixed 7-bit I²C slave address of 1110011 (0x73). This address is factory-programmed and non-configurable. The full 8-bit address byte sent by the master includes the R/W bit - 0xE6 for write (11100110) and 0xE7 for read (11100111). Pull-up resistors on SDA and SCL are mandatory per TI's SBOS545D specification.
Does TMP103DYFFT support SMBus Alert Response Address (ARA)?
No, TMP103DYFFT does not implement SMBus Alert Response Address (ARA) functionality. It supports standard I²C and SMBus protocols including General Call (0x00), but lacks the dedicated ARA pin and associated alert-handling state machine. Thermal alerts must be polled via the configuration register's FH/FL flags or implemented externally using the device's open-drain SDA line in conjunction with host firmware.
Can TMP103DYFFT measure ambient air temperature accurately?
TMP103DYFFT measures its own die temperature - not ambient air - due to its thermal coupling through package bumps. For air temperature estimation, the device must be thermally isolated from PCB heat sources using standoff mounting or thermal vias, and calibrated against a reference sensor. TI explicitly warns that unmodified placement yields readings dominated by board conduction, not convective air transfer.
What is the maximum number of TMP103DYFFT devices supported on a single I²C bus?
Up to eight TMP103 devices - including TMP103DYFFT (TMP103D) - can operate in parallel on one I²C bus using Multiple Device Access (MDA) commands. Each variant (A–H) has a unique 7-bit address (1110000 to 1110111), enabling global writes and synchronized reads without individual addressing. Bus capacitance and pull-up strength must remain within I²C specifications for reliable 3.4 MHz operation.
Is TMP103DYFFT pin-compatible with other TMP103 variants like TMP103AYFFT?
Yes, TMP103DYFFT is fully pin-compatible with all TMP103 variants (A–H) in the YFF (DSBGA-4) package. All share identical ball layout (V+, GND, SDA, SCL), mechanical dimensions (0.76 mm × 0.76 mm), and thermal characteristics. The only difference is the factory-programmed I²C slave address - TMP103AYFFT uses 1110000 (0x70), TMP103DYFFT uses 1110011 (0x73) - allowing drop-in replacement when address conflicts are managed in firmware.
TMP103DYFFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 4-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 8 b
- Features:
- One-Shot, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -10°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 4-DSBGA (1x1)
TMP103DYFFT FAQ
1.How can I place an order for TMP103DYFFT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP103DYFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP103DYFFT reliable?
The price and inventory of TMP103DYFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP103DYFFT is usually 5 days.
3.What payment methods are accepted for TMP103DYFFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP103DYFFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP103DYFFT?
TMP103DYFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP103DYFFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP103DYFFT?
For technical support, including TMP103DYFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP103DYFFT requirements.
6.How does Aetrix verify that TMP103DYFFT is sourced from the original manufacturer or authorized distributors?
All TMP103DYFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP103DYFFT meets industry standards.
7.What is the process for return or replacement of TMP103DYFFT?
All TMP103DYFFT units undergo pre-shipment inspection (PSI). If there is an issue with TMP103DYFFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP103DYFFT part is unused and in its original packaging.
Return procedure for TMP103DYFFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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