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Texas Instruments TMP103EYFFR

Part No.:
TMP103EYFFR
Manufacturer:
Texas Instruments
Category:
Analog and Digital Output
Package:
4-UFBGA, DSBGA
Datasheet:
AetrixTMP103EYFFR.pdf
Description:
SENSOR DIGITAL -40C-125C 4DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,724

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Product details

Overview

TMP103EYFFR from Texas Instruments is a low-power, digital temperature sensor in a 4-ball DSBGA (WCSP) package, featuring I²C/SMBus-compatible two-wire interface, ±1°C typical accuracy over –10°C to 100°C, 1°C resolution, and 3-μA active quiescent current at 0.25 Hz conversion rate - used for thermal monitoring in space-constrained SSDs and mobile handsets.

For engineers reviewing the TMP103EYFFR datasheet, TMP103EYFFR pinout, TMP103EYFFR application, or TMP103EYFFR equivalent, this page delivers verified technical context, real-world timing behavior, MDA-enabled multi-device bus operation, and design-meaningful specifications for thermal management in battery-powered and high-density embedded systems.

Technical Context

The TMP103EYFFR implements a monolithic diode-based temperature sensing element with on-chip 10-bit ADC and digital logic, supporting three functional modes: shutdown (≤1 μA), one-shot (26 ms conversion, auto-return), and continuous conversion (0.25/1/4/8 Hz via CR1/CR0 bits). Its serial interface includes integrated Schmitt triggers and spike suppression on SDA/SCL.

It supports Multiple Device Access (MDA) commands enabling global read/write to up to eight devices on one bus - each assigned a unique 7-bit slave address (TMP103E = 1110100), eliminating per-device addressing overhead and reducing host communication latency in multi-zone thermal systems.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Range1.4 V to 3.6 V - enables direct integration into 1.8-V and 3.3-V SoC power domains without level-shifting.
Accuracy±1°C typical (–10°C to 100°C) - sufficient for system-level thermal throttling and fan control without calibration.
Resolution1°C - fixed output granularity matching thermal response time of most PCB-mounted components.
Active IQ3 μA at 0.25 Hz - allows >1-year battery life in coin-cell–powered IoT sensors with periodic wake-up.
Conversion Time26 ms typical - enables sub-40-ms thermal sampling for responsive closed-loop thermal management.
InterfaceI²C/SMBus-compatible, up to 3.4 MHz - supports fast-mode-plus timing for high-throughput multi-sensor polling.
Operating Temp–40°C to 125°C - qualified for industrial and automotive under-hood edge-node deployments.

Pinout & Package

Package: 4-ball DSBGA (YFF), 0.76 mm × 0.76 mm, 0.35 mm pitch, bottom-side solderable.

Pin/TerminalCircuit RoleDesign Meaning
A1V+Positive supply input - requires local 0.01-μF ceramic bypass capacitor to GND for noise immunity.
A2GNDAnalog/digital ground reference - must be connected directly to system ground plane for thermal accuracy.
B1SDAOpen-drain bidirectional data line - requires external pullup resistor (typically 2.2–10 kΩ) to V+.
B2SCLOpen-drain clock input - same pullup requirement as SDA; supports fast-mode-plus (3.4 MHz) timing.

Key Features

FeatureDesign Value
Multiple Device Access (MDA)Global read/write to up to eight TMP103 devices using single command - cuts bus traffic by ≥85% in 8-zone thermal monitoring.
One-Shot ModeTrigger single 26-ms conversion from shutdown state - ideal for event-driven thermal logging with minimal wake-up overhead.
Temperature WatchdogConfigurable THIGH/TLOW registers with latchable FH/FL flags - enables autonomous overtemperature detection without host polling.
Low-Power Shutdown≤1 μA shutdown current - preserves battery energy during idle periods in portable and wearable electronics.
Thermal Path OptimizationChip-die temperature sensing via package bumps - ensures accurate junction-to-ambient thermal tracking in thermally coupled layouts.

Applications

SSD Thermal ThrottlingMobile Handset Battery Monitoring

Use Scenario: Real-time die temperature measurement inside NVMe SSD modules to trigger throttling before NAND or controller thermal derating.

IC Role / Device Role / Timing Role: Primary temperature sensor feeding thermal management firmware; reads every 100 ms in continuous mode.

Use Value: Prevents sustained >85°C operation that degrades NAND endurance - leverages 1°C resolution and ±1°C accuracy for reliable trip-point enforcement.

Use Scenario: Monitoring lithium-ion battery pack surface temperature during charge/discharge cycles in smartphones.

IC Role / Device Role / Timing Role: Secondary thermal guardrail sensor; operates in one-shot mode triggered by charger IC events.

Use Value: Enables <100-μA average system current draw for thermal safety - meets IEC 62368-1 battery thermal runaway prevention requirements.

Notebook CPU Proximity SensingTelecom Baseband Unit Ambient Monitoring

Use Scenario: Placement near CPU voltage regulator to detect localized hotspots affecting VRM efficiency and fan speed control.

IC Role / Device Role / Timing Role: Local zone sensor interfacing to EC firmware; uses MDA to coexist with 3 other TMP103s on same bus.

Use Value: Reduces thermal response latency by 4× vs sequential polling - critical for maintaining <95°C CPU junction under burst workloads.

Use Scenario: Distributed ambient temperature sensing across RF front-end, baseband, and power supply sections in 5G small cells.

IC Role / Device Role / Timing Role: Zone-5 sensor (slave address 1110100) in 8-device MDA network; reports via SMBus interrupt.

Use Value: Supports dynamic RF output power scaling based on real-time ambient drift - improves PA linearity stability over –20°C to 70°C operating range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMP102DBVRSame 6-pin SOT-23 package; 0.5°C accuracy (–25°C to 85°C); no MDA support; 10-μA active IQ.Limited to single-device buses; lacks global command capability for multi-zone systems.Select when board space permits SOT-23 and MDA is unnecessary.
STTS751DT5-pin SOT-23; ±0.5°C accuracy (–25°C to 125°C); 12-bit resolution; I²C only (no SMBus alert); 2.5-μA active IQ.No watchdog latch mode; no one-shot entry from shutdown; requires external pullups on all pins.Choose for higher resolution where MDA and SMBus compatibility are secondary.

Compared with TMP103EYFFR, TMP102DBVR trades MDA and ultra-low IQ for easier layout in non-dense designs, while STTS751DT offers finer resolution but sacrifices bus efficiency and latch-mode reliability in safety-critical thermal shutdown paths.

Availability

TMP103EYFFR is available at Aetrix Electronics and suitable for SSD thermal management, mobile handset battery monitoring, notebook CPU proximity sensing, telecom baseband unit ambient monitoring, and industrial edge-node thermal profiling requiring stable component supply across extended product lifecycles.

Supply support for TMP103EYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in precision sensing and low-power signal chain solutions.

The TMP103 product line was designed for ultra-compact, multi-zone thermal monitoring in battery-powered and space-constrained electronics - delivering calibrated digital temperature data with minimal power and board area overhead.

FAQ

What is the exact slave address for TMP103EYFFR on the I²C bus?

The TMP103EYFFR uses a fixed 7-bit slave address of 1110100 (0x74 in hexadecimal), corresponding to its "E" variant designation per TI's TMP103 family addressing scheme. This address is hardwired and cannot be changed. The full 8-bit address byte sent by the master includes this 7-bit value plus the R/W bit (0 for write, 1 for read), resulting in 0xE8 for write and 0xE9 for read operations. No external address pins or configuration registers affect this value.

Does TMP103EYFFR support SMBus Alert Response Address (ARA) functionality?

No, TMP103EYFFR does not support SMBus Alert Response Address (ARA) functionality. It implements standard I²C/SMBus slave protocol with START/STOP, ACK/NACK, and register-based read/write - but lacks dedicated ALERT pin or ARA handling logic. Thermal event notification relies solely on software-polling of the FH/FL flag bits in the configuration register or host-initiated MDA broadcast queries. This is consistent across all TMP103 variants including TMP103EYFFR.

Can TMP103EYFFR operate reliably at 1.4 V supply with full specification compliance?

Yes, TMP103EYFFR is fully specified and tested down to 1.4 V supply voltage per TI's SBOS545D datasheet Section 6.3. At 1.4 V, it maintains ±1°C typical accuracy over –10°C to 100°C, 1°C resolution, and supports all conversion rates (0.25–8 Hz). Quiescent current remains ≤3 μA in active mode and ≤1 μA in shutdown. All timing parameters, including t(LOW), t(HIGH), and tR/tF, meet spec at 1.4 V when SCL frequency ≤400 kHz - making it suitable for single-cell LiFePO₄ or alkaline-powered systems.

How does the Multiple Device Access (MDA) feature work specifically for TMP103EYFFR?

TMP103EYFFR supports MDA through dedicated command codes (0x0C for MDA Write, 0x0D for MDA Read) that target all compatible TMP103 devices on the bus simultaneously - regardless of individual slave address. When the host sends an MDA Write, all TMP103EYFFR units (and other TMP103 variants) on the bus accept the same register update. During MDA Read, each device returns its local temperature register value in sequence, enabling synchronized multi-zone acquisition in one transaction. This eliminates per-device address overhead and reduces bus arbitration latency by up to 8× in 8-sensor configurations.

Is the TMP103EYFFR package RoHS-compliant and lead-free?

Yes, the TMP103EYFFR (YFF package) is RoHS-compliant and lead-free, meeting JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1) and TI's Green Standard (no brominated flame retardants, antimony trioxide, or heavy metals above threshold limits). The 0.76 mm × 0.76 mm DSBGA package uses SnAgCu (SAC305) solder bumps and halogen-free molding compound. Full compliance documentation, including IPC-1752-certified declarations, is available through TI's Quality & Environmental portal for TMP103EYFFR.

TMP103EYFFR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
4-UFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Sensor Type:
Digital, Local
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-
Output Type:
I2C/SMBus
Voltage - Supply:
1.4V ~ 3.6V
Resolution:
8 b
Features:
One-Shot, Shutdown Mode
Accuracy - Highest (Lowest):
±2°C (±3°C)
Test Condition:
-10°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature:
-55°C ~ 150°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
4-DSBGA (1x1)

TMP103EYFFR FAQ

1.How can I place an order for TMP103EYFFR through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP103EYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP103EYFFR reliable?

The price and inventory of TMP103EYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP103EYFFR is usually 5 days.

3.What payment methods are accepted for TMP103EYFFR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP103EYFFR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP103EYFFR?

TMP103EYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP103EYFFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP103EYFFR?

For technical support, including TMP103EYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP103EYFFR requirements.

6.How does Aetrix verify that TMP103EYFFR is sourced from the original manufacturer or authorized distributors?

All TMP103EYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP103EYFFR meets industry standards.

7.What is the process for return or replacement of TMP103EYFFR?

All TMP103EYFFR units undergo pre-shipment inspection (PSI). If there is an issue with TMP103EYFFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP103EYFFR part is unused and in its original packaging.

Return procedure for TMP103EYFFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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