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Texas Instruments TMP103FYFFT

Part No.:
TMP103FYFFT
Manufacturer:
Texas Instruments
Category:
Analog and Digital Output
Package:
4-UFBGA, DSBGA
Datasheet:
AetrixTMP103FYFFT.pdf
Description:
SENSOR DIGITAL -40C-125C 4DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:843

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Product details

Overview

TMP103FYFFT from Texas Instruments is a low-power, digital temperature sensor IC in a 4-ball DSBGA (WCSP) package, featuring I²C/SMBus-compatible two-wire interface, ±1°C typical accuracy over –10°C to 100°C, 1°C resolution, and 3-μA active quiescent current at 0.25 Hz conversion rate - used for thermal monitoring in space-constrained mobile and storage devices.

For engineers reviewing the TMP103FYFFT datasheet, TMP103FYFFT pinout, TMP103FYFFT application, or TMP103FYFFT equivalent, this page delivers verified electrical specs, MDA-enabled multi-device bus architecture, shutdown/one-shot/continuous conversion modes, thermal error vs. temperature behavior, and real-world integration guidance for SSDs, notebooks, and telecom equipment.

Technical Context

The TMP103FYFFT implements a monolithic diode-based temperature sensing element with on-chip 8-bit ADC and digital control logic, supporting three functional modes: shutdown (≤1 μA), one-shot (26 ms conversion, auto-return), and continuous (0.25–8 Hz via CR1/CR0 bits). Its serial interface includes integrated Schmitt triggers and spike suppression on SDA/SCL.

It supports Multiple Device Access (MDA) commands enabling global read/write to up to eight parallel TMP103 units using unique slave addresses (e.g., TMP103A = 0x70, TMP103F = 0x75), eliminating per-device addressing overhead - critical for thermal zone management in multi-core SoC platforms and high-density server DIMMs.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage1.4 V to 3.6 V - enables direct integration with 1.8 V and 3.3 V logic rails without level-shifting.
Accuracy±1°C typical (–10°C to 100°C) - meets thermal throttling thresholds for CPU/GPU die monitoring in consumer electronics.
Resolution1°C - sufficient for fan speed control and system-level thermal event triggering without oversampling.
Active Quiescent Current3 μA at 0.25 Hz - extends battery life in always-on thermal logging applications like IoT edge sensors.
Conversion Time26 ms typical - allows sub-40 ms thermal response for dynamic thermal management loops.
Operating Temp Range–40°C to 125°C - qualified for under-hood automotive infotainment and industrial SSD controller thermal feedback.
I²C/SMBus SpeedUp to 3.4 MHz (High-Speed Mode) - supports fast polling across 8-device bus without timing bottlenecks.

Pinout & Package

Package: 4-ball DSBGA (YFF), 0.76 mm × 0.76 mm, 0.35 mm height - ultra-compact footprint for PCB area-constrained modules such as M.2 SSDs and wearable sensor nodes.

Pin/TerminalCircuit RoleDesign Meaning
A1V+Positive supply input - requires local 0.01-μF ceramic bypass capacitor per TI layout guidelines.
A2GNDGround reference - must be connected to low-impedance system ground plane to minimize thermal measurement offset.
B1SDAOpen-drain bidirectional data line - requires external pullup resistor (typically 2.2–10 kΩ) to V+.
B2SCLOpen-drain clock input - same pullup requirement as SDA; supports standard/fast/high-speed I²C timing.

Key Features

FeatureDesign Value
Multiple Device Access (MDA)Enables simultaneous read/write to up to eight TMP103 units using global commands - reduces host firmware overhead by >75% vs. individual addressing.
Configurable Conversion RateFour selectable rates (0.25/1/4/8 Hz) via CR1/CR0 bits - balances power vs. responsiveness for thermal profiling in portable devices.
Temperature WatchdogTHIGH/TLOW registers + FH/FL flag bits - provides hardware-triggered thermal alert without MCU polling, reducing system latency.
One-Shot ModeSingle conversion initiated from shutdown state - achieves <30 μA average current in burst-sensing applications like lid-open detection.
ESD Robustness±2000 V HBM, ±1000 V CDM - ensures reliability during automated PCB assembly and field handling in consumer manufacturing.

Applications

HandsetsNotebooks

Use Scenario: Real-time battery and SoC die temperature monitoring during video playback or gaming.

IC Role / Device Role / Timing Role: Primary thermal sensor feeding closed-loop throttling logic in PMIC or application processor.

Use Value: 1°C resolution and ±1°C accuracy enable precise thermal margining, preventing premature throttling while maintaining safety limits.

Use Scenario: Zone-based thermal profiling of CPU, GPU, SSD, and keyboard surface in ultrabooks.

IC Role / Device Role / Timing Role: Distributed temperature node on shared I²C bus, addressed via MDA for synchronized reads.

Use Value: 4-ball DSBGA footprint minimizes board area; 3-μA active IQ extends battery runtime during light usage.

SSDsServers

Use Scenario: NAND flash and controller junction temperature tracking to prevent write endurance degradation.

IC Role / Device Role / Timing Role: Embedded thermal monitor soldered directly on M.2 module PCB near NAND packages.

Use Value: –40°C to 125°C operating range covers full SSD qualification envelope; 26 ms conversion supports rapid thermal response during sustained writes.

Use Scenario: Memory module (DIMM) temperature sensing for JEDEC-compliant thermal management in 1U rack servers.

IC Role / Device Role / Timing Role: Slave device on SMBus-connected thermal management controller (TMC).

Use Value: MDA support allows single-bus polling of 8 DIMMs, reducing TMC firmware complexity and bus arbitration latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMP112DBVRHigher accuracy (±0.5°C), 6-pin SOT-23 package, no MDA support, 10-μA active IQSingle-node precision sensing only; lacks multi-device bus efficiencySelect when absolute accuracy > MDA scalability; avoid if >1 sensor per bus is required.
LM75BIMM/NOPBLegacy 8-bit sensor, ±2°C accuracy, SOIC-8 package, no one-shot mode, 250-μA active IQBoard-level thermal guardrail only; unsuitable for battery-powered or dense layoutsChoose for cost-sensitive industrial controls where size and power are secondary.

Compared with TMP103FYFFT, TMP112DBVR trades MDA capability and ultra-low power for tighter accuracy in single-point use cases, while LM75BIMM/NOPB offers pin compatibility with legacy designs but lacks modern power and integration features essential for compact, multi-zone systems.

Availability

TMP103FYFFT is available at Aetrix Electronics and suitable for notebooks, SSDs, and telecom baseband units requiring stable component supply, long-term lifecycle assurance, and traceable wafer-lot sourcing.

Supply support for TMP103FYFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor company specializing in analog, embedded processing, and sensing technologies, with leadership in precision analog signal chains and low-power interface solutions.

The TMP103 product line delivers ultra-small, low-quiescent-current digital temperature sensors for thermal management in space- and power-constrained electronics - targeting mobile, storage, and infrastructure applications demanding high integration density.

FAQ

What is the package type and ball pitch of the TMP103FYFFT?

The TMP103FYFFT uses a 4-ball DSBGA (Wafer Chip-Scale Package) with nominal body size 0.76 mm × 0.76 mm and ball pitch of 0.35 mm. This YFF package enables direct mounting on high-density PCBs such as M.2 SSD modules and smartphone mainboards. The TMP103FYFFT's ultra-compact footprint supports thermal sensor placement adjacent to heat sources without consuming valuable routing layers.

Does the TMP103FYFFT support multiple devices on the same I²C bus, and how many?

Yes, the TMP103FYFFT supports Multiple Device Access (MDA), allowing up to eight units on a single two-wire bus. Each variant (e.g., TMP103A–TMP103H) has a unique slave address (0x70–0x77), enabling global read/write commands that eliminate sequential addressing. This feature is implemented in the TMP103FYFFT's hardware interface logic and requires no additional firmware overhead - ideal for thermal zone monitoring in multi-DIMM servers or multi-core SoCs.

What are the power consumption modes of the TMP103FYFFT, and what is its lowest current draw?

The TMP103FYFFT operates in three modes: shutdown (≤1 μA), one-shot (26 ms active, then auto-return), and continuous conversion (0.25–8 Hz). Its lowest current draw is 0.5–1 μA in shutdown mode at 1.8 V, verified across –40°C to 125°C. This value is measured with serial bus inactive and applies directly to the TMP103FYFFT - enabling years of operation on coin-cell batteries in wireless sensor nodes.

Can the TMP103FYFFT be used for thermal watchdog functions, and how is it configured?

Yes, the TMP103FYFFT includes a hardware temperature watchdog with programmable THIGH and TLOW registers. When the measured temperature exceeds THIGH or falls below TLOW, the FH or FL flag bit in the configuration register is set. These flags can trigger interrupt signals or be polled by the host. Configuration is done via I²C writes to the TMP103FYFFT's register map - no external components required. Latch mode (LC bit) retains flag state until explicitly cleared.

Is the TMP103FYFFT compatible with both I²C and SMBus protocols, and what speed modes does it support?

Yes, the TMP103FYFFT is fully compatible with standard-mode (100 kHz), fast-mode (400 kHz), and high-speed-mode (up to 3.4 MHz) I²C, as well as SMBus 2.0 specifications. Its SDA and SCL pins include integrated Schmitt triggers and noise filters, ensuring robust communication in electrically noisy environments. All timing parameters for these modes - including tLOW, tHIGH, and tBUF - are specified in the TMP103FYFFT datasheet and validated across voltage and temperature ranges.

TMP103FYFFT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
4-UFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Sensor Type:
Digital, Local
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-
Output Type:
I2C/SMBus
Voltage - Supply:
1.4V ~ 3.6V
Resolution:
8 b
Features:
One-Shot, Shutdown Mode
Accuracy - Highest (Lowest):
±2°C (±3°C)
Test Condition:
-10°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature:
-55°C ~ 150°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
4-DSBGA (1x1)

TMP103FYFFT FAQ

1.How can I place an order for TMP103FYFFT through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP103FYFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP103FYFFT reliable?

The price and inventory of TMP103FYFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP103FYFFT is usually 5 days.

3.What payment methods are accepted for TMP103FYFFT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP103FYFFT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP103FYFFT?

TMP103FYFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP103FYFFT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP103FYFFT?

For technical support, including TMP103FYFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP103FYFFT requirements.

6.How does Aetrix verify that TMP103FYFFT is sourced from the original manufacturer or authorized distributors?

All TMP103FYFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP103FYFFT meets industry standards.

7.What is the process for return or replacement of TMP103FYFFT?

All TMP103FYFFT units undergo pre-shipment inspection (PSI). If there is an issue with TMP103FYFFT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP103FYFFT part is unused and in its original packaging.

Return procedure for TMP103FYFFT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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