Texas Instruments TMP103HYFFR

Overview

TMP103HYFFR from Texas Instruments is a low-power, digital temperature sensor in a 4-ball DSBGA (WCSP) package, featuring I²C/SMBus-compatible two-wire interface, ±1°C typical accuracy over –10°C to 100°C, 1°C resolution, and 3-μA active quiescent current at 0.25 Hz conversion rate - deployed for thermal monitoring in SSDs, notebooks, and telecom equipment.

For engineers reviewing the TMP103HYFFR datasheet, TMP103HYFFR pinout, TMP103HYFFR application, or TMP103HYFFR equivalent, key selection criteria include its MDA-capable bus architecture supporting up to eight devices on one bus, 1.4 V to 3.6 V supply range, shutdown current of 1 μA, and space-constrained WCSP footprint (0.76 mm × 0.76 mm).

Technical Context

The TMP103HYFFR implements an on-die diode-based temperature sensing element with successive-approximation ADC, integrated oscillator, and configurable register map including THIGH/TLOW limit registers and CR1/CR0 conversion rate bits. Its serial interface supports both standard (≤400 kHz) and high-speed (≤3.4 MHz) I²C modes with built-in Schmitt triggers and spike suppression on SDA/SCL.

It operates in three functional modes: Shutdown (M1=M0=0), One-Shot (M1=0,M0=1), and Continuous Conversion (M1=1), with conversion time fixed at 26 ms and programmable update rates of 0.25/1/4/8 Hz. The device uses a global MDA command structure enabling simultaneous read/write across multiple TMP103 units without individual addressing.

Key Specifications

Pinout & Package

Package: 4-ball DSBGA (YFF), 0.76 mm × 0.76 mm, 0.35 mm pitch, bottom-side solder balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Compared with TMP103HYFFR, TMP117AIRGZR trades bus efficiency and size for metrology-grade precision, while STTS751-2DFW6 offers tighter accuracy but forfeits MDA-driven scalability and ultra-low-power One-Shot operation - making TMP103HYFFR optimal for cost-sensitive, space-constrained multi-zone thermal systems.

Availability

TMP103HYFFR is available at Aetrix Electronics and suitable for SSD thermal management, notebook system monitoring, and telecom baseband unit applications requiring stable component supply across extended production lifecycles.

Supply support for TMP103HYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor company specializing in analog and embedded processing technologies, with leadership in precision sensing, power management, and interface solutions.

The TMP103 product line was designed specifically for ultra-low-power, multi-node thermal monitoring in space-constrained portable and infrastructure electronics - emphasizing bus efficiency, minimal footprint, and robust operation across industrial temperature ranges.

FAQ

What is the package type and dimensions of the TMP103HYFFR?

The TMP103HYFFR uses a 4-ball DSBGA (Wafer Chip-Scale Package) with YFF designation, measuring 0.76 mm × 0.76 mm and 0.35 mm ball pitch. This ultra-compact footprint is optimized for high-density PCB layouts in SSDs and mobile devices. The TMP103HYFFR's ball configuration (V+, GND, SDA, SCL) is validated per TI's SBOS545D datasheet Figure 3.

Does the TMP103HYFFR support multiple devices on the same I²C bus?

Yes, the TMP103HYFFR supports Multiple Device Access (MDA), allowing up to eight units - including TMP103A through TMP103H variants - to share one I²C bus. Each variant has a unique 7-bit slave address (e.g., TMP103H = 1110111), and global MDA commands let the host read or write all devices simultaneously. This capability is intrinsic to the TMP103HYFFR design and documented in Section 7.3 of the datasheet.

What is the conversion time and accuracy specification for the TMP103HYFFR?

The TMP103HYFFR has a fixed conversion time of 26 ms and delivers ±1°C typical accuracy over –10°C to 100°C at 1.8 V supply. Accuracy degrades to ±3°C across the full –40°C to 125°C range. These values are measured per JEDEC JESD51 standards and confirmed in Section 6.5 of the TMP103HYFFR datasheet - no calibration is required for standard thermal management use cases.

How does the TMP103HYFFR achieve ultra-low power consumption?

The TMP103HYFFR achieves ultra-low power via three mechanisms: (1) 1 μA shutdown current, (2) 3 μA active quiescent current at default 0.25 Hz conversion rate, and (3) One-Shot mode that performs a single 26 ms measurement then auto-returns to shutdown. These features are implemented in silicon and verified in Section 6.5 and 7.4 of the TMP103HYFFR datasheet - enabling years of operation on coin-cell batteries in wireless sensors.

Can the TMP103HYFFR operate from a 1.4 V supply?

Yes, the TMP103HYFFR is fully specified to operate from 1.4 V to 3.6 V, with all electrical characteristics - including accuracy, conversion time, and interface timing - guaranteed across this range. This allows direct connection to single-cell Li-ion (2.7–4.2 V) or regulated 1.8 V/3.3 V rails without level shifters. The 1.4 V minimum is explicitly stated in Section 6.3 of the TMP103HYFFR datasheet.