Texas Instruments TMP103HYFFT
- Part No.:
- TMP103HYFFT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 4-UFBGA, DSBGA
- Datasheet:
-
TMP103HYFFT.pdf
- Description:
- SENSOR DIGITAL -40C-125C 4DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMP103HYFFT from Texas Instruments is a low-power, digital temperature sensor in a 4-ball DSBGA (WCSP) package, featuring I²C/SMBus-compatible two-wire interface, ±1°C typical accuracy over –10°C to 100°C, 1°C resolution, and 3-μA active quiescent current at 0.25 Hz conversion rate - used for thermal monitoring in space-constrained mobile and storage devices.
For engineers reviewing the TMP103HYFFT datasheet, TMP103HYFFT pinout, TMP103HYFFT application, or TMP103HYFFT equivalent, key selection criteria include its MDA (Multiple Device Access) capability for global bus reads/writes across up to eight sensors, shutdown current of ≤1 μA, 1.4 V–3.6 V supply range, and zone-specific slave addressing (TMP103H = 1110111).
Technical Context
The TMP103HYFFT implements a diode-based on-die temperature sensing element with 8-bit ADC and integrated oscillator, supporting three functional modes: shutdown (≤1 μA), one-shot (26 ms conversion), and continuous conversion (0.25/1/4/8 Hz via CR1/CR0 bits). Its serial interface includes Schmitt-triggered SCL/SDA inputs with spike suppression and supports fast-mode (up to 400 kHz) and high-speed mode (up to 3.4 MHz) timing.
It features a programmable temperature watchdog with THIGH/TLOW registers, latchable flag bits (FH/FL/LC), and a pointer-register architecture enabling register-level read/write access. The device uses a fixed 7-bit slave address (1110111 for TMP103H variant) with R/W bit, and responds to general-call reset but not to SMBus alert or timeout commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.4 V to 3.6 V - enables direct integration into single-cell Li-ion or coin-cell powered systems without LDO. |
| Accuracy | ±1°C typical (–10°C to 100°C) - sufficient for thermal throttling and system health monitoring in consumer electronics. |
| Resolution | 1°C - fixed output granularity; no user-selectable oversampling or extended precision mode. |
| Active Quiescent Current | 3 μA at 0.25 Hz - allows battery-powered devices to sample temperature every 4 seconds with negligible drain. |
| Shutdown Current | 1 μA - maintains ultra-low standby power while retaining I²C address recognition and wake-on-read capability. |
| Conversion Time | 26 ms typical - enables rapid one-shot polling for event-triggered thermal response (e.g., CPU load surge). |
| Operating Temperature | –40°C to 125°C - supports industrial-grade operation in SSDs, telecom modules, and embedded controllers. |
| I²C Address | 0x77 (1110111) - unique 7-bit slave address for TMP103H variant; avoids conflict with common peripherals like EEPROMs or RTCs. |
Pinout & Package
Package: 4-ball DSBGA (YFF), 0.76 mm × 0.76 mm, 0.35 mm pitch, bottom-side solderable. Thermal resistance RθJA = 160°C/W - requires minimal PCB copper area for thermal management in thin-profile designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 V+ | Power supply input | Accepts 1.4–3.6 V; must be decoupled with 0.01-μF capacitor near ball for noise immunity. |
| A2 GND | Ground reference | System ground return path; connects directly to PCB ground plane under package for lowest thermal resistance. |
| B1 SDA | Open-drain bidirectional data line | Requires external pullup (typically 2.2–10 kΩ); supports I²C ACK/NACK and MDA broadcast writes. |
| B2 SCL | Open-drain clock input | Master-generated clock; integrates Schmitt trigger and spike filter to tolerate >300 ns noise pulses. |
Key Features
| Feature | Design Value |
|---|---|
| Multiple Device Access (MDA) | Enables simultaneous read/write to up to eight TMP103 devices using global commands - reduces bus traffic by >85% vs individual addressing in multi-zone thermal systems. |
| Programmable Conversion Rate | Four selectable rates (0.25/1/4/8 Hz) via CR1/CR0 bits - balances responsiveness and power for use cases ranging from ambient monitoring to real-time thermal control. |
| Temperature Watchdog | Configurable THIGH/TLOW registers with latchable FH/FL flags - triggers host interrupt on thermal excursion without polling overhead. |
| One-Shot Mode | Entry from shutdown state via M1/M0 = 01 - achieves <30 ms full measurement cycle with zero background current between samples. |
| Zone-Specific Addressing | TMP103H uses fixed 7-bit address 0x77 - eliminates external address pins or configuration resistors, simplifying layout and BOM for zone-identified thermal sensing. |
Applications
| Mobile Handset Thermal Management | SSD Controller Temperature Monitoring |
|---|---|
Use Scenario: Real-time die temperature tracking of AP/SoC and PMIC during burst workloads in smartphones. IC Role / Device Role / Timing Role: Localized on-die thermal sensor providing 1°C-resolution readings every 250 ms to enable dynamic voltage/frequency scaling (DVFS). Use Value: Prevents thermal throttling-induced frame drops by triggering DVFS 200 ms before junction exceeds 95°C threshold. | Use Scenario: Monitoring NAND flash controller temperature in M.2 NVMe SSDs to prevent write endurance degradation. IC Role / Device Role / Timing Role: Dedicated zone sensor placed adjacent to controller ASIC, reporting via I²C at 1 Hz during active writes. Use Value: Enables adaptive thermal throttling that extends SSD lifespan by 18% under sustained 70°C ambient conditions. |
| Notebook Platform Ambient Sensing | Telecom Baseband Module Profiling |
Use Scenario: Measuring chassis ambient near keyboard and hinge zones to optimize fan speed profiles in ultrabooks. IC Role / Device Role / Timing Role: Low-power ambient sensor operating in 0.25 Hz continuous mode, interfacing with EC firmware. Use Value: Reduces system idle power by 12 mW vs discrete thermistor + ADC solution while maintaining ±1°C accuracy. | Use Scenario: Distributed thermal profiling across multiple RF front-end ICs in small-cell baseband units. IC Role / Device Role / Timing Role: Eight TMP103H units (0x77) deployed per board, addressed globally via MDA for synchronized snapshot reads. Use Value: Cuts thermal calibration time by 70% during production test by eliminating sequential I²C transactions per sensor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIMM/NOPB | Fixed 9-bit resolution (0.5°C), no MDA support, 250 μA active current, SOIC-8 package (3×4.9 mm) | Lacks zone-broadcast capability; requires PCB space 12× larger than TMP103HYFFT's 0.76 mm² footprint | Choose when legacy I²C compatibility and wider temp range (–55°C to 125°C) outweigh size/power constraints. |
| STTS751-2DMR | 12-bit resolution (0.0625°C), SMBus Alert output, TDFN-8 (2×2 mm), 1.7–3.6 V supply | Includes hardware interrupt pin for thermal events; higher resolution but 15× higher active current (45 μA) | Prefer when precise thermal trip points and interrupt-driven response are required over ultra-low power. |
Compared with LM75BIMM/NOPB and STTS751-2DMR, TMP103HYFFT delivers the smallest footprint and lowest active/shutdown current among these alternatives, making it optimal for battery-powered, multi-sensor thermal architectures where bus efficiency and spatial constraints dominate.
Availability
TMP103HYFFT is available at Aetrix Electronics and suitable for notebook thermal management, SSD controller monitoring, telecom baseband profiling, handset SoC throttling, and set-top box ambient sensing requiring stable component supply across long-lifecycle consumer programs.
Supply support for TMP103HYFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The TMP103 product line was designed specifically for ultra-compact, ultra-low-power thermal sensing in multi-zone portable and storage systems - prioritizing minimal footprint, MDA-enabled bus efficiency, and sub-1μA shutdown operation.
FAQ
What is the I²C slave address of the TMP103HYFFT?
The TMP103HYFFT uses a fixed 7-bit I²C slave address of 0x77 (binary 1110111), corresponding to the TMP103H variant per TI's device addressing table. This address is hardwired and cannot be changed via pins or registers. When calculating the full 8-bit address byte, the R/W bit is appended - resulting in 0xF0 for write operations and 0xF1 for read operations. The TMP103HYFFT does not respond to general-call writes unless explicitly enabled via configuration register settings.
Does the TMP103HYFFT support SMBus Alert functionality?
No, the TMP103HYFFT does not implement SMBus Alert (SMBALERT#) functionality. It lacks a dedicated interrupt output pin and does not assert an alert signal on bus activity. Thermal event detection relies solely on software polling of the FH/FL flag bits in the configuration register after reading temperature data. For hardware interrupt-driven thermal management, alternative sensors such as the STTS751-2DMR or TMP117 are recommended.
How does Multiple Device Access (MDA) work on the TMP103HYFFT?
MDA on the TMP103HYFFT allows a master controller to issue a single broadcast command that all TMP103 devices on the same I²C bus respond to simultaneously - regardless of their individual slave addresses. The TMP103HYFFT recognizes MDA write commands (0x00) and MDA read commands (0x01) sent to the reserved address 0x00 (General Call). This eliminates sequential addressing overhead, reducing bus transaction time by up to 88% when reading temperature from eight sensors. MDA does not alter the device's native 0x77 address for standard operations.
What is the maximum I²C clock frequency supported by the TMP103HYFFT?
The TMP103HYFFT supports I²C clock frequencies up to 3.4 MHz in high-speed mode when V+ > 1.7 V, and up to 2.75 MHz when V+ < 1.7 V. In standard/fast-mode, it operates from 1 kHz to 400 kHz. Timing parameters including t(LOW), t(HIGH), and t(F) are fully specified across all modes in the datasheet. Note that active quiescent current increases to 85 μA at 3.4 MHz - a trade-off between speed and power that must be evaluated per application.
Can the TMP103HYFFT measure ambient air temperature accurately?
The TMP103HYFFT measures its own die temperature, which closely tracks PCB substrate temperature due to low thermal resistance through package bumps. For accurate ambient air temperature measurement, the device must be thermally isolated from the PCB using elevated mounting, thermal vias, or airflow shielding - otherwise readings reflect board temperature, not ambient. TI recommends avoiding placement near heat sources and using conformal coating only if validated for thermal impact. Accuracy degrades by >2°C if mounted directly on high-copper layers without isolation.
TMP103HYFFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 4-UFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 8 b
- Features:
- One-Shot, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -10°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 4-DSBGA (1x1)
TMP103HYFFT FAQ
1.How can I place an order for TMP103HYFFT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP103HYFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP103HYFFT reliable?
The price and inventory of TMP103HYFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP103HYFFT is usually 5 days.
3.What payment methods are accepted for TMP103HYFFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP103HYFFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP103HYFFT?
TMP103HYFFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP103HYFFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP103HYFFT?
For technical support, including TMP103HYFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP103HYFFT requirements.
6.How does Aetrix verify that TMP103HYFFT is sourced from the original manufacturer or authorized distributors?
All TMP103HYFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP103HYFFT meets industry standards.
7.What is the process for return or replacement of TMP103HYFFT?
All TMP103HYFFT units undergo pre-shipment inspection (PSI). If there is an issue with TMP103HYFFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP103HYFFT part is unused and in its original packaging.
Return procedure for TMP103HYFFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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