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Texas Instruments TMP1075DSGR
- Part No.:
- TMP1075DSGR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
TMP1075DSGR.pdf
- Description:
- IC TEMP SENSOR
- Quantity:
- Payment:
- Shipping:
Inventory:15,194
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Product details
Overview
TMP1075DSGR from Texas Instruments is a high-accuracy, low-power digital temperature sensor with I²C and SMBus interface, ±0.25°C typical accuracy from −55°C to 125°C, 12-bit resolution (0.0625°C), and 2.7 μA average supply current. It serves as a pin- and software-compatible upgrade to LM75/TMP75 in thermal monitoring circuits for power supplies, battery management, and PC/notebook systems.
For engineers reviewing the TMP1075DSGR datasheet, TMP1075DSGR pinout, TMP1075DSGR application, or TMP1075DSGR equivalent, key selection criteria include its −55°C to 125°C operating range, WSON-8 package footprint (2.0 mm × 2.0 mm), NIST-traceable calibration, ALERT pin functionality, and support for up to 32 I²C addresses - all critical for space-constrained, high-reliability thermal sensing designs.
Technical Context
The TMP1075DSGR integrates an on-chip 12-bit ADC with 0.0625°C resolution and uses an internal thermal BJT sensor whose output is independent of supply voltage (PSRR ±0.03°C/V). Its digital interface supports I²C fast mode (400 kHz) and high-speed mode (2.56 MHz), with integrated spike filters enabling coexistence on I³C mixed fast-mode buses.
It implements configurable conversion rates (27.5 ms to 220 ms), programmable THIGH/TLOW registers for interrupt-driven thermal alerts, and SMBus Alert/Reset compatibility. The device samples A0/A1/A2 address pins on every bus transaction to support dynamic address configuration across up to 32 devices on one bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.25°C typical (−55°C to 125°C); ±1°C max (−40°C to 110°C) - enables precise thermal throttling without system-level calibration |
| Resolution | 12-bit (0.0625°C LSB) - supports fine-grained temperature trending and differential monitoring |
| Supply Range | 1.7 V to 5.5 V - interoperates with 1.8 V, 3.3 V, and 5 V host systems without level-shifting |
| Average Current | 2.7 μA (default conversion rate) - extends battery life in portable and always-on environmental sensors |
| I²C Addresses | 32 unique addresses via A0/A1/A2 pins - allows dense multi-sensor deployments on single bus |
| Package | WSON-8 (DSG), 2.0 mm × 2.0 mm - reduces PCB area by 82% vs. SOIC-8, ideal for compact modules |
| NIST Traceability | 100% production-tested per ISO/IEC 17025-accredited standards - satisfies metrology requirements in industrial and medical applications |
Pinout & Package
Package: WSON-8 (DSG), 2.0 mm × 2.0 mm, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SDA | I/O (open-drain) | Serial data line; requires external pullup; supports I²C/SMBus read/write and ACK/NACK signaling |
| 2: GND | Power reference | System ground return; connects to thermal pad for optimal heat dissipation and noise immunity |
| 3: ALERT | Output (open-drain) | Active-low overtemperature alert; configurable threshold trigger; requires pullup for SMBus Alert compliance |
| 4: SCL | Input | Serial clock input; includes integrated Schmitt trigger and spike filter for robust noise immunity |
| 5: V+ | Power supply | 1.7–5.5 V supply input; powers internal ADC, logic, and interface; bypass with 0.01 µF capacitor |
| 6: A0 | Input | LSB address select; accepts GND/V+/SDA/SCL to configure one of 32 I²C addresses |
| 7: A2 | Input | MSB address select; connects to GND or V+; sampled dynamically on each bus transaction |
| 8: A1 | Input | Middle address bit; accepts GND/V+/SDA/SCL; enables flexible address mapping in multi-device systems |
Key Features
| Feature | Design Value |
|---|---|
| LM75/TMP75 software compatibility | Drop-in register map and command set - eliminates firmware rework when upgrading legacy thermal monitors |
| Programmable conversion rate | Four selectable rates (27.5/55/110/220 ms) - balances measurement latency vs. power consumption per application need |
| I³C mixed fast-mode support | Integrated 50 ns spike filter on SCL/SDA - enables coexistence with I³C masters without bus arbitration conflicts |
| Thermal error independence from supply | PSRR of ±0.03°C/V - ensures stable readings across brown-out or battery-voltage droop conditions |
| Dynamic address configuration | A0/A1/A2 sampled per transaction - allows runtime readdressing without hardware changes or reset |
Applications
| Power-Supply Thermal Monitoring | PC and Notebook Thermal Management |
|---|---|
Use Scenario: Real-time junction temperature tracking of VRMs, DC-DC converters, and PMICs in server PSUs and telecom power bricks. IC Role / Device Role / Timing Role: Primary temperature sensor feeding thermal control loop; provides 0.0625°C-resolution data at 27.5 ms intervals for dynamic fan speed adjustment. Use Value: Prevents thermal runaway during transient load spikes while maintaining ±0.25°C accuracy across −55°C to 125°C ambient - critical for ASHRAE Class A4 environments. | Use Scenario: CPU/GPU die proximity sensing and motherboard hotspot detection in thin-and-light laptops and mini-PCs. IC Role / Device Role / Timing Role: Secondary thermal monitor interfacing directly to EC or BMC via shared I²C bus; operates in interrupt mode using ALERT pin to reduce polling overhead. Use Value: Enables rapid thermal response (<100 ms alert-to-action) with 32-device address space - supports multi-zone monitoring without bus contention. |
| Battery Pack Temperature Sensing | Wireless Environmental Sensor Nodes |
Use Scenario: Cell-level temperature monitoring in Li-ion battery packs for EVs, e-bikes, and power tools. IC Role / Device Role / Timing Role: Low-power thermal node in distributed BMS architecture; wakes periodically to report temperature via I²C to master MCU. Use Value: 2.7 μA average current and 0.37 μA shutdown current extend battery life >5 years in maintenance-free deployments; NIST traceability ensures regulatory compliance. | Use Scenario: Compact, battery-powered air quality and HVAC sensors deployed in smart buildings and industrial IoT gateways. IC Role / Device Role / Timing Role: Primary ambient temperature sensor in ultra-small form factor nodes; communicates over I²C to ESP32 or nRF52 host with minimal PCB real estate. Use Value: 2.0 mm × 2.0 mm WSON-8 package saves 82% board area vs. SOIC-8 - enables sub-10 cm³ sensor enclosures while retaining full accuracy and I²C flexibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIMM/NOPB | 8-bit resolution (1°C), ±2°C accuracy (−25°C to 100°C), SOIC-8 only, no ALERT pin, 250 μA supply current | Limited to basic thermal warning in non-critical consumer electronics; lacks precision for closed-loop control | Select when cost sensitivity outweighs accuracy and power needs; not suitable for battery or high-density designs |
| TMP117AIYFFR | ±0.1°C max accuracy (−55°C to 150°C), 16-bit resolution, 3.5 μA avg current, same WSON-8 package | Targeted at metrology-grade applications requiring tighter tolerance and extended range; higher cost | Choose for medical, test equipment, or aerospace where ±0.1°C is mandated; over-spec for general thermal protection |
Compared with LM75BIMM/NOPB, TMP1075DSGR delivers 12× finer resolution and 99% lower power; versus TMP117AIYFFR, it offers identical footprint and I²C compatibility at 40% lower unit cost while meeting most industrial thermal management specs.
Availability
TMP1075DSGR is available at Aetrix Electronics and suitable for power-supply thermal monitoring, PC/notebook thermal management, and battery pack sensing requiring stable component supply, long-term lifecycle support, and consistent NIST-traceable calibration across production lots.
Supply support for TMP1075DSGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in precision sensing, power management, and signal chain technologies.
The TMP1075 product line targets high-accuracy, ultra-low-power thermal sensing for industrial, computing, and battery-powered applications - designed to replace legacy LM75-family sensors while enabling smaller footprints and smarter thermal control.
FAQ
What is the operating temperature range of the TMP1075DSGR?
The TMP1075DSGR is specified for operation from −55°C to +125°C. Its accuracy is ±0.25°C typical across this full range, with ±1°C maximum error between −40°C and +110°C. This wide range makes the TMP1075DSGR suitable for under-hood automotive modules, industrial motor drives, and outdoor telecom equipment where extreme ambient conditions occur.
Does the TMP1075DSGR support I³C bus compatibility?
Yes, the TMP1075DSGR supports coexistence on I³C mixed fast-mode buses via integrated 50 ns spike filters on SCL and SDA pins. It does not implement full I³C protocol features like in-band interrupts or dynamic address assignment, but its noise-immune interface prevents bus collisions when sharing infrastructure with I³C masters - confirmed in TI's SBOS854F datasheet Section 6.9.
How many I²C addresses does the TMP1075DSGR support?
The TMP1075DSGR supports up to 32 unique I²C addresses via hardware-configurable A0, A1, and A2 pins. Each pin accepts GND, V+, SDA, or SCL, enabling flexible addressing in multi-sensor systems. This capability is validated in Table 7-2 of the datasheet and applies specifically to the TMP1075DSGR (DSG package), unlike the TMP1075N variant which supports only 4 addresses.
What is the resolution and accuracy of the TMP1075DSGR temperature reading?
The TMP1075DSGR provides 12-bit temperature resolution (0.0625°C per LSB) and ±0.25°C typical accuracy from −55°C to +125°C. Maximum accuracy is ±1°C from −40°C to +110°C and ±2°C across the full range. These values are measured and guaranteed per TI's NIST-traceable production test setup, as documented in Sections 6.5 and 7.3.1 of the SBOS854F datasheet.
Is the TMP1075DSGR pin-compatible with the LM75?
Yes, the TMP1075DSGR is pin-to-pin compatible with the industry-standard LM75 in SOIC-8, VSSOP-8, and WSON-8 packages - including the DSG variant. Its pinout matches LM75 exactly (SCL, GND, ALERT, SDA, V+, A0, A2, A1), and it maintains register-level software compatibility, enabling drop-in replacement without PCB or firmware changes.
TMP1075DSGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 1.7V ~ 5.5V
- Resolution:
- 12 b
- Features:
- Shutdown Mode, One-Shot
- Accuracy - Highest (Lowest):
- ±1°C (±2°C)
- Test Condition:
- -40°C ~ 75°C (-55°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-WSON (2x2)
TMP1075DSGR FAQ
1.How can I place an order for TMP1075DSGR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP1075DSGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP1075DSGR reliable?
The price and inventory of TMP1075DSGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP1075DSGR is usually 5 days.
3.What payment methods are accepted for TMP1075DSGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP1075DSGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP1075DSGR?
TMP1075DSGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP1075DSGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP1075DSGR?
For technical support, including TMP1075DSGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP1075DSGR requirements.
6.How does Aetrix verify that TMP1075DSGR is sourced from the original manufacturer or authorized distributors?
All TMP1075DSGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP1075DSGR meets industry standards.
7.What is the process for return or replacement of TMP1075DSGR?
All TMP1075DSGR units undergo pre-shipment inspection (PSI). If there is an issue with TMP1075DSGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP1075DSGR part is unused and in its original packaging.
Return procedure for TMP1075DSGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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