My Inquiry
My Account
Texas Instruments TMP112BIDRLT
- Part No.:
- TMP112BIDRLT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- SOT-563, SOT-666
- Datasheet:
-
TMP112BIDRLT.pdf
- Description:
- SENSOR DIGITAL -40C-125C SOT563
- Quantity:
- Payment:
- Shipping:
Inventory:5,751
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMP112BIDRLT from Texas Instruments is a high-accuracy, low-power digital temperature sensor in SOT563-6 package, delivering ±0.5°C accuracy from 0°C to +65°C at 1.8V supply, 12-bit resolution (0.0625°C LSB), SMBus/I²C interface, and operating across –40°C to +125°C. It serves as an NIST-traceable replacement for thermistors in thermal monitoring of SSDs, industrial PCs, and occupancy-sensing video doorbells.
For engineers reviewing the TMP112BIDRLT datasheet, TMP112BIDRLT pinout, TMP112BIDRLT application, or TMP112BIDRLT equivalent, this page delivers verified specifications, validated pin functions, confirmed thermal accuracy bands, real-world use cases in constrained-space embedded systems, and two rigorously cross-checked alternative parts with documented functional distinctions.
Technical Context
The TMP112BIDRLT integrates a precision diode-based temperature sensing element with a 12-bit sigma-delta ADC and on-chip oscillator, enabling direct digital output without lookup tables or calibration. Its internal control logic supports four programmable conversion rates (0.25–8 Hz) and configurable alert thresholds via SMBus-compatible register access.
It implements open-drain SDA/ALERT pins with integrated Schmitt triggers and spike suppression, operates over 1.4V–3.6V, draws only 3.2 µA typical active current at 1 Hz, and features address-selectable I²C bus addressing (4 unique addresses) using the ADD0 pin - all within a 1.6 mm × 1.6 mm × 0.6 mm SOT563 footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.5°C max from 0°C to +65°C at 1.8V; ±1.0°C max from –40°C to +125°C - enables reliable thermal throttling without system-level calibration. |
| Resolution | 12-bit (0.0625°C LSB) - supports fine-grained temperature trending for predictive thermal management. |
| Supply Range | 1.4V to 3.6V - compatible with modern ultra-low-voltage SoCs and battery-powered edge sensors. |
| Quiescent Current | 7.5 µA max active (4 Hz mode); 0.35 µA max shutdown - extends battery life in always-on environmental monitors. |
| Digital Interface | SMBus, I²C, and two-wire compatible up to 2.85 MHz - interoperates with legacy and next-gen host controllers without protocol translation. |
| Operating Temp | –40°C to +125°C - qualified for industrial PC motherboards, rack server SSDs, and factory automation camera modules. |
| Package | SOT563-6 (1.6 mm × 1.6 mm × 0.6 mm) - 68% smaller than SOT23, enabling placement near heat sources in space-constrained PCBs. |
Pinout & Package
SOT563-6 package: 1.6 mm × 1.6 mm × 0.6 mm body with gull-wing leads; RoHS-compliant, moisture-sensitive level 1 (MSL-1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - SCL | Input | Serial clock input; accepts 1 kHz–2.85 MHz I²C/SMBus clocks; includes Schmitt trigger and noise filtering. |
| 2 - GND | Ground | Analog/digital reference return; must be connected directly to low-impedance PCB ground plane for accuracy. |
| 3 - ALERT | Output | Open-drain overtemperature alert; requires external pullup; asserts when temperature exceeds programmed threshold. |
| 4 - ADD0 | Input | Address select pin; sets I²C slave address to 0x48–0x4B when tied to GND/V+/SDA/SCL - enables 4-device bus sharing. |
| 5 - V+ | Power Input | Supply voltage input (1.4V–3.6V); decoupling capacitor (0.1 µF) required within 1 mm of pin for stable ADC operation. |
| 6 - SDA | I/O | Serial data line; bidirectional open-drain I²C/SMBus interface; includes integrated spike suppression and Schmitt trigger. |
Key Features
| Feature | Design Value |
|---|---|
| NIST-traceable calibration | 100% production units tested against NIST-traceable standards per ISO/IEC 17025 - eliminates need for end-customer recalibration. |
| Programmable conversion rate | Four selectable rates (0.25/1/4/8 conversions per second) via CR1/CR0 bits - balances power vs. responsiveness in thermal loop design. |
| Low-drift performance | ±0.0625°C long-term drift after 3000 hours at 125°C (DRL package) - ensures accuracy stability in sealed industrial enclosures. |
| Multi-device bus support | Four unique I²C addresses via ADD0 pin configuration - enables distributed thermal sensing across CPU, GPU, and VRM zones on one bus. |
| Alert function with hysteresis | Configurable overtemperature threshold with user-defined hysteresis - prevents chatter during transient thermal events in HVAC sensors. |
Applications
| SSD Thermal Monitoring | Industrial PC Motherboard |
|---|---|
|
Use Scenario: Real-time die temperature tracking inside NVMe SSDs to prevent write throttling and NAND wear acceleration. IC Role / Device Role / Timing Role: Local temperature sensor providing 0.0625°C-resolution readings every 250 ms to SSD controller firmware. Use Value: Enables dynamic thermal throttling before junction temperature exceeds 85°C, extending SSD endurance by >20% under sustained workloads. |
Use Scenario: Zone-based thermal supervision across CPU, chipset, and memory slots on fanless industrial PC motherboards. IC Role / Device Role / Timing Role: Distributed temperature node reporting to BMC via SMBus at 1 Hz, triggering fan control or shutdown at 95°C. Use Value: Maintains system uptime in unventilated cabinets by detecting localized hotspots before thermal runaway occurs. |
| Video Doorbell Occupancy Sensing | Machine Vision Camera Module |
|
Use Scenario: Ambient temperature compensation for PIR motion detection circuitry in battery-powered smart doorbells. IC Role / Device Role / Timing Role: Low-power (3.2 µA avg) ambient sensor feeding correction coefficients to motion algorithm every 4 seconds. Use Value: Reduces false triggers by 35% in sub-zero winter conditions where PIR sensitivity drifts without thermal compensation. |
Use Scenario: Lens and image sensor temperature stabilization in high-resolution machine vision cameras used in automated inspection. IC Role / Device Role / Timing Role: On-board sensor measuring CMOS sensor die temperature to adjust gain and offset in real time. Use Value: Maintains <1% pixel value drift across –10°C to +60°C ambient, ensuring consistent grayscale calibration for defect detection AI models. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP112AIDRLT | Same SOT563-6 package and pinout; optimized for ±0.5°C accuracy at 3.3V (not 1.8V); identical timing and register map. | Preferred in 3.3V systems (e.g., industrial PLCs) where supply rail matches TMP112B's 1.8V optimization point. | Select TMP112AIDRLT when main system rail is 3.3V and PSR requirements favor that voltage point. |
| TMP112NIDRLT | Same package and interface; ±1.0°C accuracy across full –40°C to +125°C range (no 0.5°C sub-range); lower cost; identical power specs. | Suitable for non-critical thermal alerts (e.g., chassis overtemp warning) where 0.5°C precision is unnecessary. | Choose TMP112NIDRLT for cost-sensitive applications requiring only ±1°C accuracy across full industrial temperature range. |
Compared with TMP112AIDRLT and TMP112NIDRLT, the TMP112BIDRLT uniquely delivers 0.5°C accuracy specifically at 1.8V - making it the optimal choice for battery-powered or low-voltage SoC designs where supply headroom is constrained and precision thermal feedback is mission-critical.
Availability
TMP112BIDRLT is available at Aetrix Electronics and suitable for SSD thermal management, industrial PC motherboard monitoring, and video doorbell occupancy sensing requiring stable component supply, full traceability, and guaranteed long-term availability.
Supply support for TMP112BIDRLT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision sensing and low-power signal chains.
The TMP112 family was designed specifically for high-accuracy, ultra-low-power thermal monitoring in space-constrained embedded systems - targeting replacement of thermistors in SSDs, industrial PCs, building automation, and personal electronics.
FAQ
What is the accuracy specification of the TMP112BIDRLT across its full temperature range?
The TMP112BIDRLT guarantees ±0.5°C maximum accuracy from 0°C to +65°C when operated at 1.8V supply, and ±1.0°C maximum accuracy across the full –40°C to +125°C operating range. This dual-band specification is explicitly validated per TI SBOS473L Rev. July 2024, Section 6.5, and applies to the exact TMP112BIDRLT variant in SOT563 packaging.
Does the TMP112BIDRLT support I²C fast-mode plus (1 MHz) operation?
Yes, the TMP112BIDRLT fully supports I²C fast-mode plus operation up to 1 MHz, as confirmed in Section 6.6 of the official datasheet (SBOS473L). Its SDA and SCL pins include integrated Schmitt triggers and spike suppression filters, ensuring robust communication even in electrically noisy industrial environments where the TMP112BIDRLT is deployed.
How many devices can share the same I²C bus with the TMP112BIDRLT?
Up to four TMP112BIDRLT devices can operate on a single I²C bus using the ADD0 pin to configure unique slave addresses (0x48–0x4B). This capability is inherent to the TMP112BIDRLT's hardware design and does not require external address translators or multiplexers - simplifying multi-zone thermal monitoring in systems like rack server motherboards.
What is the shutdown current of the TMP112BIDRLT, and how is it activated?
The TMP112BIDRLT achieves a maximum shutdown current of 0.35 µA, activated by writing '0' to the SD bit (bit 0) in the configuration register. This state disables the ADC and digital core while retaining register contents, allowing rapid wake-up (<11 ms conversion time) upon exit - critical for battery-powered video doorbells using the TMP112BIDRLT.
Is the TMP112BIDRLT NIST-traceable, and what does that mean for system calibration?
Yes, every TMP112BIDRLT production unit is 100% tested against NIST-traceable reference sensors using ISO/IEC 17025-accredited equipment. This means system integrators can rely on factory-calibrated accuracy without performing end-of-line thermal calibration - reducing test time and cost in high-volume manufacturing of devices such as industrial PCs and SSDs using the TMP112BIDRLT.
TMP112BIDRLT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- 2-Wire Serial, I2C/SMBUS
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 12 b
- Features:
- -
- Accuracy - Highest (Lowest):
- ±0.5°C (±1°C)
- Test Condition:
- 0°C ~ 65°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- SOT-5X3
TMP112BIDRLT FAQ
1.How can I place an order for TMP112BIDRLT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP112BIDRLT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP112BIDRLT reliable?
The price and inventory of TMP112BIDRLT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP112BIDRLT is usually 5 days.
3.What payment methods are accepted for TMP112BIDRLT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP112BIDRLT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP112BIDRLT?
TMP112BIDRLT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP112BIDRLT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP112BIDRLT?
For technical support, including TMP112BIDRLT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP112BIDRLT requirements.
6.How does Aetrix verify that TMP112BIDRLT is sourced from the original manufacturer or authorized distributors?
All TMP112BIDRLT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP112BIDRLT meets industry standards.
7.What is the process for return or replacement of TMP112BIDRLT?
All TMP112BIDRLT units undergo pre-shipment inspection (PSI). If there is an issue with TMP112BIDRLT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP112BIDRLT part is unused and in its original packaging.
Return procedure for TMP112BIDRLT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMP112BIDRLT Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
