Texas Instruments TMP121AIDBVT
- Part No.:
- TMP121AIDBVT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- SOT-23-6
- Datasheet:
-
TMP121AIDBVT.pdf
- Description:
- SENSOR DIGITAL -40C-125C SOT23-6
- Quantity:
- Payment:

- Shipping:

Inventory:672
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMP121AIDBVT from Texas Instruments is a 12-bit + sign SPI-compatible digital temperature sensor in SOT23-6 package, delivering ±1.5°C accuracy from −25°C to +85°C, 0.0625°C resolution, and operation up to +150°C. It serves as a self-contained thermal sensing node for battery management, notebook thermal protection, and power-supply monitoring without external components.
For engineers reviewing the TMP121AIDBVT datasheet, TMP121AIDBVT pinout, TMP121AIDBVT application, or TMP121AIDBVT equivalent, key selection criteria include SPI interface compatibility, shutdown current ≤1 µA, supply range 2.7V–5.5V, SOT23-6 footprint constraints, and thermal accuracy over extended industrial temperature ranges.
Technical Context
The TMP121AIDBVT integrates a diode-based temperature sensor, delta-sigma ADC, on-chip oscillator, and SPI-compatible serial interface with configurable control logic. Its temperature register outputs 16-bit two's complement data (12-bit + sign), with D1–D0 in high-impedance state and conversion time of 240–320 ms at 12-bit resolution.
It operates in continuous conversion mode while CS is high, enters analog shutdown when CS is pulled low (quiescent current drops to ≤1 µA), and latches the last completed conversion result for readout. Thermal sensing relies on the die flag thermally coupled to pin 2 (GND), making GND the primary thermal path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 12-bit + sign, 0.0625°C step - enables precise thermal threshold detection in battery and CPU thermal management. |
| Accuracy | ±1.5°C max from −25°C to +85°C - meets requirements for notebook and peripheral thermal protection without calibration. |
| Supply Range | 2.7V to 5.5V - supports direct integration into 3.3V and 5V systems without LDO overhead. |
| Quiescent Current | 35–50 µA (active), ≤1 µA (shutdown) - extends battery life in portable devices during idle periods. |
| Operating Temp | −55°C to +150°C - enables use in under-hood automotive power modules and industrial motor drives. |
| Conversion Time | 240–320 ms (12-bit) - balances measurement latency and power consumption for periodic thermal polling. |
| Interface | SPI-compatible (CS, SCK, SO) - simplifies host MCU integration using standard SPI peripherals without custom drivers. |
Pinout & Package
SOT23-6 package (DBV), 2.9 mm × 1.6 mm × 1.45 mm, RoHS-compliant, moisture sensitivity level 2 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (NC) | No Connection | Must be left floating or tied to GND; no internal connection - avoids unintended coupling or leakage paths. |
| 2 (GND) | Ground / Thermal Reference | Primary thermal conduction path; die flag bonded to this pin - critical for accurate ambient/surface temperature measurement. |
| 3 (V+) | Power Supply | Accepts 2.7V–5.5V; requires 0.1 µF bypass capacitor - ensures stable ADC and oscillator operation across supply range. |
| 4 (SO) | Serial Output | Three-state SPI data output (MSB-first, two's complement); VOL = 0.4V @ 3mA - compatible with 3.3V/5V logic families. |
| 5 (CS) | Chip Select | Active-low enable; initiates shutdown and latches conversion result - controls power state and data access timing. |
| 6 (SCK) | Serial Clock | Input clock for SPI readout; min period 100 ns - defines maximum data rate and timing margin for host MCU. |
Key Features
| Feature | Design Value |
|---|---|
| Digital SPI interface | Eliminates need for external ADC or signal conditioning; reduces BOM count and layout area in space-constrained designs. |
| Self-contained thermal sensing | Requires no external components beyond 0.1 µF bypass capacitor - accelerates design-in and improves reliability vs. discrete sensor+ADC solutions. |
| Hardware shutdown mode | Reduces current to ≤1 µA via CS assertion - enables ultra-low-power thermal monitoring in always-on battery applications. |
| Extended temperature operation | Functional from −55°C to +150°C - supports deployment in harsh environments such as automotive engine compartments and industrial inverters. |
| Small SOT23-6 footprint | 2.9 mm × 1.6 mm body size - fits tight PCB real estate in mobile and wearable electronics where thermal sensing must coexist with RF or power circuits. |
Applications
| Power-Supply Thermal Monitoring | Notebook Computer Thermal Protection |
|---|---|
Use Scenario: Real-time temperature tracking of DC-DC converter MOSFETs and inductors in server PSUs and telecom power modules. IC Role / Device Role / Timing Role: Standalone temperature node providing 0.0625°C-resolution readings every 480–640 ms to trigger fan control or OCP shutdown. Use Value: Prevents thermal runaway by detecting localized hotspots before silicon junction limits are exceeded. | Use Scenario: Monitoring CPU/GPU VRM and battery pack temperature in ultrabooks and 2-in-1 laptops. IC Role / Device Role / Timing Role: SPI-connected thermal sensor feeding data to EC or PMIC for dynamic throttling and charge rate adjustment. Use Value: Enables adaptive thermal management that maintains performance while extending battery cycle life and user comfort. |
| Cell Phone Battery Management | Office Machine Thermal Safety |
Use Scenario: Integration into smartphone battery fuel gauge subsystems to monitor Li-ion cell temperature during fast charging. IC Role / Device Role / Timing Role: Low-quiescent-current sensor (≤50 µA active, ≤1 µA shutdown) reporting to battery management IC via shared SPI bus. Use Value: Ensures JEITA-compliant charge profiles by detecting temperature excursions that could cause dendrite growth or thermal runaway. | Use Scenario: Thermal cutoff sensing in laser printer fuser assemblies and copier paper path heaters. IC Role / Device Role / Timing Role: Independent safety monitor interfacing with microcontroller to disable heater if >125°C is detected. Use Value: Provides redundant thermal protection meeting IEC 60950-1 requirements without relying solely on mechanical thermostats. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP123AIDBVT | Identical pinout and SPI interface; NC pin at position 2 instead of GND - requires board-level GND tie for thermal accuracy. | Same operating range (−55°C to +150°C) but specified accuracy ±2.0°C over −40°C to +125°C vs. TMP121AIDBVT's ±1.5°C over −25°C to +85°C. | Select TMP123AIDBVT only if NC pin routing flexibility is needed and wider accuracy tolerance is acceptable. |
| MCP9808-E/MS | I²C interface (not SPI); 12-bit resolution; ±0.25°C typical accuracy; 1.7V–5.5V supply - higher precision but incompatible bus protocol. | Supports SMBus alert output and user-configurable resolution modes; lacks hardware shutdown - requires software-controlled sleep states. | Choose MCP9808-E/MS when I²C infrastructure exists and sub-degree accuracy is required, but avoid if SPI-only host MCU or ultra-low shutdown current is mandatory. |
Compared with TMP121AIDBVT, TMP123AIDBVT offers identical packaging and thermal range but trades tighter accuracy for pin configuration flexibility, while MCP9808-E/MS delivers superior precision and feature set at the cost of interface incompatibility and higher minimum supply voltage headroom.
Availability
TMP121AIDBVT is available at Aetrix Electronics and suitable for power-supply thermal monitoring, notebook computer thermal protection, and cell phone battery management requiring stable component supply across production lifecycles.
Supply support for TMP121AIDBVT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in precision sensing and low-power design.
The TMP121 product line was developed for compact, low-power thermal monitoring in portable and space-constrained electronics, emphasizing SPI simplicity, minimal external components, and extended temperature capability.
FAQ
What is the absolute maximum supply voltage for the TMP121AIDBVT?
The TMP121AIDBVT has an absolute maximum supply voltage (V+) of 7 V. Exceeding this rating may cause permanent damage. For reliable operation, the device must be powered within its specified operating range of 2.7 V to 5.5 V, as confirmed in the Electrical Characteristics table of the SBOS273C datasheet.
Does the TMP121AIDBVT require external components to function?
No, the TMP121AIDBVT requires no external components for basic operation. A 0.1 µF supply bypass capacitor is recommended but not mandatory for stable performance. Unlike analog sensors, it integrates the temperature transducer, delta-sigma ADC, oscillator, and SPI interface on-die - enabling drop-in thermal sensing in the TMP121AIDBVT design.
How does the TMP121AIDBVT enter shutdown mode and what is its shutdown current?
The TMP121AIDBVT enters analog shutdown mode when the CS pin is pulled low, terminating ongoing conversions and reducing quiescent current to ≤1 µA. This hardware-controlled state is distinct from idle mode (20 µA) and is explicitly characterized in the Electrical Characteristics table - a key advantage of the TMP121AIDBVT for battery-powered applications.
What is the thermal sensing mechanism used in the TMP121AIDBVT?
The TMP121AIDBVT uses an on-die p-n junction diode as its temperature-sensing element, with the die flag of the lead frame thermally connected to pin 2 (GND). This makes the GND pin the dominant thermal conduction path - a design feature confirmed in the Applications Information section and critical to achieving the specified ±1.5°C accuracy in the TMP121AIDBVT.
Can the TMP121AIDBVT measure temperatures below −40°C or above +125°C?
Yes - while the TMP121AIDBVT is specified for accuracy over −40°C to +125°C, its operating range extends to −55°C to +150°C per Absolute Maximum Ratings. At extremes beyond the specified range, accuracy degrades to ±1.5°C (e.g., at +150°C), but functionality remains intact, making the TMP121AIDBVT suitable for high-stress industrial and automotive under-hood applications.
TMP121AIDBVT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- SOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 2.7V ~ 5.5V
- Resolution:
- 12 b
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1.5°C (±2°C)
- Test Condition:
- -25°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- SOT-23-6
TMP121AIDBVT FAQ
1.How can I place an order for TMP121AIDBVT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP121AIDBVT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP121AIDBVT reliable?
The price and inventory of TMP121AIDBVT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP121AIDBVT is usually 5 days.
3.What payment methods are accepted for TMP121AIDBVT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP121AIDBVT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP121AIDBVT?
TMP121AIDBVT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP121AIDBVT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP121AIDBVT?
For technical support, including TMP121AIDBVT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP121AIDBVT requirements.
6.How does Aetrix verify that TMP121AIDBVT is sourced from the original manufacturer or authorized distributors?
All TMP121AIDBVT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP121AIDBVT meets industry standards.
7.What is the process for return or replacement of TMP121AIDBVT?
All TMP121AIDBVT units undergo pre-shipment inspection (PSI). If there is an issue with TMP121AIDBVT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP121AIDBVT part is unused and in its original packaging.
Return procedure for TMP121AIDBVT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMP121AIDBVT Tags

-
MCP9700T-E/TT
Microchip Technology

-
MCP9700T-E/LT
Microchip Technology

-
MCP9701T-E/TT
Microchip Technology

-
MCP9701T-E/LT
Microchip Technology

-
TMP235A4DBZR
Texas Instruments

-
MCP9700AT-E/TT
Microchip Technology

-
MCP9700AT-E/LT
Microchip Technology

-
MCP9701AT-E/LT
Microchip Technology

-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

