My Inquiry
My Account
Texas Instruments TMP123AIDBVR
- Part No.:
- TMP123AIDBVR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- SOT-23-6
- Datasheet:
-
TMP123AIDBVR.pdf
- Description:
- SENSOR DIGITAL -40C-125C SOT23-6
- Quantity:
- Payment:
- Shipping:
Inventory:2,667
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMP123AIDBVR from Texas Instruments is a 12-bit + sign SPI-compatible digital temperature sensor in SOT23-6 package, delivering ±1.5°C accuracy from −25°C to +85°C, 0.0625°C resolution, and operation up to +150°C - used for thermal protection in notebook computers, battery management, and power-supply monitoring.
For engineers reviewing the TMP123AIDBVR datasheet, TMP123AIDBVR pinout, TMP123AIDBVR application, or TMP123AIDBVR equivalent, this page delivers verified electrical specs, thermal performance boundaries, SPI timing constraints, package thermal path details, and validated alternative options for thermal sensing in space-constrained, low-power embedded systems.
Technical Context
The TMP123AIDBVR integrates a diode-based temperature sensor, delta-sigma A/D converter, oscillator, control logic, and SPI-compatible serial interface - all on a single die with no external components required. Its temperature register outputs 16-bit two's complement data (12-bit + sign), with D1–D0 in high-impedance state and conversion period fixed at 480–640 ms.
Unlike the TMP121, the TMP123 uses pin 2 as NC (not GND), altering thermal coupling: the die flag connects thermally to pin 2 (NC) rather than pin 2 (GND), requiring careful PCB layout to avoid ambient air conduction errors. Shutdown current is 0.1–3 µA, and analog shutdown activates on CS low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 12-bit + sign (0.0625°C step); enables precise thermal threshold detection without interpolation. |
| Accuracy | ±1.5°C max over −25°C to +85°C; defines worst-case error margin for thermal trip point design. |
| Supply Range | 2.7V to 5.5V; supports direct connection to common logic rails (3.3V/5V) without regulation. |
| Quiescent Current | 35–50 µA (serial bus inactive); enables multi-year battery life in portable thermal monitors. |
| Operating Temp | −55°C to +150°C; allows placement near hot ICs or in under-hood automotive subsystems. |
| Conversion Period | 480–640 ms; sets minimum interval between valid temperature reads for thermal response planning. |
| Interface | SPI-compatible (CS/SCK/SO); interoperates with standard microcontroller SPI peripherals without protocol translation. |
Pinout & Package
SOT23-6 package (DBV), 1.45 mm max height, RoHS-compliant, moisture sensitivity level 2 (260°C reflow). Thermal path optimized via NC (pin 2) and GND (pin 1) leads - pin 2 is thermally connected to die flag and must be left floating or tied to GND per datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | GND | Ground reference and secondary thermal path; required for stable ADC reference and noise immunity. |
| 2 | NC | No connection - thermally coupled to die flag; must float or connect to GND to maintain thermal accuracy. |
| 3 | V+ | Power supply input (2.7–5.5V); bypass capacitor (0.1 µF) recommended adjacent to pin for noise suppression. |
| 4 | SO | Serial output - SPI MISO; drives temperature data MSB-first on falling SCK edge with 30 ns delay. |
| 5 | CS | Chip select - active-low; initiates analog shutdown and latches last conversion result into shift register. |
| 6 | SCK | Serial clock input - SPI SCLK; controls data rate; min period 100 ns; timing-critical for reliable readout. |
Key Features
| Feature | Design Value |
|---|---|
| Self-contained sensing | No external components needed - die temperature directly measured; eliminates calibration drift from external thermistors. |
| Low-power operation | 50 µA max active current + 0.1–3 µA shutdown - enables always-on thermal monitoring in energy-sensitive devices. |
| SPI-native interface | Direct compatibility with MCU SPI hardware - no bit-banging or custom firmware drivers required. |
| Extended temperature range | Operation to +150°C - suitable for proximity sensing near power MOSFETs, DC-DC converters, or motor drivers. |
| High-resolution output | 0.0625°C quantization - supports fine-grained thermal profiling for fan speed control or battery charge termination. |
Applications
| Power-Supply Thermal Monitoring | Notebook Computer Thermal Protection |
|---|---|
Use Scenario: Real-time temperature tracking of VRM, LDO, or PMIC die during load transients. IC Role / Device Role / Timing Role: Primary thermal sensor feeding closed-loop thermal throttling logic in system controller. Use Value: ±1.5°C accuracy ensures safe junction temperature margins; 480 ms conversion period aligns with typical power stage thermal time constants. | Use Scenario: CPU/GPU hotspot monitoring and fan speed modulation in ultra-thin clamshell designs. IC Role / Device Role / Timing Role: Localized die-temperature proxy mounted on motherboard near processor BGA. Use Value: SOT23-6 footprint minimizes board area; 0.0625°C resolution enables smooth PWM fan ramping without audible stepping. |
| Battery Pack Temperature Sensing | Office Machine Thermal Safety |
Use Scenario: Cell-level temperature acquisition in Li-ion battery packs for charge/discharge cutoff and aging compensation. IC Role / Device Role / Timing Role: Standalone temperature node interfaced to battery fuel gauge MCU via SPI. Use Value: 2.7–5.5V supply range matches battery voltage swing; −55°C to +150°C range covers cold-weather startup and fast-charge heating. | Use Scenario: Fuser assembly temperature supervision in laser printers to prevent paper jams or component damage. IC Role / Device Role / Timing Role: High-temp-rated sensor placed on fuser roller housing for real-time thermal feedback. Use Value: +150°C operation withstands sustained fuser temperatures; NC pin (pin 2) thermal coupling enables accurate surface measurement when mounted with thermal epoxy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP121AIDBVR | GND on pin 2 (not NC); ±0.5°C typ accuracy over −25°C to +85°C; identical conversion period and SPI interface. | Preferred where GND-referenced thermal mounting simplifies layout; slightly tighter accuracy spec but same package and pinout. | Select TMP121AIDBVR if ground-plane thermal coupling is preferred and tighter typical accuracy is required. |
| MAX31820MUA+ | 1-Wire interface (not SPI); 12-bit resolution; ±0.5°C accuracy; TO-92 package; requires pull-up resistor. | Suitable for low-pin-count microcontrollers lacking SPI; not drop-in compatible due to interface and package mismatch. | Choose MAX31820MUA+ only when 1-Wire infrastructure exists and board space permits TO-92 mounting. |
Compared with TMP121AIDBVR, the TMP123AIDBVR trades GND-connected thermal path for NC flexibility and maintains identical timing and resolution - while MAX31820MUA+ offers better accuracy but demands interface redesign and larger footprint.
Availability
TMP123AIDBVR is available at Aetrix Electronics and suitable for notebook computer thermal protection, battery management systems, and power-supply temperature monitoring requiring stable component supply across production lifecycles.
Supply support for TMP123AIDBVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies since 1930.
The TMP12x series was designed specifically for low-power, high-accuracy local temperature sensing in space-constrained consumer and computing applications - prioritizing integration, minimal external components, and SPI interoperability.
FAQ
What is the maximum operating temperature of the TMP123AIDBVR?
The TMP123AIDBVR operates from −55°C to +150°C, with full specification over −40°C to +125°C. Its ability to function continuously at +150°C makes it suitable for placement near high-heat sources like power converters or motor drivers - confirmed in Absolute Maximum Ratings and Typical Characteristics sections of SBOS273C.
Does the TMP123AIDBVR require external components to operate?
No, the TMP123AIDBVR requires no external components for basic operation. A 0.1 µF supply bypass capacitor is recommended at the V+ pin for noise suppression, but no resistors, capacitors, or calibration elements are needed - as stated in the Applications Information section and verified in Figure 1 of SBOS273C.
How does the TMP123AIDBVR differ from the TMP121AIDBVR in pin configuration?
The TMP123AIDBVR uses pin 2 as NC (no connection), whereas the TMP121AIDBVR uses pin 2 as GND. This changes the primary thermal path: in the TMP123AIDBVR, the die flag connects thermally to pin 2 (NC), requiring it to float or tie to GND - a critical distinction documented in Pin Configurations and Applications Information of SBOS273C.
What is the SPI timing behavior of the TMP123AIDBVR during a temperature read?
When CS goes low, the TMP123AIDBVR terminates ongoing conversion, enters analog shutdown (1 µA), latches the last completed result, and clocks out 16-bit two's complement data MSB-first on SO at falling SCK edges. t2 (SCK falling to SO valid) is 30 ns max, and t4 (CS low to SO valid) is 30 ns max - per Table 3 and Figure 4 in SBOS273C.
Can the TMP123AIDBVR be used in battery-powered IoT sensors?
Yes - the TMP123AIDBVR draws only 35–50 µA during active conversion and 0.1–3 µA in shutdown, enabling multi-year operation on coin cells. Its 2.7–5.5V supply range supports direct connection to common battery chemistries (e.g., 3× alkaline or Li-SOCl₂), and its 480–640 ms conversion period allows duty-cycled wake-up strategies - all verified in Electrical Characteristics and Typical Characteristics sections.
TMP123AIDBVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- SOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 2.7V ~ 5.5V
- Resolution:
- 12 b
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1.5°C (±2°C)
- Test Condition:
- -25°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- SOT-23-6
TMP123AIDBVR FAQ
1.How can I place an order for TMP123AIDBVR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP123AIDBVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP123AIDBVR reliable?
The price and inventory of TMP123AIDBVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP123AIDBVR is usually 5 days.
3.What payment methods are accepted for TMP123AIDBVR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP123AIDBVR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP123AIDBVR?
TMP123AIDBVR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP123AIDBVR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP123AIDBVR?
For technical support, including TMP123AIDBVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP123AIDBVR requirements.
6.How does Aetrix verify that TMP123AIDBVR is sourced from the original manufacturer or authorized distributors?
All TMP123AIDBVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP123AIDBVR meets industry standards.
7.What is the process for return or replacement of TMP123AIDBVR?
All TMP123AIDBVR units undergo pre-shipment inspection (PSI). If there is an issue with TMP123AIDBVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP123AIDBVR part is unused and in its original packaging.
Return procedure for TMP123AIDBVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMP123AIDBVR Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
