Texas Instruments TMP144YBKR

Overview

TMP144YBKR from Texas Instruments is a low-power, 12-bit digital temperature sensor with SMAART Wire™/UART interface in a 4-ball DSBGA (YBK) package measuring 0.76 mm × 0.96 mm × 310 µm. It delivers ±1°C accuracy from –10°C to +100°C, 0.0625°C resolution, and operates from 1.4 V to 3.6 V supply. Its daisy-chain capability supports up to 16 devices on one bus-ideal for multi-zone thermal monitoring in space-constrained mobile electronics.

For engineers reviewing the TMP144YBKR datasheet, TMP144YBKR pinout, TMP144YBKR application, or TMP144YBKR equivalent, key selection criteria include its ultra-low 3-μA active current at 0.25 Hz sampling, push-pull TX output, MDA-enabled global bus commands, and YBK package's 310-µm height for under-component placement in smartphones and tablets.

Technical Context

The TMP144YBKR implements a proprietary SMAART Wire™ interface-a UART-compatible, two-wire (RX/TX), LSB-first protocol with built-in 28-ms timeout recovery and baud-rate calibration via 0x55 byte. It supports both daisy-chain transparent mode and individually addressable operation after position-based initialization.

Its functional modes include One-Shot (26 ms conversion), Continuous (configurable 0.125–4 s period), Shutdown (0.6 μA), and Extended Temperature Mode (13-bit output, 255.9°C max). The internal thermal BJT sensor feeds a 12-bit ADC, with register-mapped configuration, alert flags (FH/FL), and interrupt-on-bus-low capability triggered by limit violations.

Key Specifications

Pinout & Package

Package: 4-ball DSBGA (YBK), 0.76 mm × 0.96 mm footprint, 310 µm maximum height - optimized for placement under heat-dissipating components to improve thermal response and accuracy.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Compared with MAX31875R12+T and STTS22HTR, the TMP144YBKR uniquely combines daisy-chain topology, MDA command efficiency, 310-µm YBK packaging, and full industrial temperature range - making it the only option supporting high-density, low-profile, multi-sensor thermal networks without bus arbitration or layout rework.

Availability

TMP144YBKR is available at Aetrix Electronics and suitable for smartphone thermal management, LED backlight compensation, and enterprise server DIMM monitoring requiring stable component supply, long-lifecycle assurance, and wafer-level packaging consistency.

Supply support for TMP144YBKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision sensing and low-power design.

The TMP144 product line was engineered specifically for ultra-compact, multi-node thermal profiling in mobile and computing systems - prioritizing daisy-chain scalability, sub-1-μA power budgets, and wafer-level packaging for direct thermal coupling.

FAQ

What is the pin configuration and package type of the TMP144YBKR?

The TMP144YBKR uses a 4-ball DSBGA (YBK) package with 0.76 mm × 0.96 mm footprint and maximum height of 310 µm. Its pins are V+ (A1), GND (A2), RX (B2), and TX (B1) - configured as power input, ground, serial input, and push-pull serial output respectively. This layout supports high-density placement under thermally active components, and the pinout is identical across all TMP144 variants including TMP144YBKR.

Does the TMP144YBKR support daisy-chaining, and how many devices can be connected?

Yes, the TMP144YBKR supports true daisy-chain configuration using its SMAART Wire™/UART interface, allowing up to 16 devices on a single RX/TX bus. Each device auto-assigns a unique address during initialization based on physical position in the chain, and the host communicates bidirectionally through the first and last nodes. This eliminates I²C address conflicts and reduces routing complexity - a core capability confirmed for TMP144YBKR in TI's SBOS891C datasheet.

What is the temperature accuracy and operating range of the TMP144YBKR?

The TMP144YBKR is specified for ±1.0°C accuracy over –10°C to +100°C and ±2.0°C over its full operating range of –40°C to +125°C. These values are measured under recommended conditions (V+ = 1.4–3.6 V, free-air ambient), and the sensor achieves 0.0625°C resolution via its 12-bit output (extendable to 13-bit). Accuracy is maintained across all three DSBGA packages, including the YBK variant used in TMP144YBKR.

How does the Multiple Device Access (MDA) feature work on the TMP144YBKR?

The MDA feature in TMP144YBKR enables global read/write operations across all daisy-chained devices using single broadcast commands - such as global software reset, global initialization, or global clear interrupt - instead of addressing each unit individually. This cuts communication time and host processing load significantly. MDA is integral to the SMAART Wire™ protocol and fully supported in TMP144YBKR, as documented in TI's command flow diagrams and register map (SBOS891C Sections 7.3.1 and 7.5.1).

What power-saving modes does the TMP144YBKR offer, and what are their current draws?

The TMP144YBKR offers three low-power states: Continuous Conversion (3 μA avg at 0.25 Hz), One-Shot (3 μA active during 26-ms conversion, then auto-returns to shutdown), and Shutdown (0.6 μA typical). All modes operate across 1.4–3.6 V supply. These values are measured per SBOS891C Section 6.5 and apply identically to TMP144YBKR, whose YBK package exhibits thermal characteristics aligned with the datasheet's specified IDD_AVG and IDD_SD performance.