Texas Instruments TMP144YFFR

Overview

TMP144YFFR from Texas Instruments is a low-power, 12-bit digital temperature sensor with SMAART Wire™/UART interface in a 4-ball DSBGA (YFF) package measuring 0.76 mm × 0.96 mm × 625 µm. It delivers ±1°C accuracy from –10°C to +100°C, 0.0625°C resolution, and operates from 1.4 V to 3.6 V supply. Designed for multi-zone thermal monitoring in space-constrained mobile devices, it supports daisy-chain configurations of up to 16 units on a single bus.

For engineers reviewing the TMP144YFFR datasheet, TMP144YFFR pinout, TMP144YFFR application, or TMP144YFFR equivalent, key selection considerations include its ultra-low 3-μA active current at 0.25 Hz sampling, push-pull TX output, MDA (Multiple Device Access) command support, and YFF-package thermal profile optimized for under-component placement in smartphones and tablets.

Technical Context

The TMP144YFFR implements a proprietary SMAART Wire™ interface - UART-compatible but requiring calibration byte (0x55) synchronization - enabling daisy-chained topologies where RX input propagates to TX output unless interrupted by device-initiated data transmission or interrupt assertion. Its functional modes include One-Shot (26 ms conversion), Continuous (configurable 0.125–4 s period), Shutdown (0.6 μA), and Extended Temperature Mode (13-bit output, 255.9°C max).

Thermal sensing relies on the die itself, with dominant heat paths through solder bumps and package top surface due to low height (625 µm) and metal-rich construction. The YFF package's RθJB = 60 °C/W and ψJB = 60 °C/W indicate strong board-coupled thermal response, making it suitable for surface-temperature measurement when thermally bonded - not ambient air sensing.

Key Specifications

Pinout & Package

Package: 4-ball DSBGA (YFF), 0.76 mm × 0.96 mm footprint, 625 µm maximum height, ball pitch 0.4 mm. Compatible with standard SMT reflow profiles; bottom-side thermal path optimized for PCB conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Compared with MAX31875Y+T and STTS751-2DMR, the TMP144YFFR uniquely combines ultra-small YFF DSBGA packaging, true daisy-chain scalability, and MDA command efficiency - delivering 73% lower interconnect density and 91% lower average bus latency in 8-sensor thermal arrays.

Availability

TMP144YFFR is available at Aetrix Electronics and suitable for smartphone thermal management, LED backlight derating, and medical wearable temperature tracking requiring stable component supply, long-term lifecycle assurance, and wafer-level traceability.

Supply support for TMP144YFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in precision sensing and low-power design.

The TMP144 product line targets space- and power-constrained thermal monitoring in consumer electronics, delivering daisy-chainable, MDA-enabled digital temperature sensing with sub-millimeter WCSP packaging and industry-leading 0.6 μA shutdown current.

FAQ

What is the maximum number of TMP144YFFR devices supported in a daisy-chain configuration?

The TMP144YFFR supports up to 16 devices in a single daisy-chain topology. Each device passes RX input to TX output in transparent mode, forming a closed loop with the host. This architecture eliminates address conflicts and enables synchronized global commands via Multiple Device Access (MDA), reducing bus overhead significantly compared to individually addressed sensors.

Does the TMP144YFFR require external pull-up resistors on its TX/RX lines?

No, the TMP144YFFR does not require external pull-up resistors. Its TX pin features a push-pull output stage capable of driving directly to V+ or GND, and the RX pin is a high-impedance CMOS input. This simplifies layout and eliminates BOM cost and reliability risk associated with discrete pull-ups - confirmed in Section 5 and Figure 5-1 of the SBOS891C datasheet.

How does the YFF package height impact thermal measurement accuracy in the TMP144YFFR?

The YFF package's 625 µm maximum height enhances thermal coupling to the PCB and adjacent components, yielding RθJB = 60 °C/W. When mounted under heat-dissipating ICs with thermally conductive adhesive, this enables faster thermal response (<1.2 s to 90% step) and improved surface-temperature fidelity versus taller packages - critical for accurate SoC junction estimation in smartphones.

Can the TMP144YFFR operate reliably at 1.4 V supply voltage?

Yes, the TMP144YFFR is fully specified from 1.4 V to 3.6 V. At 1.4 V, it maintains ±2.0°C accuracy across –40°C to +125°C, 12-bit resolution, and 26 ms conversion time. Quiescent current remains at 3 μA (0.25 Hz), and interface timing complies with UART baud rates down to 4.8 kbps - verified in Sections 6.3 and 6.5 of SBOS891C.

What is the function of the ETM bit in the TMP144YFFR configuration register?

The ETM (Extended Temperature Mode) bit configures the TMP144YFFR to output 13-bit temperature data (0.0625°C LSB, range –40°C to +255.9°C) and enables EM bits in limit registers. When ETM = 1, THIGH/TLOW values must be doubled to preserve temperature thresholds; exiting ETM mode without updating registers halves the effective limit - a behavior explicitly documented in Section 7.4.4 of SBOS891C.