Texas Instruments TMP144YMTT
- Part No.:
- TMP144YMTT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 4-XFBGA, DSBGA
- Datasheet:
-
TMP144YMTT.pdf
- Description:
- IC POWER
- Quantity:
- Payment:

- Shipping:

Inventory:1,498
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Product details
Overview
TMP144YMTT from Texas Instruments is a low-power, 12-bit digital temperature sensor with SMAART Wire™/UART interface in a 4-ball, 0.76 mm × 0.96 mm DSBGA package (YMT variant, 150 µm max height). It delivers ±1°C accuracy from –10°C to +100°C, 0.0625°C resolution, and operates from 1.4 V to 3.6 V supply. Designed for space-constrained thermal monitoring in mobile devices, it supports daisy-chain configurations of up to 16 units with Multiple Device Access (MDA) commands.
For engineers reviewing the TMP144YMTT datasheet, TMP144YMTT pinout, TMP144YMTT application, or TMP144YMTT equivalent, key selection considerations include its ultra-thin YMT package for under-heat-sink placement, 3-μA active quiescent current at 0.25 Hz conversion rate, push-pull TX output, and global command support for multi-sensor bus efficiency.
Technical Context
The TMP144YMTT implements a proprietary SMAART Wire™ interface - UART-compatible, single-wire half-duplex protocol using dedicated RX (input) and TX (push-pull output) pins. It supports both daisy-chain topology (serial loop with up to 16 devices) and transparent mode where input propagates directly to next device.
Its functional architecture includes MDA command execution (global read/write), programmable conversion rates (0.125 s to 4 s), extended temperature mode (13-bit output, up to 255.9°C), and interrupt-driven alerting via bus hold-low. Thermal sensing uses on-die BJT circuitry with dominant top-side thermal path enabled by the 150-µm YMT package's low height and metal bumps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 12-bit (0.0625°C LSB); configurable to 13-bit for extended range up to 255.9°C |
| Accuracy | ±1.0°C over –10°C to +100°C; ±2.0°C over full –40°C to +125°C operating range |
| Supply Range | 1.4 V to 3.6 V - enables direct integration with 1.8 V and 3.3 V logic domains |
| Quiescent Current | 3 μA at 0.25 Hz conversion rate - optimized for battery-powered thermal polling |
| Shutdown Current | 0.6 μA - preserves system-level power budget during idle periods |
| Conversion Time | 26 ms typical one-shot conversion - supports >30 conversions/sec in burst mode |
| Interface | SMAART Wire™/UART (8N1), 4.8–114 kbps baud - no external pull-ups required; built-in timeout recovery |
Pinout & Package
The TMP144YMTT is housed in a 4-ball, wafer-level chip-scale package (DSBGA) with 0.76 mm × 0.96 mm footprint and maximum 150 µm height (YMT variant). This ultra-thin profile allows placement beneath heat-dissipating components for improved thermal response and measurement fidelity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| V+ | Power supply input | Accepts 1.4 V–3.6 V; includes internal POR at 0.9 V threshold |
| GND | Ground reference | Single ground connection; forms return path for internal analog/digital blocks |
| RX | Serial data input | High-impedance CMOS input; receives calibration byte, commands, and address assignments |
| TX | Serial data output | Push-pull digital output; drives host or next device in daisy chain; no external pull-up needed |
Key Features
| Feature | Design Value |
|---|---|
| Daisy-chain support (up to 16 devices) | Reduces host GPIO count and PCB routing complexity in multi-zone thermal systems |
| Multiple Device Access (MDA) commands | Enables simultaneous global read/write across all devices - cuts bus traffic by ~94% vs. individual addressing |
| Ultra-thin 150 µm YMT package | 40% thinner than 0201 resistor; enables under-heat-sink mounting for faster thermal response and higher accuracy |
| Configurable conversion rate (0.125–4 s) | Allows dynamic trade-off between power consumption and thermal update frequency per system requirement |
| Temperature alert with latch/interrupt modes | Hardware-triggered bus hold-low interrupt eliminates polling overhead and reduces host CPU wake-ups |
Applications
| Smartphone Thermal Management | LED Backlight Thermal Compensation |
|---|---|
Use Scenario: Real-time junction temperature monitoring of AP/SoC and PMIC in high-density smartphone PCBs. IC Role / Device Role / Timing Role: Digital temperature sensor providing 0.0625°C-resolution readings via SMAART Wire™ daisy chain to baseband processor. Use Value: Enables dynamic DVFS throttling and prevents thermal shutdown using ±1°C accuracy across –10°C to +100°C ambient range. | Use Scenario: Closed-loop thermal compensation of LED backlight brightness in tablets and HDTVs. IC Role / Device Role / Timing Role: Local temperature node placed near LED driver IC to feed real-time die temperature into backlight controller. Use Value: Maintains consistent luminance and color point by adjusting PWM duty cycle based on 26-ms conversion latency and 3-μA active current draw. |
| Enterprise Server DIMM Monitoring | Medical Wearable Skin-Temperature Sensing |
Use Scenario: Per-module temperature tracking across DDR5 memory modules in rack-mounted servers. IC Role / Device Role / Timing Role: Ultra-small-footprint sensor mounted directly on DIMM PCB, communicating via global MDA commands over shared bus. Use Value: Supports predictive failure analytics with ±2°C accuracy over –40°C to +125°C range and 0.6-μA shutdown current for always-on monitoring. | Use Scenario: Direct skin-contact temperature acquisition in compact wearable health monitors. IC Role / Device Role / Timing Role: Low-profile YMT-packaged sensor thermally bonded to housing surface, interfacing with MCU via UART at 114 kbps. Use Value: Achieves clinical-grade response time via 150-µm height and top-side thermal path - validated against ISO 80601-2-56 thermal accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX31875Y+T | 2-wire I²C interface; 16-bit resolution; ±0.25°C accuracy (–40°C to +125°C); 0.7 mm × 0.7 mm 4-bump WLP | Requires separate I²C bus lines; lacks daisy-chain or MDA capability; higher accuracy but larger minimum trace spacing | Preferred when I²C infrastructure exists and highest accuracy is prioritized over bus efficiency |
| STTS22HTR | I²C interface; 12-bit resolution; ±0.5°C accuracy (–20°C to +85°C); 1.0 mm × 1.0 mm 4-bump DFN | Narrower temperature range; no multi-device bus optimization; taller 350 µm package limits under-component placement | Selected for cost-sensitive consumer electronics where full –40°C to +125°C range and ultra-thin profile are not required |
Compared with MAX31875Y+T and STTS22HTR, the TMP144YMTT uniquely combines daisy-chain scalability, MDA command efficiency, and 150-µm YMT packaging - making it optimal for space- and power-constrained multi-sensor thermal architectures where bus pin count and thermal response time are critical.
Availability
TMP144YMTT is available at Aetrix Electronics and suitable for smartphone thermal management, LED backlight compensation, enterprise server DIMM monitoring, medical wearable sensing, and HDTV thermal profiling requiring stable component supply and long-term lifecycle support.
Supply support for TMP144YMTT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in precision sensing and low-power design.
The TMP144 product line was developed specifically for ultra-compact, multi-node thermal monitoring in mobile and computing platforms - emphasizing minimal PCB area, sub-1-μA shutdown current, and intelligent bus protocols for scalable sensor networks.
FAQ
What is the package type and dimensions of the TMP144YMTT?
The TMP144YMTT uses a 4-ball, wafer-level chip-scale package (DSBGA) designated YMT, with nominal dimensions of 0.76 mm × 0.96 mm and a maximum height of 150 µm. This ultra-thin profile is 40% thinner than a standard 0201 resistor and enables placement beneath heat-dissipating components for improved thermal coupling and faster response. The YMT variant is explicitly specified for the TMP144YMTT orderable part number.
Does the TMP144YMTT support daisy-chain configuration, and how many devices can be connected?
Yes, the TMP144YMTT supports daisy-chain topology using its SMAART Wire™/UART interface, allowing up to 16 devices to be connected serially on a single two-wire bus (RX/TX). Each device auto-assigns a unique address during initialization, and the host communicates with the first device, which relays data through the chain. The TMP144YMTT also supports Multiple Device Access (MDA) commands to broadcast reads/writes to all units simultaneously - a capability confirmed in the SBOS891C datasheet revision C.
What is the temperature accuracy and operating range of the TMP144YMTT?
The TMP144YMTT provides ±1.0°C maximum accuracy over the –10°C to +100°C range and ±2.0°C maximum over its full operating range of –40°C to +125°C. These specifications are guaranteed across the recommended supply voltage range (1.4 V to 3.6 V) and are validated per the SBOS891C production data sheet. Accuracy includes effects of self-heating and is measured with the device mounted per JEDEC standards.
How does the TMP144YMTT achieve ultra-low power consumption?
The TMP144YMTT achieves ultra-low power via three key mechanisms: (1) 3 μA typical active quiescent current at 0.25 Hz conversion rate, (2) 0.6 μA shutdown current with full interface retention, and (3) programmable conversion periods (0.125 s to 4 s) that let designers match update frequency to thermal dynamics. Its SMAART Wire™ interface requires no external pull-ups, and the YMT package's low thermal resistance minimizes self-heating-induced current drift - all confirmed in Section 6.5 of the TMP144YMTT datasheet.
Can the TMP144YMTT generate hardware interrupts, and how is it implemented?
Yes, the TMP144YMTT supports hardware interrupt functionality via bus hold-low assertion. When enabled (INT_EN = 1), and a temperature violation occurs (exceeding THIGH or falling below TLOW), the device disconnects the chain and pulls the TX line low until cleared by a Global Interrupt Clear or Software Reset command. This interrupt is latched independently of the LC (latch control) bit and works in both transparent and latch modes - a behavior fully documented in Section 7.4.6 of the SBOS891C datasheet for the TMP144YMTT.
TMP144YMTT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 4-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SMAART Wire, UART
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 12 b
- Features:
- One-Shot, Standby Mode, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1°C (±2°C)
- Test Condition:
- -10°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 4-PICOSTAR (0.76x0.76)
TMP144YMTT FAQ
1.How can I place an order for TMP144YMTT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP144YMTT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP144YMTT reliable?
The price and inventory of TMP144YMTT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP144YMTT is usually 5 days.
3.What payment methods are accepted for TMP144YMTT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP144YMTT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP144YMTT?
TMP144YMTT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP144YMTT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP144YMTT?
For technical support, including TMP144YMTT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP144YMTT requirements.
6.How does Aetrix verify that TMP144YMTT is sourced from the original manufacturer or authorized distributors?
All TMP144YMTT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP144YMTT meets industry standards.
7.What is the process for return or replacement of TMP144YMTT?
All TMP144YMTT units undergo pre-shipment inspection (PSI). If there is an issue with TMP144YMTT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP144YMTT part is unused and in its original packaging.
Return procedure for TMP144YMTT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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