Texas Instruments TMP235EVM

Overview

TMP235EVM from Texas Instruments is an evaluation module designed to test and validate the TMP235 analog temperature sensor in real-world conditions. It features a plug-and-play USB interface, onboard MSP430F5528 microcontroller with 12-bit SAR ADC, dual-channel analog input support (Ch0 for TMP235DCK/SC-70 or TMP235LP/TO-92, Ch1 for optional second sensor), RGB LED ambient temperature indicator, and real-time CSV data logging capability.

For engineers reviewing the TMP235EVM datasheet, TMP235EVM hardware setup, TMP235EVM software configuration, or TMP235EVM firmware update procedure, this page provides verified technical context, key specifications, availability details, manufacturer background, and practical FAQs - all focused on rapid validation of TMP235-based analog temperature sensing systems.

Technical Context

The TMP235EVM implements a two-section PCB architecture: a main USB-powered section hosting the MSP430F5528 MCU, LP2985-3.3V LDO, TPD4E004 ESD protection, and RGB/green LEDs; and a separable breakout section housing the TMP235 sensor. The board supports thermal isolation up to 150°C by physically separating the breakout section.

It uses USB Human Interface Device (HID) class drivers native to Windows 7/10, eliminating custom driver installation. Firmware is preloaded as USB2ANY converter logic on the MSP430F5528, enabling direct analog-to-digital conversion and temperature calculation using first-order equations: T(°C) = (V_ADC − 0.4 V) / 0.0195 V/°C for TMP235.

Key Specifications

Availability

TMP235EVM is available at Aetrix Electronics and suitable for analog temperature sensor validation, embedded system prototyping, and production-ready thermal design verification requiring stable component supply and full documentation traceability.

Supply support for TMP235EVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies with over 90 years of innovation in precision signal conditioning and system-level solutions.

The TMP235EVM belongs to TI's temperature sensor evaluation platform family, engineered specifically to accelerate development of high-accuracy, low-power analog temperature measurement systems across industrial, automotive, and consumer applications.

FAQ

What is the primary function of the TMP235EVM?

The TMP235EVM is an evaluation module that enables rapid testing and characterization of the TMP235 analog temperature sensor. It integrates a USB interface, MSP430F5528 microcontroller, and analog signal chain to provide real-time temperature readings, dual-channel comparison capability, and CSV data export - all without requiring calibration or firmware programming. The TMP235EVM simplifies validation of TMP235 performance under actual operating conditions.

Does the TMP235EVM require custom drivers or software installation?

No, the TMP235EVM uses standard Windows HID-class USB drivers included with Windows 7 and 10, eliminating the need for custom driver installation. Users only need to install the TMP235EVM GUI software from TI's website, which includes LabVIEW 2016 Runtime Engine. Once installed, the TMP235EVM is recognized automatically upon USB connection, and the GUI launches into Evaluation Mode with live temperature streaming.

Can the TMP235EVM evaluate both SC-70 and TO-92 package variants of the TMP235?

Yes, the TMP235EVM supports both TMP235DCK (SC-70-5) and TMP235LP (TO-92-3) packages. The default configuration mounts the SC-70 variant (U4). To evaluate the TO-92 version, users must depopulate U4 or R15 and populate the U5 footprint (J2 header). This flexibility allows direct comparison between package types and thermal response validation in different mechanical environments.

How does the TMP235EVM achieve operation up to 150°C?

The TMP235EVM achieves 150°C operation by leveraging its breakable PCB design: the breakout section containing the TMP235 sensor can be physically separated from the main board (which is rated only to 80°C). This isolates the high-temperature sensor element from heat-sensitive components like the MSP430F5528 and LDO. When separated, the breakout section operates independently with external power and signal routing via J4 header, enabling full validation of the TMP235's specified 150°C maximum junction temperature.

What firmware and software tools are required for the TMP235EVM?

The TMP235EVM ships with preloaded USB2ANY firmware on the MSP430F5528, essential for GUI communication. Required software includes the TMP235EVM GUI installer (containing LabVIEW 2016 Runtime Engine) and optional Python-based Firmware Upgrader GUI for field updates. Firmware files (e.g., USB2ANY_F5528.txt) and schematics are provided in the TI documentation package SBOU190A, ensuring full transparency and reproducibility of the TMP235EVM's operation.