Texas Instruments TMP300BIDCKT

Overview

TMP300BIDCKT from Texas Instruments is a resistor-programmable temperature switch and analog-output temperature sensor in SC70-6 package, featuring ±2°C trip accuracy (–40°C to +125°C), 10 mV/°C analog output, open-drain digital output, 5°C/10°C selectable hysteresis, and 1.8 V to 18 V supply operation - used for overtemperature protection in DC-DC modules and power-supply systems.

For engineers reviewing the TMP300BIDCKT datasheet, TMP300BIDCKT pinout, TMP300BIDCKT application, or TMP300BIDCKT equivalent, key selection considerations include programmable trip point via external RSET, dual hysteresis configuration, analog output usability for thermal compensation or test simulation, and SC70-6 footprint compatibility with space-constrained thermal monitoring designs.

Technical Context

The TMP300BIDCKT implements a comparator-based thermal trip architecture where the TSET pin voltage-set by an external resistor and internal 3 µA bias current-determines the trip threshold. The HYSTSET pin selects between 5°C (GND) or 10°C (V+) hysteresis to prevent oscillation near the trip point.

VTEMP provides a high-impedance (210 kΩ), temperature-proportional analog output (10 mV/°C) usable for system-level temperature measurement or as a simulated input to force digital output toggling during safety circuit validation.

Key Specifications

Pinout & Package

SC70-6 package (DCK), body size 2.00 mm × 1.25 mm, 1.1 mm max height, JEDEC MO-203 AB compliant, lead finish NIPDAU, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature switch and analog sensor applications.

Compared with LMT70AIDSC and TMP235AIDBVR, the TMP300BIDCKT uniquely combines resistor-programmable trip point, selectable hysteresis, open-drain safety output, and calibrated analog output in a single SC70-6 device - enabling both autonomous protection and system-level thermal awareness without external components.

Availability

TMP300BIDCKT is available at Aetrix Electronics and suitable for power-supply systems, DC-DC modules, and electronic protection systems requiring stable component supply and long-term thermal reliability.

Supply support for TMP300BIDCKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision sensing and power management ICs.

The TMP300 product line is designed for thermal safety and monitoring in power-constrained, space-limited systems - delivering programmable overtemperature protection with analog telemetry in micropackages.

FAQ

What is the trip accuracy specification for TMP300BIDCKT over its full temperature range?

The TMP300BIDCKT has a total trip accuracy of ±2°C over the functional temperature range of –40°C to +125°C. This value includes initial accuracy, temperature drift, and hysteresis effects. At +25°C, typical accuracy improves to ±1°C. The specification applies specifically to the TMP300B grade, as confirmed in Section 6.3 of the SBOS335F datasheet.

How do I calculate the RSET resistor value to set a specific trip temperature on TMP300BIDCKT?

Use the equation RSET = 10(50 + TC)/3 kΩ, where TC is the desired trip temperature in °C. For example, to set a 75°C trip point: RSET = 10(50 + 75)/3 = 417 kΩ. The device uses a 3 µA internal bias current through RSET to generate the TSET voltage; this relationship is factory-trimmed for accuracy and documented in Section 7.2.1 of the TMP300BIDCKT datasheet.

Can TMP300BIDCKT operate from a 1.8-V supply while maintaining full temperature range functionality?

Yes, TMP300BIDCKT operates from 1.8 V, but the functional temperature range is limited to –40°C to 100 × (VS – 0.95)°C. At 1.8 V, this yields –40°C to +85°C. Full –40°C to +125°C operation requires VS ≥ 2.35 V. This dependency is explicitly defined in Table 6-3 of the SBOS335F datasheet and verified in electrical characteristics testing.

What is the purpose of the VTEMP pin on TMP300BIDCKT, and how should it be used in circuit design?

The VTEMP pin delivers a high-impedance (210 kΩ), temperature-proportional analog output of 10 mV/°C - usable for real-time thermal telemetry or as a test input to simulate thermal events. To preserve accuracy, avoid direct loading; buffer with an op-amp (e.g., OPA335) if driving ADCs or long traces. Figure 7-2 in the TMP300BIDCKT datasheet shows recommended buffering topology.

Is TMP300BIDCKT pin-compatible with other variants in the TMP300 family, such as TMP300BIDBVR?

Yes, TMP300BIDCKT shares identical pinout and electrical behavior with TMP300BIDBVR - both use the same 6-pin functional mapping (TSET, GND, OUT, HYSTSET, VTEMP, V+). The only difference is package: DCK = SC70-6 (2.00 mm × 1.25 mm), DBV = SOT23-6 (2.90 mm × 1.60 mm). Mechanical layout must accommodate SC70 dimensions, but no schematic or firmware changes are needed when substituting TMP300BIDCKT for TMP300BIDBVR.