Texas Instruments TMP303ADRLR

Overview

TMP303ADRLR from Texas Instruments is a factory-programmed temperature switch with fixed trip window (TL = 0°C, TH = 60°C), ±0.2°C typical accuracy from –40°C to 125°C, 5 μA maximum quiescent current, and push-pull active-high output - used for battery thermal protection and low-power overtemperature detection in space-constrained portable electronics.

For engineers reviewing the TMP303ADRLR datasheet, TMP303ADRLR pinout, TMP303ADRLR application, or TMP303ADRLR equivalent, key selection criteria include factory-set 0°C/60°C trip points, selectable 1/2/5/10°C hysteresis via HYSTSET0/HYSTSET1 pins, 1.4 V to 3.6 V supply operation, SOT-563 micropackage footprint, and SOH test-enabling functionality.

Technical Context

The TMP303ADRLR implements a fully integrated analog temperature sensor core with comparator-based trip decision logic and digital hysteresis control. Its trip thresholds are laser-trimmed at wafer test and permanently fixed per device variant - TMP303ADRLR specifically uses TL = 0°C and TH = 60°C.

Hysteresis is configured by two digital inputs (HYSTSET0, HYSTSET1) tied to GND or VS, selecting discrete windows of 1°C, 2°C, 5°C, or 10°C. The SOH pin provides a dedicated test override that forces OUT high regardless of temperature, using an internal 100-kΩ pulldown resistor.

Key Specifications

Pinout & Package

SOT-563 (DRL) package: 1.60 mm × 1.20 mm × 0.6 mm body size, 6-pin micropackage with exposed pad for thermal coupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature switch applications.

Compared with MAX6505UTP+T and LM75BIMM/NOPB, the TMP303ADRLR delivers superior low-voltage operation (down to 1.4 V), tighter trip accuracy (±0.2°C vs ±2°C), and smaller SOT-563 packaging - making it optimal for space- and power-constrained battery thermal cutoff applications where simplicity and reliability are critical.

Availability

TMP303ADRLR is available at Aetrix Electronics and suitable for battery thermal protection, wireless heat detectors, and portable fan control requiring stable component supply and long-lifecycle availability.

Supply support for TMP303ADRLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and system-on-chip solutions for industrial, automotive, and consumer markets.

The TMP303 product line delivers factory-programmed, ultra-low-power temperature switches optimized for battery-operated thermal safety applications where minimal footprint, zero calibration, and guaranteed trip accuracy are essential.

FAQ

What is the exact trip temperature range programmed into the TMP303ADRLR?

The TMP303ADRLR is factory-programmed with a fixed low trip point (TL) of 0°C and high trip point (TH) of 60°C. This configuration is permanent and cannot be altered in-circuit. The device asserts its active-high OUT signal when temperature rises above 60°C and clears only after falling below (60°C − selected hysteresis), e.g., 59°C for 1°C hysteresis. This trip window is confirmed in TI's SBOS486I datasheet Device Options table.

Does the TMP303ADRLR require any external components to operate?

Yes - the TMP303ADRLR requires only a 0.1 µF ceramic bypass capacitor between VS and GND, placed as close as possible to the device pins. No pull-up resistors, calibration components, or microcontroller intervention are needed. The internal push-pull output drives directly, and hysteresis is set via HYSTSET0/HYSTSET1 pin states. This minimal BOM enables rapid integration into space-constrained designs.

How does the SOH pin function on the TMP303ADRLR?

The SOH (Set Output High) pin on the TMP303ADRLR is a digital input with an internal 100-kΩ pulldown resistor. When pulled high (≥0.7 × VS), it forces the OUT pin to logic high immediately - regardless of measured temperature or hysteresis settings. When grounded or left floating, SOH has no effect on normal operation. This feature enables hardware-level functional testing of the output path without thermal cycling, improving manufacturing test efficiency for the TMP303ADRLR.

What hysteresis values can be selected for the TMP303ADRLR, and how are they configured?

The TMP303ADRLR supports four discrete hysteresis values: 1°C, 2°C, 5°C, or 10°C, selected by connecting HYSTSET0 and HYSTSET1 to either GND or VS per TI's Table 1. For example: both pins GND = 1°C; HYSTSET0 = GND, HYSTSET1 = VS = 2°C; HYSTSET0 = VS, HYSTSET1 = GND = 5°C; both pins VS = 10°C. These configurations are static and define the temperature dead-band around the 0°C/60°C trip window for the TMP303ADRLR.

Is the TMP303ADRLR suitable for automotive under-hood applications?

No - the TMP303ADRLR is specified for operation from –40°C to +125°C, but it is not qualified to AEC-Q200 or automotive-grade reliability standards. Its design targets consumer, enterprise, and industrial applications such as battery packs, wireless sensors, and portable electronics. For under-hood use, TI recommends automotive-qualified alternatives like the TMP1075 or TMP117, which undergo extended temperature stress testing and PPAP documentation. The TMP303ADRLR remains appropriate for cabin-mounted or non-safety-critical automotive subsystems where qualification is not mandated.