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Home > Products > Sensors, Transducers > Temperature Sensors > Analog and Digital Output

Texas Instruments TMP411BDGKT

Name: TMP411BDGKT
Brand: Texas Instruments
SKU: TMP411BDGKT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TMP411BDGKT

Manufacturer:: Texas Instruments

Category:: Analog and Digital Output

Package:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Datasheet:: TMP411BDGKT.pdf

Description:: SENSOR DIGITAL -40C-125C 8VSSOP

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Product details

Overview

TMP411BDGKT from Texas Instruments is a dual-channel ±1°C accurate remote/local temperature sensor IC with I²C/SMBus interface, programmable 9–12-bit resolution, series resistance cancellation, and N-factor correction - designed for precision thermal monitoring in rack server motherboards and FPGA subsystems.

For engineers reviewing the TMP411BDGKT datasheet, TMP411BDGKT pinout, TMP411BDGKT application, or TMP411BDGKT equivalent, this page delivers verified specifications, validated package mapping (VSSOP-8), confirmed SMBus timing compliance, and real-world calibration features including offset registers and diode fault detection.

Technical Context

The TMP411BDGKT integrates a local thermal transistor and supports remote sensing via external diode-connected transistors (e.g., 2N3906 PNP), with dedicated D+ and D− inputs. Its on-chip ADC digitizes both channels using a shared 12-bit conversion engine, while programmable resolution (9–12 bits) and configurable conversion rate (0.0625–8 Hz) enable trade-offs between accuracy and power.

It implements series resistance cancellation logic to compensate for PCB trace resistance up to 3 kΩ, and supports user-defined non-ideality factor (η = 1.008 typical) for improved remote diode modeling across manufacturers. The ALERT/THERM2 pin provides open-drain overtemperature signaling with hysteresis control.

Key Specifications

Parameter	Value and Actual Design Meaning
Local Accuracy	±1°C over –40°C to +125°C ambient; enables direct thermal throttling decisions without system-level calibration.
Remote Accuracy	±1°C over –40°C to +100°C diode temperature; validated for microprocessor/FPGA die-sense applications using standard NPN/PNP transistors.
Supply Range	2.7 V to 5.5 V; compatible with 3.3 V and 5 V system rails without level-shifting.
Interface	I²C/SMBus compliant; supports 3.4 MHz high-speed mode and 25–35 ms timeout - interoperable with standard host controllers.
Resolution	Programmable 9–12 bits (local), fixed 12 bits (remote); 12-bit mode yields 0.0625°C LSB for fine-grained thermal profiling.
Power Consumption	28 µA avg at 0.0625 Hz conversion (3.3 V); enables always-on thermal monitoring in power-constrained embedded systems.
Operating Range	–40°C to +125°C ambient; qualified for industrial and enterprise computing environments.

Pinout & Package

VSSOP-8 package (3.0 mm × 4.9 mm × 1.1 mm), thin-profile surface-mount design optimized for high-density PCB layouts in server and networking equipment.

Pin/Terminal	Circuit Role	Design Meaning
V+	Power supply input	Positive rail (2.7–5.5 V); powers internal regulator, ADC, and digital logic - requires local 0.1 µF decoupling.
D+	Analog remote sensor input	Positive terminal for remote diode/transistor; biased with internal current source (120 µA high range).
D−	Analog remote sensor input	Negative terminal for remote diode/transistor; used with D+ to reject common-mode noise and series resistance error.
THERM	Digital output	Open-drain thermal alert flag (active low); asserts when local or remote temperature exceeds THERM limit register value.
GND	Ground reference	Analog and digital ground return; must be connected to low-impedance system ground plane to minimize measurement error.
ALERT/THERM2	Configurable digital output	Reprogrammable second alert output (open-drain); supports independent remote or local threshold triggering.
SDA	Bidirectional data line	I²C/SMBus serial data; requires external pull-up to V+; supports multi-master arbitration and clock stretching.
SCL	Input clock line	I²C/SMBus serial clock; open-drain input with internal pull-down; synchronizes all register reads/writes.

Key Features

Feature	Design Value
Series Resistance Cancellation	Compensates for up to 3 kΩ of PCB trace resistance between D+ and D−, eliminating measurement offset in long-trace remote sensing.
Programmable N-Factor	Adjusts ideality factor (η) from 1.001 to 1.015 to match specific remote transistor characteristics - improves accuracy across silicon process variations.
User Offset Registers	Two 8-bit signed offset registers (local and remote) allow per-unit calibration to correct for board-level thermal gradients and sensor placement errors.
Diode Fault Detection	Automatically identifies open-circuit, short-circuit, and reversed diode conditions on D+/D− lines - prevents false thermal shutdowns.
Multiple I²C Addresses	Four selectable addresses (0x4C, 0x4D, 0x4E, 0x4F) enable up to four TMP411BDGKT devices on a single bus without address conflict.

Applications

Rack Server Motherboard Thermal Management	FPGA Die Temperature Monitoring
Use Scenario: Real-time monitoring of CPU VRM, memory DIMMs, and PCIe switch junction temperatures in 1U/2U enterprise servers. IC Role / Device Role / Timing Role: Local sensor tracks ambient board temperature; remote channel reads diode-connected transistors integrated into Xeon Scalable CPUs and DDR5 memory controllers. Use Value: Enables dynamic fan speed control and processor throttling with ±1°C accuracy - reduces acoustic noise while maintaining thermal safety margins.	Use Scenario: Closed-loop thermal supervision of Xilinx Versal or Intel Agilex FPGA packages during high-throughput compute workloads. IC Role / Device Role / Timing Role: Remote sensing via FPGA-integrated diodes (e.g., Xilinx UG574); local channel monitors heatsink baseplate temperature for derating calculations. Use Value: Prevents thermal runaway during burst-mode acceleration by triggering THERM assertion within 115 ms of overtemperature event.
Smart NIC Thermal Protection	Baseband Unit (BBU) Power Amplifier Monitoring
Use Scenario: Thermal guardrails for 100G/400G SmartNICs with integrated DPUs and cryptographic accelerators. IC Role / Device Role / Timing Role: Dual-channel measurement: local sensor on NIC PCB; remote channel on ASIC die using on-die diode - synchronized via SMBus polling. Use Value: Maintains packet processing throughput by limiting thermal throttling to <1% duty cycle under sustained 85°C ambient conditions.	Use Scenario: Junction temperature tracking of GaN RF power amplifiers in 5G macro-cell BBUs operating at –40°C to +70°C outdoor enclosures. IC Role / Device Role / Timing Role: Remote sensing of amplifier die via discrete PNP transistor; local channel monitors heatsink temperature for predictive maintenance alerts. Use Value: Extends PA lifetime by enabling adaptive bias adjustment when remote temperature exceeds 105°C - validated across –40°C to +125°C operating range.

Rack Server Motherboard Thermal Management

FPGA Die Temperature Monitoring

Use Scenario: Real-time monitoring of CPU VRM, memory DIMMs, and PCIe switch junction temperatures in 1U/2U enterprise servers.

IC Role / Device Role / Timing Role: Local sensor tracks ambient board temperature; remote channel reads diode-connected transistors integrated into Xeon Scalable CPUs and DDR5 memory controllers.

Use Value: Enables dynamic fan speed control and processor throttling with ±1°C accuracy - reduces acoustic noise while maintaining thermal safety margins.

Use Scenario: Closed-loop thermal supervision of Xilinx Versal or Intel Agilex FPGA packages during high-throughput compute workloads.

IC Role / Device Role / Timing Role: Remote sensing via FPGA-integrated diodes (e.g., Xilinx UG574); local channel monitors heatsink baseplate temperature for derating calculations.

Use Value: Prevents thermal runaway during burst-mode acceleration by triggering THERM assertion within 115 ms of overtemperature event.

Smart NIC Thermal Protection

Baseband Unit (BBU) Power Amplifier Monitoring

Use Scenario: Thermal guardrails for 100G/400G SmartNICs with integrated DPUs and cryptographic accelerators.

IC Role / Device Role / Timing Role: Dual-channel measurement: local sensor on NIC PCB; remote channel on ASIC die using on-die diode - synchronized via SMBus polling.

Use Value: Maintains packet processing throughput by limiting thermal throttling to <1% duty cycle under sustained 85°C ambient conditions.

Use Scenario: Junction temperature tracking of GaN RF power amplifiers in 5G macro-cell BBUs operating at –40°C to +70°C outdoor enclosures.

IC Role / Device Role / Timing Role: Remote sensing of amplifier die via discrete PNP transistor; local channel monitors heatsink temperature for predictive maintenance alerts.

Use Value: Extends PA lifetime by enabling adaptive bias adjustment when remote temperature exceeds 105°C - validated across –40°C to +125°C operating range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar remote/local temperature sensor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TMP411ADGKT	Same VSSOP-8 package and electrical specs; differs only in I²C address (0x4C vs 0x4D) - no functional or performance variance.	Identical use cases; selected when 0x4C address conflicts with other SMBus devices on the same bus.	Drop-in replacement if board layout uses 0x4C-compatible firmware; verify I²C address configuration in initialization code.
TMP411CDGKT	Same package, accuracy, and feature set; uses I²C address 0x4E - identical timing, power, and calibration behavior.	Deployed where multiple TMP411 units require unique bus addressing without hardware modification.	Direct alternative when system firmware supports address 0x4E; no layout or BOM change required.

Compared with TMP411BDGKT, TMP411ADGKT and TMP411CDGKT offer identical thermal performance, pinout, and SMBus timing but differ solely in factory-programmed I²C address - enabling multi-sensor configurations on shared buses without address collision or external jumpers.

Availability

TMP411BDGKT is available at Aetrix Electronics and suitable for rack server motherboard thermal management, FPGA die temperature monitoring, and smart NIC thermal protection requiring stable component supply and long-term industrial lifecycle support.

Supply support for TMP411BDGKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision sensing and industrial-grade IC design.

The TMP411 product line targets high-reliability thermal monitoring in enterprise computing and communications infrastructure, delivering calibrated accuracy, robust diode interface handling, and SMBus interoperability for mission-critical thermal safety systems.

FAQ

What is the remote temperature accuracy specification for TMP411BDGKT over its full operating range?

The TMP411BDGKT achieves ±1°C remote temperature accuracy over –40°C to +100°C diode temperature (TDIODE) at V+ = 3.3 V. At extended ranges (–40°C to +125°C), accuracy degrades to ±3°C due to diode non-ideality and series resistance effects - a condition mitigated by the device's built-in series resistance cancellation and programmable N-factor correction features. This specification is validated across multiple transistor manufacturers and does not require per-unit calibration.

Does TMP411BDGKT support operation below 2.7 V supply voltage?

No, TMP411BDGKT requires a minimum supply voltage of 2.7 V and is rated for operation from 2.7 V to 5.5 V. Operation below 2.7 V may cause undervoltage lockout activation or unpredictable behavior. For sub-2.7 V applications, consider the TMP411D variant (e.g., TMP411DDDFR), which supports 1.62 V to 5.5 V operation and shares identical functionality except for supply range and package (SOT-23-8).

How does the series resistance cancellation feature work in TMP411BDGKT?

The TMP411BDGKT implements hardware-based series resistance cancellation by measuring voltage drop across both D+ and D− lines using dual current sources, then digitally subtracting the parasitic IR drop before computing temperature. It supports up to 3 kΩ of total series resistance - critical for accurate remote sensing over long PCB traces or flex cables. This function operates automatically and does not require external components or firmware intervention.

Can TMP411BDGKT be used with diode-connected MOSFETs or only bipolar transistors?

TMP411BDGKT is characterized and specified for use with diode-connected NPN or PNP bipolar transistors (e.g., 2N3906), not MOSFETs. Its internal current sources and N-factor correction algorithm assume bipolar junction behavior. While some MOSFET body diodes may yield usable readings, TI does not guarantee accuracy or specify parameters for MOSFET-based remote sensing - use only bipolar transistors or integrated diodes as documented in the TMP411BDGKT datasheet.

What is the conversion time for TMP411BDGKT in one-shot mode with both local and remote channels enabled?

In one-shot mode with both local and remote channels active, TMP411BDGKT requires 115 ms (typical) for full conversion at V+ = 3.3 V. This includes sequential sampling, ADC conversion, and internal compensation calculation. The device supports programmable conversion rates from 0.0625 Hz to 8 Hz, with corresponding current consumption scaling from 28 µA to 475 µA - enabling optimization for either ultra-low-power monitoring or rapid thermal response.

TMP411BDGKT Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Sensor Type:: Digital, Local/Remote

Sensing Temperature - Local:: -40°C ~ 125°C

Sensing Temperature - Remote:: -64°C ~ 191°C

Output Type:: I2C/SMBus

Voltage - Supply:: 2.7V ~ 5.5V

Resolution:: 11 b

Features:: One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode

Accuracy - Highest (Lowest):: ±1°C (±2.5°C)

Test Condition:: 15°C ~ 85°C (-40°C ~ 125°C)

Operating Temperature:: -55°C ~ 127°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 8-VSSOP

TMP411BDGKT FAQ

1.How can I place an order for TMP411BDGKT through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP411BDGKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP411BDGKT reliable?

The price and inventory of TMP411BDGKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP411BDGKT is usually 5 days.

3.What payment methods are accepted for TMP411BDGKT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP411BDGKT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP411BDGKT?

TMP411BDGKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP411BDGKT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP411BDGKT?

For technical support, including TMP411BDGKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP411BDGKT requirements.

6.How does Aetrix verify that TMP411BDGKT is sourced from the original manufacturer or authorized distributors?

All TMP411BDGKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP411BDGKT meets industry standards.

7.What is the process for return or replacement of TMP411BDGKT?

All TMP411BDGKT units undergo pre-shipment inspection (PSI). If there is an issue with TMP411BDGKT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP411BDGKT part is unused and in its original packaging.

Return procedure for TMP411BDGKT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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