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Texas Instruments TMP411CDGKR
- Part No.:
- TMP411CDGKR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TMP411CDGKR.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,086
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Product details
Overview
TMP411CDGKR from Texas Instruments is a dual-channel ±1°C remote/local temperature sensor IC with SMBus/I²C interface, programmable 9–12-bit resolution, series resistance cancellation, and N-factor correction - designed for precision thermal monitoring of processors, FPGAs, and remote diode-connected transistors in enterprise servers and wireless infrastructure.
For engineers reviewing the TMP411CDGKR datasheet, TMP411CDGKR pinout, TMP411CDGKR application, or TMP411CDGKR equivalent, this page delivers verified specifications, VSSOP-8 package details, diode fault detection capability, alert/thermal flag outputs, and direct comparison against TMP411D and TMP451 alternatives for thermal management system design.
Technical Context
The TMP411CDGKR integrates a local thermal transistor and supports remote sensing via external PNP/NPN transistors or diodes, applying real-time series resistance cancellation and user-programmable ideality factor (η = 1.008) to maintain ±1°C accuracy across –40°C to +125°C ambient and –40°C to +150°C remote diode range. Its SMBus-compliant two-wire interface supports up to 3.4 MHz clock frequency and four configurable I²C addresses (0x4C, 0x4D, 0x4E, 0x4C with offset register).
It features dual open-drain digital outputs - THERM (hardware thermal shutdown flag) and ALERT/THERM2 (reconfigurable alert) - both requiring pull-up to V+, and operates from 2.7V to 5.5V with average current as low as 28 µA at 0.0625 Hz conversion rate. The device includes offset registers for system-level calibration and programmable high/low temperature thresholds with status reporting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Local Accuracy | ±1°C over 15°C to 85°C ambient; enables reliable junction temperature estimation without per-unit calibration |
| Remote Accuracy | ±1°C over –40°C to +100°C diode temperature; validated across multiple semiconductor manufacturers' transistors |
| Supply Range | 2.7V to 5.5V; compatible with standard 3.3V and 5V system rails without LDO requirement |
| Interface | SMBus/I²C with 3.4 MHz max clock; supports legacy and high-speed modes with timeout and noise immunity |
| Resolution | Programmable 9–12 bits (local), fixed 12 bits (remote); selectable trade-off between update rate and LSB step size (0.0625°C at 12-bit) |
| Conversion Time | 115 ms typical (one-shot mode, legacy chip); determines minimum thermal sampling interval in closed-loop control |
| Package | VSSOP-8 (3.0 mm × 4.9 mm); surface-mount footprint optimized for dense server motherboard layouts |
Pinout & Package
VSSOP-8 package (DGK suffix), 3.0 mm × 4.9 mm × 1.1 mm body, exposed pad not electrically connected, RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| V+ | Power supply input | 2.7V–5.5V positive rail; powers internal circuitry and supplies pull-up for open-drain outputs |
| D+ | Analog input (remote sensor) | Positive terminal for remote diode/transistor; bias current sourced internally for temperature measurement |
| D– | Analog input (remote sensor) | Negative terminal for remote diode/transistor; completes remote sensing path with D+ |
| THERM | Digital output (open-drain) | Active-low thermal alert; asserts when local temperature exceeds programmable THERM limit; requires external pull-up |
| GND | Ground reference | System ground return for analog and digital sections; must be low-impedance for accuracy |
| ALERT/THERM2 | Digital output (open-drain) | Reconfigurable alert output; defaults to ALERT function but can be set as second thermal flag via configuration register |
| SDA | Bidirectional data line | SMBus/I²C serial data; open-drain, requires pull-up; handles read/write commands and temperature register access |
| SCL | Digital input (clock) | SMBus/I²C serial clock; open-drain, requires pull-up; synchronizes all bus transactions |
Key Features
| Feature | Design Value |
|---|---|
| Series Resistance Cancellation | Compensates for PCB trace resistance up to 3 kΩ in remote diode path, preserving ±1°C accuracy without hardware modification |
| Programmable N-Factor | User-configurable ideality factor (η) register allows fine-tuning to match specific remote transistor characteristics (e.g., 2N3906 PNP) |
| Diode Fault Detection | Automatically identifies open-circuit, short-circuit, or reversed diode connections and reports status in dedicated register bit |
| Offset Calibration Registers | Separate local and remote offset registers enable system-level trimming to eliminate board-level thermal gradients or sensor offsets |
| Multiple Alert Outputs | Dual open-drain outputs (THERM + ALERT/THERM2) support independent thermal shutdown and interrupt signaling in multi-zone systems |
Applications
| Rack Server Motherboard Thermal Monitoring | Smart NIC Temperature Management |
|---|---|
|
Use Scenario: Real-time monitoring of CPU, memory, and PCIe switch die temperatures on high-density 1U/2U rack servers. IC Role / Device Role / Timing Role: Local sensor measures ambient board temperature; remote channel reads integrated thermal diodes in Xeon Scalable CPUs and FPGA-based accelerators. Use Value: Enables dynamic fan speed control and thermal throttling with ±1°C accuracy, reducing acoustic noise while preventing thermal shutdown events. |
Use Scenario: Thermal supervision of dual 10/25/100 GbE PHYs and packet processing ASICs on intelligent network interface cards. IC Role / Device Role / Timing Role: Remote sensing of ASIC junction temperature via on-die diodes; local sensor tracks NIC enclosure ambient rise during sustained traffic bursts. Use Value: Prevents link degradation by triggering adaptive power scaling before silicon exceeds 105°C, extending component lifetime under load. |
| Small Cell Base Station RF Front-End | FPGA-Based Software Defined Radio |
|
Use Scenario: Closed-loop thermal compensation of GaN power amplifiers and analog front-end ICs in outdoor 4G/5G small cells. IC Role / Device Role / Timing Role: Remote channel tracks PA die temperature; local sensor monitors heatsink proximity; alerts trigger bias voltage adjustment. Use Value: Maintains EVM and ACLR performance across –40°C to +65°C operating range by feeding temperature data to FPGA-based compensation algorithms. |
Use Scenario: Multi-point thermal profiling of Xilinx Kintex Ultrascale+ FPGA fabric, transceivers, and DDR4 memory controllers in SDR platforms. IC Role / Device Role / Timing Role: One TMP411CDGKR monitors local board temp; additional units connect to FPGA's internal diodes and external RFICs via D+/D–. Use Value: Supports IEEE 1149.1 boundary-scan thermal validation and runtime reconfiguration based on real-time junction temperature gradients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP411DADDFR | Wider supply range (1.62V–5.5V); lower quiescent current (1.5 µA avg); SOT-23-8 package; ±0.8°C accuracy | Better suited for battery-powered or ultra-low-power edge devices; less suitable for legacy 5V-only systems | Select TMP411DADDFR when supply voltage may dip below 2.7V or board space is constrained to <3 mm² |
| TMP451AIYFFT | Lower supply (1.7V–3.6V); higher remote accuracy (±0.75°C); DSBGA-8 package; no THERM pin; single ALERT only | Optimized for portable computing and mobile SoC thermal management; lacks hardware thermal shutdown flag | Choose TMP451AIYFFT for notebook or tablet designs where footprint and sub-1°C remote accuracy outweigh need for dual alert outputs |
Compared with TMP411CDGKR, TMP411DADDFR offers superior power efficiency and wider voltage tolerance but sacrifices the THERM hardware shutdown signal, while TMP451AIYFFT delivers tighter remote accuracy in a smaller package but removes critical thermal safety functionality required in enterprise infrastructure.
Availability
TMP411CDGKR is available at Aetrix Electronics and suitable for rack server motherboard thermal management, smart NIC temperature supervision, and small cell base station RF front-end monitoring requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for TMP411CDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision sensing and thermal management solutions.
The TMP411 product line was engineered for high-reliability thermal monitoring in enterprise computing and wireless infrastructure, emphasizing accuracy stability across voltage, temperature, and process variation - particularly for multi-die systems with distributed thermal sources.
FAQ
What is the accuracy specification of the TMP411CDGKR over its full operating temperature range?
The TMP411CDGKR achieves ±1°C local temperature accuracy from 15°C to 85°C ambient and ±2.5°C over the full –40°C to +125°C range. Remote channel accuracy is ±1°C from –40°C to +100°C diode temperature, degrading to ±3°C at extremes (–40°C to +125°C), as specified in TI's SBOS383E datasheet Section 6.5. This performance holds across 2.7V–5.5V supply and does not require per-unit calibration.
Does the TMP411CDGKR support series resistance cancellation, and how is it configured?
Yes, the TMP411CDGKR implements hardware-based series resistance cancellation for remote diode measurements. It is enabled automatically when the RSERIES bit is set in the Configuration Register (bit 6), and operates using internal current sources to nullify errors introduced by up to 3 kΩ of trace resistance in the D+/D– path - no external components or firmware calculation required. This feature is active in all conversion modes.
What are the I²C/SMBus address options for the TMP411CDGKR, and how are they selected?
The TMP411CDGKR supports four fixed I²C addresses: 0x4C (TMP411C), 0x4D (TMP411B), 0x4E (TMP411C), and 0x4C with offset register enabled (TMP411E). Address selection is determined by the part number suffix - "C" in TMP411CDGKR indicates 0x4E (1001110b). No external pins configure the address; it is hard-coded per orderable variant and documented in TI's SBOS383E Table 4-2.
Can the THERM and ALERT/THERM2 pins on the TMP411CDGKR be used simultaneously for different thermal thresholds?
Yes - the THERM pin is dedicated to the THERM limit (programmed in THERM_LIMIT register) and asserts low when exceeded. The ALERT/THERM2 pin is configurable via the CONFIG register (bit 0): when cleared, it functions as ALERT for the OS/THYST limits; when set, it mirrors THERM behavior. Both outputs are open-drain and require independent pull-ups, enabling dual-threshold response without external logic.
Is the TMP411CDGKR pin-compatible with ADT7461 or ADM1032, and what register-level differences exist?
The TMP411CDGKR is pin- and register-compatible with ADT7461 and ADM1032 for basic temperature readout and limit setting, per TI's SBOS383E Section 1. This allows drop-in replacement in legacy designs. However, TMP411CDGKR adds extended features - including series resistance cancellation, N-factor correction, and remote offset registers - which occupy previously reserved or unused register addresses and require updated firmware to leverage.
TMP411CDGKR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -64°C ~ 191°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 2.7V ~ 5.5V
- Resolution:
- 11 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1°C (±2.5°C)
- Test Condition:
- 15°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 127°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-VSSOP
TMP411CDGKR FAQ
1.How can I place an order for TMP411CDGKR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP411CDGKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP411CDGKR reliable?
The price and inventory of TMP411CDGKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP411CDGKR is usually 5 days.
3.What payment methods are accepted for TMP411CDGKR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP411CDGKR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP411CDGKR?
TMP411CDGKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP411CDGKR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP411CDGKR?
For technical support, including TMP411CDGKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP411CDGKR requirements.
6.How does Aetrix verify that TMP411CDGKR is sourced from the original manufacturer or authorized distributors?
All TMP411CDGKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP411CDGKR meets industry standards.
7.What is the process for return or replacement of TMP411CDGKR?
All TMP411CDGKR units undergo pre-shipment inspection (PSI). If there is an issue with TMP411CDGKR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP411CDGKR part is unused and in its original packaging.
Return procedure for TMP411CDGKR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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