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Texas Instruments TMP411CDR
- Part No.:
- TMP411CDR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TMP411CDR.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,464
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Product details
Overview
TMP411CDR from Texas Instruments is a dual-channel ±1°C remote/local temperature sensor IC with I²C/SMBus interface, programmable 9–12-bit resolution, series resistance cancellation, and N-factor correction - designed for precision thermal monitoring in microprocessor, FPGA, and server motherboard applications.
For engineers reviewing the TMP411CDR datasheet, TMP411CDR pinout, TMP411CDR application, or TMP411CDR equivalent, this page delivers verified specifications, package mapping (SOIC-8), functional pin definitions, real-world use cases in enterprise systems, and two validated alternative parts with documented technical and application differences.
Technical Context
The TMP411CDR integrates a local thermal transistor and supports remote sensing via external diode-connected transistors (e.g., 2N3906 PNP), with accuracy maintained across –40°C to +125°C ambient and up to +150°C remote diode temperature. It implements SMBus-compatible write byte/read byte commands for configuration and data retrieval.
Its architecture includes dedicated registers for offset calibration, programmable alert thresholds, diode fault detection, and THERM/ALERT/THERM2 output control - all operating within a 2.7V–5.5V supply range and compatible with ADT7461/ADM1032 register maps and pinouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Local Accuracy | ±1°C over 15°C–85°C ambient; enables reliable CPU die temperature tracking without system-level calibration |
| Remote Accuracy | ±1°C over –40°C–100°C diode temperature; maintains precision despite PCB trace resistance up to 3 kΩ |
| Supply Range | 2.7V–5.5V; interoperable with standard 3.3V and 5V logic rails in server and networking hardware |
| Interface | I²C/SMBus (up to 3.4 MHz); supports multi-drop bus with four selectable addresses (A/B/C/E) |
| Resolution | Programmable 9–12 bits (local), fixed 12 bits (remote); balances conversion time (115 ms typical) and LSB step size (0.0625°C) |
| Operating Range | –40°C to +125°C ambient; qualified for industrial and enterprise-grade thermal management environments |
| Power Consumption | 28 µA avg @ 0.0625 Hz conversion; enables low-duty-cycle thermal polling in power-constrained systems |
Pinout & Package
Package: SOIC-8 (D package), 4.9 mm × 6.0 mm × 1.75 mm body height, surface-mount, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| V+ | Power supply input | Positive rail (2.7V–5.5V); powers internal circuitry and supplies pull-up for open-drain outputs |
| D+ | Analog input | Positive terminal for remote diode sensor; bias current sourced internally for accurate ΔVBE measurement |
| D– | Analog input | Negative terminal for remote diode sensor; completes remote sensing path with D+ |
| THERM | Digital output | Active-low open-drain thermal alert; asserts when local temperature exceeds programmable threshold |
| GND | Ground reference | System ground return; required for analog measurement stability and digital logic reference |
| ALERT/THERM2 | Digital output | Reconfigurable active-low open-drain output; defaults to ALERT but can be set as second thermal flag |
| SDA | Bidirectional data line | SMBus/I²C serial data; requires external pull-up to V+; supports read/write register access |
| SCL | Digital clock input | SMBus/I²C serial clock; requires external pull-up to V+; controls timing of data transfers |
Key Features
| Feature | Design Value |
|---|---|
| Series Resistance Cancellation | Compensates for PCB trace resistance up to 3 kΩ in remote diode path, preserving ±1°C accuracy without hardware modification |
| Programmable N-Factor Correction | Adjusts ideality factor (η = 1.008 default) to match specific transistor/diode characteristics, eliminating calibration per sensor type |
| User-Defined Offset Registers | Enables system-level calibration by applying per-device offsets to local/remote readings, improving end-system accuracy |
| Diode Fault Detection | Automatically identifies open-circuit, short-circuit, or leakage faults on D+/D– lines and flags via status register |
| Multiple Alert Outputs | THERM and ALERT/THERM2 provide independent thermal event signaling - critical for redundant safety monitoring in servers |
Applications
| Rack Server Motherboard Thermal Monitoring | Smart NIC Temperature Management |
|---|---|
Use Scenario: Real-time monitoring of CPU, memory, and VRM hotspots on high-density 1U/2U server motherboards. IC Role / Device Role / Timing Role: Local sensor tracks ambient board temperature; remote channel reads integrated diode in Xeon/EPYC processors. Use Value: Enables dynamic fan speed control and thermal throttling with ±1°C accuracy, reducing acoustic noise and extending component life. |
Use Scenario: Thermal supervision of FPGA-based packet processing engines and SerDes lanes in 10/25/100G smart network interface cards. IC Role / Device Role / Timing Role: Remote sensing of FPGA junction temperature via on-die diode; local channel monitors NIC ambient airflow. Use Value: Prevents thermal shutdown during burst traffic loads by triggering alerts at user-defined thresholds before performance degradation occurs. |
| Baseband Unit (BBU) in Small Cell Infrastructure | FPGA and ASIC Thermal Protection |
Use Scenario: Compact thermal monitoring in outdoor-rated 5G baseband units where space, power, and reliability are constrained. IC Role / Device Role / Timing Role: Dual-channel sensing of RF SoC die temperature (remote) and enclosure ambient (local) under wide temperature swing (–40°C to +125°C). Use Value: Maintains radio uptime by enabling predictive cooling and graceful power reduction before thermal limits are breached. |
Use Scenario: Protecting high-performance FPGAs (e.g., Xilinx Versal, Intel Stratix) from thermal runaway during compute-intensive workloads. IC Role / Device Role / Timing Role: Remote channel interfaces with FPGA's internal diode; local channel validates heatsink attachment integrity. Use Value: Supports JTAG-accessible temperature logging and triggers hardware reset via THERM pin if FPGA junction exceeds safe limit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar remote/local temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP411ADR | Same SOIC-8 package and electrical specs; differs only in I²C address (1001100b vs 1001101b for TMP411CDR) | No functional difference; used in same multi-sensor bus configurations where address collision must be avoided | Select TMP411ADR when designing systems requiring ≥2 TMP411 devices on one SMBus segment |
| ADT7461ARQZ | Pin- and register-compatible; ±2°C local/remote accuracy; wider supply (3.0V–5.5V); no series resistance cancellation | Lacks remote error compensation - requires matched diodes and careful layout to achieve <±2°C performance | Choose ADT7461ARQZ only if legacy design reuse is prioritized over accuracy and layout flexibility |
Compared with TMP411ADR, TMP411CDR offers identical functionality with a different I²C address - enabling direct substitution in multi-node thermal networks. Against ADT7461ARQZ, TMP411CDR delivers tighter ±1°C accuracy and built-in series resistance correction, reducing system-level calibration effort and PCB routing constraints.
Availability
TMP411CDR is available at Aetrix Electronics and suitable for rack server motherboard thermal monitoring, smart NIC temperature management, and 5G baseband unit (BBU) applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for TMP411CDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision sensing and thermal management ICs.
The TMP411 product line targets high-reliability enterprise and communications infrastructure, delivering calibrated dual-channel temperature sensing with robust digital interface and fault diagnostics for mission-critical thermal control.
FAQ
What is the accuracy specification of the TMP411CDR over its full operating temperature range?
The TMP411CDR achieves ±1°C local temperature accuracy from 15°C to 85°C ambient and ±2.5°C over the full –40°C to +125°C range. Remote channel accuracy is ±1°C from –40°C to +100°C diode temperature, degrading to ±3°C at extremes (–40°C to +125°C), as specified in the official TI datasheet SBOS383E.
Does the TMP411CDR support series resistance cancellation, and how does it improve system accuracy?
Yes, the TMP411CDR implements hardware-based series resistance cancellation to compensate for PCB trace resistance up to 3 kΩ in the remote diode path. This feature eliminates measurement errors caused by parasitic resistance, allowing ±1°C remote accuracy without requiring matched routing or external calibration - directly enhancing thermal control fidelity in dense server layouts.
What package type and dimensions does the TMP411CDR use?
The TMP411CDR uses the SOIC-8 (D) package: 4.9 mm × 6.0 mm footprint with 1.75 mm maximum height. It is a surface-mount, gull-wing leaded package compliant with JEDEC MS-012, and is distinct from the VSSOP-8 (DGK) and SOT-23-8 (DDF) variants used by other TMP411 family members.
Can the TMP411CDR replace the ADT7461 in an existing design without hardware changes?
The TMP411CDR is pin- and register-compatible with the ADT7461, but it is not a drop-in replacement due to differences in accuracy (±1°C vs ±2°C), supply range (2.7V–5.5V vs 3.0V–5.5V), and missing series resistance cancellation in the ADT7461. Layout remains identical, but firmware may require minor register initialization updates to leverage enhanced features of the TMP411CDR.
How does the TMP411CDR handle diode fault detection, and what conditions trigger it?
The TMP411CDR continuously monitors D+ and D– for open-circuit, short-circuit, and excessive leakage faults. It reports faults via the Status Register bit 0 (DIODE_FAULT) and can assert the ALERT/THERM2 pin. Detection occurs when voltage across D+/D– falls outside expected ranges - for example, >1.5 V (open) or <0.1 V (short) - ensuring robust remote sensing integrity in field-deployed systems.
TMP411CDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -64°C ~ 191°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 2.7V ~ 5.5V
- Resolution:
- 11 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1°C (±2.5°C)
- Test Condition:
- 15°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 127°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-SOIC
TMP411CDR FAQ
1.How can I place an order for TMP411CDR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP411CDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP411CDR reliable?
The price and inventory of TMP411CDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP411CDR is usually 5 days.
3.What payment methods are accepted for TMP411CDR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP411CDR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP411CDR?
TMP411CDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP411CDR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP411CDR?
For technical support, including TMP411CDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP411CDR requirements.
6.How does Aetrix verify that TMP411CDR is sourced from the original manufacturer or authorized distributors?
All TMP411CDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP411CDR meets industry standards.
7.What is the process for return or replacement of TMP411CDR?
All TMP411CDR units undergo pre-shipment inspection (PSI). If there is an issue with TMP411CDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP411CDR part is unused and in its original packaging.
Return procedure for TMP411CDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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