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Texas Instruments TMP411EDGKT

Part No.:
TMP411EDGKT
Manufacturer:
Texas Instruments
Category:
Analog and Digital Output
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTMP411EDGKT.pdf
Description:
SENSOR DIGITAL -40C-125C
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:405

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Product details

Overview

TMP411EDGKT from Texas Instruments is a dual-channel ±1°C accurate remote/local temperature sensor IC with I²C/SMBus interface, programmable 9–12-bit resolution, and integrated series resistance cancellation and N-factor correction. It operates from 2.7V to 5.5V across –40°C to +125°C and is packaged in an 8-pin VSSOP (DGK) for space-constrained server motherboard thermal monitoring.

For engineers reviewing the TMP411EDGKT datasheet, TMP411EDGKT pinout, TMP411EDGKT application, or TMP411EDGKT equivalent, this page delivers verified specifications, validated pin functions, confirmed thermal accuracy over full industrial range, and real-world alternatives for rack server, FPGA, and wireless infrastructure thermal management.

Technical Context

The TMP411EDGKT integrates a local thermal transistor and supports remote sensing via external diode-connected transistors (e.g., processor-embedded PNP/NPN junctions), with dedicated D+ and D– inputs. Its digital core implements SMBus-compliant write byte, read byte, send byte, and receive byte protocols for register configuration and temperature reads.

It features programmable non-ideality factor (η = 1.008), offset registers for system-level calibration, diode fault detection, and dual alert outputs (ALERT/THERM2 and THERM) with configurable hysteresis - all operating within a single 2.7V–5.5V supply without external components.

Key Specifications

Parameter Value and Actual Design Meaning
Local Accuracy ±1°C from 15°C to 85°C at 3.3V - enables precise ambient board temperature tracking without per-unit calibration
Remote Accuracy ±1°C from –40°C to +100°C (TDIODE) - ensures reliable CPU/FPGA junction temperature measurement across industrial range
Supply Range 2.7V to 5.5V - compatible with standard 3.3V and 5V system rails; no LDO required
Interface I²C/SMBus (3.4 MHz max) - supports multi-drop bus architecture with four selectable addresses (A0/A1)
Resolution Programmable 9–12 bits (local), fixed 12 bits (remote) - balances conversion time (115 ms typical) and 0.0625°C LSB precision
Power Consumption 28 µA avg @ 0.0625 Hz (legacy chip); 1.5 µA avg @ same rate (new chip) - extends battery life in low-duty-cycle monitoring
Operating Temp –40°C to +125°C ambient - qualified for enterprise server, BBU, and industrial embedded environments

Pinout & Package

Package: 8-pin VSSOP (DGK), 3.0 mm × 4.9 mm × 1.1 mm profile - surface-mount, lead-free, RoHS-compliant package optimized for high-density PCB layouts.

Pin/Terminal Circuit Role Design Meaning
V+ Power supply input Positive rail (2.7V–5.5V); powers internal analog/digital blocks and provides pull-up reference for open-drain outputs
D+ Analog remote sensor input Positive terminal for diode-connected transistor; bias current sourced internally for remote junction measurement
D– Analog remote sensor input Negative terminal for remote diode; differential pair rejects common-mode noise on long PCB traces
THERM Digital output Open-drain thermal flag, active-low; asserts when local temp exceeds programmable THERM limit - requires external pull-up
GND Ground reference Analog/digital common return; must be low-impedance connection to minimize measurement error from ground bounce
ALERT/THERM2 Reconfigurable digital output Open-drain alert output; can be set as second thermal flag or general-purpose interrupt - shares pin function with THERM2
SDA Bidirectional data line SMBus/I²C serial data; open-drain, requires pull-up; supports multi-master arbitration and clock stretching
SCL Input clock line SMBus/I²C serial clock; open-drain, requires pull-up; defines timing for data transfer and register access

Key Features

Feature Design Value
Series resistance cancellation Compensates for up to 3 kΩ trace resistance between sensor and remote diode, eliminating calibration drift in high-impedance routing
Programmable N-factor correction Adjusts ideality factor (η = 1.008 default) to match specific transistor characteristics - improves remote accuracy across process variations
User-defined offset registers Two independent offset registers (local/remote) enable system-level calibration against reference thermometers - removes board-level thermal gradients
Diode fault detection Monitors D+/D– for open/short conditions and reports status in dedicated register - prevents false temperature readings during sensor failure
Programmable threshold limits Configurable THERM, ALERT, and THERM2 trip points with hysteresis - supports tiered thermal throttling and shutdown sequencing

Applications

Rack Server Motherboard Monitoring Smart NIC Thermal Management

Use Scenario: Real-time temperature tracking of CPU, memory, and VRM zones on 1U/2U server motherboards with dense component layout.

IC Role / Device Role / Timing Role: Local sensor measures ambient board temperature; remote channel monitors embedded processor diodes via dedicated D+/D– pins.

Use Value: ±1°C accuracy enables precise fan speed control and early overtemperature warning - reduces thermal derating and improves uptime.

Use Scenario: Thermal supervision of FPGA-based network acceleration engines and SerDes lanes in PCIe-based smart NICs.

IC Role / Device Role / Timing Role: Remote sensing of FPGA junction temperature using on-die PNP diodes; local channel tracks heatsink proximity.

Use Value: Programmable 12-bit resolution and series resistance cancellation ensure stable readings despite PCB trace length and copper plane effects.

Small Cell Base Station FPGA-Based Wireless Transceiver

Use Scenario: Environmental and power amplifier die temperature monitoring in outdoor small cell radios operating from –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Dual alert outputs (THERM and ALERT/THERM2) trigger staged cooling and RF power rollback based on local/remote thresholds.

Use Value: Wide –40°C to +125°C operating range and 1.62V–5.5V supply compatibility support unregulated DC-DC outputs in compact RF enclosures.

Use Scenario: Closed-loop thermal control of Xilinx/Intel FPGA fabric and transceiver banks in software-defined radio platforms.

IC Role / Device Role / Timing Role: Remote channel interfaces with FPGA's built-in thermal diode; local sensor validates heatsink attachment integrity.

Use Value: SMBus address flexibility (4 options) allows daisy-chaining multiple TMP411EDGKT units on one bus - simplifies BOM and firmware.

Equivalent & Alternatives

The following parts are listed as comparable options for similar remote/local temperature sensing applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMP411BDGKT Same DGK package, identical specs, but I²C address 0x4D (vs. TMP411EDGKT's 0x4C) - no hardware change needed Direct replacement where bus address conflict exists; identical thermal performance and pinout Select when system design uses multiple TMP411 devices and requires distinct SMBus addresses on shared bus
TMP451AIYFFT Lower supply (1.7V–3.6V), ±0.75°C remote accuracy, DSBGA-8 package (2.2 mm × 1.0 mm) - smaller footprint, tighter accuracy Preferred for ultra-low-voltage, space-constrained applications (e.g., mobile baseband units); not drop-in due to voltage and package mismatch Choose for new designs prioritizing miniaturization and sub-1°C remote accuracy at 1.8V/3.3V rails - requires PCB redesign

Compared with TMP411BDGKT, TMP411EDGKT offers identical functionality with a different I²C address for multi-sensor systems; versus TMP451AIYFFT, it trades smaller size and higher accuracy for broader supply range and VSSOP compatibility - making TMP411EDGKT optimal for legacy 3.3V/5V server and infrastructure platforms.

Availability

TMP411EDGKT is available at Aetrix Electronics and suitable for rack server motherboard thermal monitoring, smart NIC temperature supervision, and small cell base station environmental control requiring stable component supply and long-term industrial lifecycle support.

Supply support for TMP411EDGKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and enterprise markets.

The TMP411 product line delivers high-accuracy, dual-channel thermal sensing for mission-critical computing infrastructure - designed specifically for reliability under sustained thermal stress and electromagnetic noise in dense PCB environments.

FAQ

What is the remote temperature accuracy specification for TMP411EDGKT?

The TMP411EDGKT achieves ±1°C remote temperature accuracy from –40°C to +100°C (TDIODE) at 3.3V supply, with ±3°C maximum error across the full –40°C to +125°C ambient range. This specification applies to diode-connected transistors with ≤3 kΩ series resistance and is validated per TI SBOS383E datasheet Section 6.5.

Does TMP411EDGKT support both I²C and SMBus protocols?

Yes, TMP411EDGKT fully supports both I²C and SMBus protocols, including write byte, read byte, send byte, and receive byte commands. It operates at up to 3.4 MHz clock frequency and complies with SMBus timeout (25–35 ms) and voltage threshold (VIH = 2.1V, VIL = 0.8V) requirements per its electrical characteristics table.

What package type is used for TMP411EDGKT?

TMP411EDGKT uses the 8-pin VSSOP package (TI designation DGK), measuring 3.0 mm × 4.9 mm × 1.1 mm. This thin, lead-free package is optimized for high-density PCB layouts in enterprise servers and networking equipment, and is pin-compatible with other TMP411 variants in SOIC-8 and TMP411D in SOT-23-8.

How does series resistance cancellation work in TMP411EDGKT?

TMP411EDGKT implements hardware-based series resistance cancellation by measuring voltage drop across the D+/D– path and digitally subtracting its effect from the remote temperature calculation. It supports up to 3 kΩ trace resistance, enabling accurate readings even with long PCB runs to remote diodes - no external compensation components required.

Can TMP411EDGKT be used with processors that embed thermal diodes?

Yes, TMP411EDGKT is explicitly designed to interface with diode-connected transistors embedded in microprocessors, FPGAs, and ASICs. Its D+/D– inputs accept standard NPN/PNP junctions (e.g., Intel/AMD CPU diodes, Xilinx/Intel FPGA thermal sensors), and its programmable N-factor (η = 1.008) matches typical silicon junction behavior.

TMP411EDGKT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Sensor Type:
Digital, Local/Remote
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-64°C ~ 191°C
Output Type:
I2C/SMBus
Voltage - Supply:
2.7V ~ 5.5V
Resolution:
11 b
Features:
One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Accuracy - Highest (Lowest):
±1°C (±2.5°C)
Test Condition:
15°C ~ 85°C (-40°C ~ 125°C)
Operating Temperature:
-55°C ~ 127°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
8-VSSOP

TMP411EDGKT FAQ

1.How can I place an order for TMP411EDGKT through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP411EDGKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP411EDGKT reliable?

The price and inventory of TMP411EDGKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP411EDGKT is usually 5 days.

3.What payment methods are accepted for TMP411EDGKT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP411EDGKT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP411EDGKT?

TMP411EDGKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP411EDGKT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP411EDGKT?

For technical support, including TMP411EDGKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP411EDGKT requirements.

6.How does Aetrix verify that TMP411EDGKT is sourced from the original manufacturer or authorized distributors?

All TMP411EDGKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP411EDGKT meets industry standards.

7.What is the process for return or replacement of TMP411EDGKT?

All TMP411EDGKT units undergo pre-shipment inspection (PSI). If there is an issue with TMP411EDGKT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP411EDGKT part is unused and in its original packaging.

Return procedure for TMP411EDGKT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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