Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments TMP431DDGKR

Part No.:
TMP431DDGKR
Manufacturer:
Texas Instruments
Category:
Analog and Digital Output
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixTMP431DDGKR.pdf
Description:
SENSOR DIGITAL -40C-125C 8VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,500

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TMP431DDGKR from Texas Instruments is a dual-channel digital temperature sensor IC featuring one local die temperature channel and one remote junction temperature channel, ±1°C accuracy (0°C–100°C), SMBus 2.0 interface, 12-bit resolution (0.0625°C), and automatic beta/η-factor compensation for PNP/NPN transistors used in FPGA or processor thermal monitoring.

For engineers reviewing the TMP431DDGKR datasheet, TMP431DDGKR pinout, TMP431DDGKR application, or TMP431DDGKR equivalent, key selection criteria include remote diode measurement accuracy across –40°C to 125°C ambient, series resistance cancellation up to 1 kΩ, programmable ALERT/THERM2 flag behavior, SMBus timing compliance at 3.4 MHz, and VSSOP-8 package compatibility with space-constrained embedded thermal management systems.

Technical Context

The TMP431DDGKR implements a dual-sensing architecture: an on-die bandgap-based local sensor and a remote delta-VBE circuit that drives and measures external PNP/NPN transistors via DXP/DXN pins. It uses collector-current control-not emitter-current control-to enable accurate beta compensation across process nodes down to 45 nm.

Its SMBus interface supports write byte, read byte, send byte, and receive byte commands; register-mapped configuration enables independent high/low threshold programming for local and remote channels, minimum/maximum temperature tracking, and diode fault detection-all without requiring calibration or external components beyond pullup resistors on SCL, SDA, ALERT, and THERM.

Key Specifications

ParameterValue and Actual Design Meaning
Local Accuracy±1°C over 0°C–100°C ambient; enables precise SoC die temperature tracking without system-level calibration.
Remote Accuracy±1°C over 0°C–100°C remote diode temperature; validated across multiple transistor manufacturers and PNP/NPN types.
Resolution0.0625°C (12-bit); provides fine-grained thermal margining for fan speed control or throttling decisions.
SMBus SpeedUp to 3.4 MHz; supports fast polling in high-dynamic thermal environments like server CPUs or FPGAs.
Supply Range2.7 V–5.5 V; interoperable with 3.3 V and 5 V logic domains without level-shifting.
Quiescent Current35–45 μA at 0.0625 conversions/s; suitable for always-on thermal monitoring in battery-backed or low-power systems.
Series Resistance CancellationUp to 1 kΩ (beta disabled) or 300 Ω (beta enabled); eliminates PCB trace-induced offset without hardware compensation.

Pinout & Package

VSSOP-8 (DGK) package, 3.00 mm × 3.00 mm body size, 0.65 mm lead pitch, exposed thermal pad not present.

Pin/TerminalCircuit RoleDesign Meaning
1 - V+Power supply inputAccepts 2.7–5.5 V; requires 0.1-μF ceramic bypass capacitor placed near pin for stable ADC and SMBus operation.
2 - DXPRemote sensor positive terminalDrives current into base-collector junction of external PNP/NPN; connects directly to diode anode or transistor collector.
3 - DXNRemote sensor negative terminalCompletes remote sensing loop; connects to diode cathode or transistor emitter; differential pair rejects common-mode noise.
4 - THERMDigital thermal alert outputOpen-drain, active-low flag triggered when local or remote exceeds programmable THERM limit; requires external pullup to V+.
5 - GNDAnalog/digital ground referenceSingle ground plane required; no separate AGND/DGND; layout must minimize impedance to reduce measurement noise.
6 - ALERT/THERM2Configurable dual-function outputOpen-drain, active-low; defaults as ALERT (local/remote over/under-limit), reconfigurable as second thermal flag (THERM2) via register.
7 - SDASMBus bidirectional data lineOpen-drain I/O; requires pullup to V+; supports multi-drop bus with other SMBus devices sharing same line.
8 - SCLSMBus clock inputOpen-drain input; requires pullup to V+; timing compliant with SMBus 2.0 Fast Mode Plus (3.4 MHz max).

Key Features

FeatureDesign Value
Automatic beta compensationAdapts collector-current drive per conversion to match external transistor β (0.1–27 range), eliminating drift due to process variation or temperature-dependent β shift.
η-factor correctionSupports ideality factor tuning (1.000 or 1.008) to match physical characteristics of discrete diodes or integrated transistor junctions.
Programmable threshold limitsIndependent high/low registers for local and remote channels allow asymmetric trip points-e.g., +95°C alarm with –10°C warning-without host MCU intervention.
Diode fault detectionIdentifies open-circuit, short-circuit, or reverse-biased remote sensors during initialization and periodic conversions, preventing false thermal shutdowns.
Extended temperature range modeEnables –64°C to 191°C reporting range (via Configuration Register 1 bit-2), though remote diode sensing remains limited to –55°C to 150°C per device specification.

Applications

Processor Thermal MonitoringFPGA Junction Sensing

Use Scenario: Real-time die temperature tracking of x86 or ARM processors in servers and workstations to trigger dynamic frequency scaling or fan ramp-up before thermal throttling occurs.

IC Role / Device Role / Timing Role: Local sensor measures CPU die temperature; remote channel monitors external transistor on processor package substrate to detect hotspots near memory interfaces.

Use Value: ±1°C remote accuracy ensures thermal control loops respond within 1°C of actual junction temperature, reducing unnecessary throttling and preserving performance headroom.

Use Scenario: Monitoring junction temperature of high-density FPGA fabric during compute-intensive acceleration tasks in telecom baseband or AI inference engines.

IC Role / Device Role / Timing Role: Remote channel interfaces with on-die PNP transistor (e.g., Xilinx Virtex-7 thermal diode); local channel validates ambient board temperature for derating calculations.

Use Value: Automatic beta compensation maintains accuracy across FPGA process corners and operating temperatures, eliminating need for per-unit calibration in volume production.

Industrial Controller Thermal SafetyStorage Area Network (SAN) Enclosure Monitoring

Use Scenario: Overtemperature protection in PLCs or motor drives where ambient temperature swings from –40°C to 85°C and failure must be prevented under sustained overload.

IC Role / Device Role / Timing Role: THERM pin directly drives hardware reset or power-cut circuit; ALERT pin signals host controller for predictive maintenance logging.

Use Value: Dual independent flags (THERM + ALERT/THERM2) enable tiered response-e.g., THERM initiates immediate shutdown while ALERT logs event for root-cause analysis.

Use Scenario: Multi-point thermal supervision inside 2U SAN chassis housing 24+ hot-swap SAS SSDs, where airflow patterns create localized hot zones near power supplies and backplanes.

IC Role / Device Role / Timing Role: One TMP431DDGKR per blade monitors local controller die temp and remote diode on adjacent SSD controller IC; SMBus daisy-chain reduces I²C bus loading.

Use Value: 3.4 MHz SMBus support allows full 24-device polling in <100 ms, enabling rapid thermal map updates for adaptive fan zoning algorithms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar remote/local temperature sensing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM95235CIMMX-2/NOPB10-bit resolution (0.25°C), no automatic beta compensation, supports only PNP diodes, 2-wire SMBus only (no I²C fallback)Lacks series resistance cancellation and η-factor tuning; requires manual β calibration per sensor typeLower cost for fixed-geometry industrial systems where remote sensor type is invariant and precision <0.5°C is not required.
MAX6642AESA+11-bit resolution (0.125°C), fixed η=1.008, no beta auto-ranging, supports both PNP/NPN but requires external resistor network for biasingNo diode fault detection; ALERT/THERM outputs lack reconfigurability; SMBus timeout fixed at 35 ms (vs. TMP431DDGKR's 25–35 ms programmable range)Better for legacy designs using MAXIM toolchains; acceptable where extended diagnostics and adaptive compensation are not needed.

Compared with LM95235CIMMX-2/NOPB and MAX6642AESA+, the TMP431DDGKR delivers higher resolution, autonomous compensation for modern low-beta transistors, and flexible dual-flag signaling-making it optimal for next-generation compute and storage platforms demanding robust, calibration-free thermal management.

Availability

TMP431DDGKR is available at Aetrix Electronics and suitable for server thermal management, FPGA-based accelerators, and industrial controller safety systems requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for TMP431DDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.

The TMP43x product line was designed specifically for high-accuracy, multi-point thermal monitoring in computing infrastructure-addressing the growing need for calibration-free, process-node-agnostic remote junction sensing in CPUs, GPUs, FPGAs, and ASICs.

FAQ

What is the maximum remote temperature measurement range supported by the TMP431DDGKR?

The TMP431DDGKR supports an extended remote temperature measurement range of –55°C to 150°C per its electrical specifications. While the device's internal register format allows reporting from –64°C to 191°C when extended mode is enabled, this wider range applies only to data representation-not physical sensing capability. The remote diode channel is characterized and specified for –55°C to 150°C, and accuracy degrades outside that band. The TMP431DDGKR datasheet confirms this limit in Section 6.5 and Figure 1.

Does the TMP431DDGKR require external calibration for remote temperature measurements?

No, the TMP431DDGKR does not require external calibration for remote temperature measurements. Its automatic beta compensation, η-factor correction, and series resistance cancellation features eliminate the need for per-sensor or per-board calibration. Accuracy of ±1°C over 0°C–100°C is guaranteed across multiple transistor manufacturers and PNP/NPN types without user intervention. This is explicitly stated in the Features and Description sections of the TMP431DDGKR datasheet (SBOS441I).

Can the ALERT and THERM pins of the TMP431DDGKR be used simultaneously for independent thermal events?

Yes, the TMP431DDGKR supports simultaneous use of ALERT and THERM for independent thermal events. THERM is a dedicated active-low thermal flag triggered by programmable high/low limits on either local or remote channels. ALERT/THERM2 is a reconfigurable pin: by default it functions as ALERT (for additional over/under-limit conditions), but can be set via Configuration Register 1 to act as a second independent thermal flag (THERM2). Both outputs are open-drain and require pullup resistors, enabling wired-OR sharing across multiple devices.

What is the SMBus timing compliance of the TMP431DDGKR, and does it support I²C protocols?

The TMP431DDGKR is fully compliant with SMBus 2.0 specifications, supporting clock frequencies up to 3.4 MHz (Fast Mode Plus) and timeout durations of 25–35 ms. It accepts standard SMBus commands: write byte, read byte, send byte, and receive byte. While electrically compatible with I²C (open-drain SCL/SDA, 3.3 V logic levels), it does not implement full I²C protocol features such as clock stretching or 10-bit addressing. The TMP431DDGKR datasheet specifies SMBus-only command support in Section 8.5.

How does the TMP431DDGKR handle series resistance in remote sensor traces?

The TMP431DDGKR cancels series resistance in remote sensor traces using a dual-current measurement technique. When beta compensation is disabled, it cancels up to 1 kΩof total series resistance (RS1 + RS2); when enabled, cancellation is up to 300 Ω. This eliminates temperature offset caused by PCB trace resistance or connector contact resistance without requiring external compensation networks. The method is detailed in Section 8.3.3 and Table 6-5 of the TMP431DDGKR datasheet, and is validated across production units.

TMP431DDGKR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Sensor Type:
Digital, Local/Remote
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-64°C ~ 191°C
Output Type:
SMBus
Voltage - Supply:
2.7V ~ 5.5V
Resolution:
12 b
Features:
One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Accuracy - Highest (Lowest):
±1°C (±2.5°C)
Test Condition:
0°C ~ 100°C (-40°C ~ 125°C)
Operating Temperature:
-55°C ~ 127°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
8-VSSOP

TMP431DDGKR FAQ

1.How can I place an order for TMP431DDGKR through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP431DDGKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP431DDGKR reliable?

The price and inventory of TMP431DDGKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP431DDGKR is usually 5 days.

3.What payment methods are accepted for TMP431DDGKR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP431DDGKR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP431DDGKR?

TMP431DDGKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP431DDGKR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP431DDGKR?

For technical support, including TMP431DDGKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP431DDGKR requirements.

6.How does Aetrix verify that TMP431DDGKR is sourced from the original manufacturer or authorized distributors?

All TMP431DDGKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP431DDGKR meets industry standards.

7.What is the process for return or replacement of TMP431DDGKR?

All TMP431DDGKR units undergo pre-shipment inspection (PSI). If there is an issue with TMP431DDGKR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP431DDGKR part is unused and in its original packaging.

Return procedure for TMP431DDGKR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMP431DDGKR Tags

  • TMP431DDGKR
  • TMP431DDGKR PDF
  • TMP431DDGKR Datasheet
  • TMP431DDGKR Specifications
  • TMP431DDGKR Images
  • Texas Instruments
  • Texas Instruments TMP431DDGKR
  • Buy TMP431DDGKR
  • TMP431DDGKR Price
  • TMP431DDGKR Distributor
  • TMP431DDGKR Supplier
  • TMP431DDGKR Wholesale
Related Products
MCP9700T-E/TT
MCP9700T-E/TT

Microchip Technology

MCP9700T-E/LT
MCP9700T-E/LT

Microchip Technology

MCP9701T-E/TT
MCP9701T-E/TT

Microchip Technology

MCP9701T-E/LT
MCP9701T-E/LT

Microchip Technology

TMP235A4DBZR
TMP235A4DBZR

Texas Instruments

MCP9700AT-E/TT
MCP9700AT-E/TT

Microchip Technology

MCP9700AT-E/LT
MCP9700AT-E/LT

Microchip Technology

MCP9701AT-E/LT
MCP9701AT-E/LT

Microchip Technology

MCP9701AT-E/TT
MCP9701AT-E/TT

Microchip Technology

LM335Z
LM335Z

STMicroelectronics

TMP1075NDRLR
TMP1075NDRLR

Texas Instruments

TMP1075DGKR
TMP1075DGKR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER