My Inquiry
My Account
Texas Instruments TMP432BDGSR
- Part No.:
- TMP432BDGSR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TMP432BDGSR.pdf
- Description:
- SENSOR DIGITAL -40C-125C 10VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:5,507
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMP432BDGSR from Texas Instruments is a dual-channel remote + local digital temperature sensor IC with ±1°C remote accuracy, 12-bit resolution (0.0625°C), SMBus 2.0/3.0 interface, and automatic beta compensation for PNP/NPN transistors. It monitors processor/FPGA junction temperature and die temperature in servers and industrial controllers.
For engineers reviewing the TMP432BDGSR datasheet, TMP432BDGSR pinout, TMP432BDGSR application, or TMP432BDGSR equivalent, key selection criteria include dual remote diode support, series resistance cancellation (up to 300 Ω with beta correction enabled), programmable THERM/ALERT thresholds, extended measurement range (–64°C to 191°C), and VSSOP-10 package compatibility with thermal design constraints.
Technical Context
The TMP432BDGSR implements a dual-channel analog front-end with independent DXP1/DXN1 and DXP2/DXN2 inputs for two remote diode sensors, plus an on-die local sensor. Its internal current sources support four selectable remote bias currents (6–120 μA) and auto-ranging beta correction across 0.1–27 range.
It uses SMBus-compliant timing (up to 3.4 MHz), features two open-drain digital outputs (ALERT/THERM2 and THERM), and performs series resistance cancellation by measuring voltage drop across both DXP/DXN pairs during conversion-enabling accurate remote sensing despite PCB trace resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Remote Accuracy | ±1°C over 0°C–100°C ambient, ±1.5°C over –40°C–100°C ambient - enables reliable thermal throttling without calibration |
| Local Accuracy | ±1.25°C over –40°C–125°C - sufficient for die-temperature monitoring of host processors |
| Resolution | 0.0625°C (12-bit) - supports fine-grained thermal profiling and hysteresis control |
| Supply Range | 2.7 V–5.5 V - compatible with 3.3 V and 5 V system rails without level-shifting |
| Quiescent Current | 35–45 μA at 0.0625 conversions/s - suitable for always-on thermal monitoring in low-power systems |
| Remote Channels | Two independent diode inputs (DXP1/DXN1, DXP2/DXN2) - allows simultaneous monitoring of CPU and GPU or dual-core die temps |
| SMBus Speed | Up to 3.4 MHz - supports fast polling in high-throughput server management applications |
Pinout & Package
VSSOP-10 package (3.00 mm × 3.00 mm, 0.5 mm pitch), thermally enhanced for PCB-mounted thermal sensing with exposed pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 V+ | Power supply input | Accepts 2.7–5.5 V; requires 0.1 μF local bypass capacitor for stable ADC operation |
| 2 DXP1 | Analog positive input (remote channel 1) | Connects to collector/base of PNP or emitter of NPN remote diode; bias current sourced internally |
| 3 DXN1 | Analog negative input (remote channel 1) | Completes remote diode sensing loop for channel 1; used with DXP1 for delta-VBE measurement |
| 4 DXP2 | Analog positive input (remote channel 2) | Enables concurrent monitoring of second thermal zone (e.g., memory controller or ASIC) |
| 5 DXN2 | Analog negative input (remote channel 2) | Paired with DXP2; supports independent beta compensation and series resistance cancellation per channel |
| 6 GND | Ground reference | Analog/digital common return; must be low-impedance connection to minimize measurement offset |
| 7 THERM | Digital thermal flag output | Open-drain, active-low; asserts when local or remote temp exceeds programmable THERM limit |
| 8 ALERT/THERM2 | Reconfigurable alert output | Open-drain, active-low; defaults as ALERT; can be set via register to function as second thermal flag |
| 9 SDA | SMBus bidirectional data line | Open-drain I/O; requires external pullup to V+; supports read/write byte, send/receive byte commands |
| 10 SCL | SMBus clock input | Open-drain input; requires external pullup to V+; controls timing for all SMBus transactions |
Key Features
| Feature | Design Value |
|---|---|
| Dual remote diode sensing | Simultaneous measurement of two external transistor junctions with independent configuration registers |
| Automatic beta compensation | Real-time detection and correction for beta drift across temperature (0.1–27 range), critical for sub-90nm process nodes |
| Series resistance cancellation | Compensates up to 300 Ω series resistance per channel when beta correction is enabled - eliminates PCB trace-induced offset |
| Programmable ideality factor (η) | Supports η = 1.000 or 1.008 to match physical characteristics of discrete diodes or integrated PNP transistors |
| Extended temperature range | Configurable –64°C to 191°C measurement range (via Configuration Register 1 bit 2), though diode limits remain –55°C to 150°C |
| Diode fault detection | Identifies open-circuit, short-circuit, and reverse-biased conditions on either remote channel - prevents false thermal shutdown |
Applications
| Processor Thermal Monitoring | FPGA Junction Sensing |
|---|---|
Use Scenario: Real-time die temperature tracking of multi-core x86 CPUs in 1U rack servers under variable workload. IC Role / Device Role / Timing Role: Local sensor measures SoC die temperature; DXP1/DXN1 and DXP2/DXN2 monitor CPU core and I/O die junctions via integrated PNP transistors. Use Value: Enables dynamic frequency scaling and fan control with ±1°C accuracy - reduces thermal throttling latency by >30% vs. single-channel solutions. | Use Scenario: Thermal management of high-density FPGA-based acceleration cards in AI inference servers. IC Role / Device Role / Timing Role: TMP432BDGSR acts as dedicated remote sensor hub, interfacing with two on-die PNP transistors (logic fabric and transceiver banks) via SMBus polling every 100 ms. Use Value: Dual-channel capability eliminates need for second temperature IC - saves 22 mm² PCB area and simplifies BOM while maintaining independent thermal trip points. |
| Industrial PLC Controller | Telecom Line Card |
Use Scenario: Ambient and component-level thermal supervision in DIN-rail mounted programmable logic controllers operating from –40°C to +70°C. IC Role / Device Role / Timing Role: Local sensor tracks ambient cabinet temperature; DXP1/DXN1 monitors power MOSFET junction; DXP2/DXN2 monitors Ethernet PHY IC. Use Value: Programmable ALERT and THERM outputs drive independent hardware shutdown circuits - meets IEC 61000-6-2 thermal safety requirements without software intervention. | Use Scenario: Hot-swap line card in central office telecom equipment requiring precise thermal margining across multiple ASICs. IC Role / Device Role / Timing Role: TMP432BDGSR provides three-point thermal feedback (local + two remote) to shelf manager via SMBus; THERM asserts at 85°C to trigger forced air ramp-up. Use Value: Extended –64°C to 191°C range supports cold-start validation and high-temp burn-in testing - reduces qualification cycle time by 2 weeks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel remote temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX6642AESA+ | Single remote + local channel; no beta compensation; 10-bit resolution (0.25°C); SMBus 1.1 only | Limited to one external diode; unsuitable for dual-die monitoring or sub-90nm processors | Select when cost sensitivity outweighs dual-channel requirement and beta drift is negligible |
| LM95235CIMMX | Two remote + local channels; no automatic beta compensation; supports η-factor but requires manual tuning; 11-bit resolution | Requires external calibration for beta variation; higher quiescent current (120 μA typical) | Choose if legacy SMBus 1.0 infrastructure exists and manual β configuration is acceptable |
Compared with MAX6642AESA+ and LM95235CIMMX, the TMP432BDGSR delivers true dual remote sensing with autonomous beta adaptation and finer 0.0625°C resolution - making it the only option capable of maintaining ±1°C accuracy across wide temperature swings in modern high-performance processors.
Availability
TMP432BDGSR is available at Aetrix Electronics and suitable for servers, industrial PLCs, and telecom line cards requiring stable component supply, long-term lifecycle assurance, and guaranteed traceability.
Supply support for TMP432BDGSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with over 50 years of precision sensing IP.
The TMP43x product line was designed specifically for high-accuracy, multi-point thermal monitoring in computing and communications infrastructure - addressing beta drift, series resistance, and diode non-ideality in advanced process nodes.
FAQ
What is the maximum remote temperature measurement range supported by the TMP432BDGSR?
The TMP432BDGSR supports an extended remote temperature measurement range of –64°C to 191°C when configured via bit 2 of Configuration Register 1. However, practical limits are constrained by the external diode's operational range (typically –55°C to 150°C) and the device's specified ambient operating range (–40°C to 125°C). The TMP432BDGSR achieves this range using extended binary encoding with a –64°C offset.
Does the TMP432BDGSR require external calibration for remote temperature accuracy?
No, the TMP432BDGSR does not require external calibration for remote temperature accuracy. It achieves ±1°C accuracy across multiple device manufacturers through automatic beta compensation, η-factor correction, and series resistance cancellation - all implemented in hardware without user intervention. Calibration is unnecessary because the TMP432BDGSR dynamically adapts to transistor characteristics during each conversion cycle.
How many remote diode sensors can the TMP432BDGSR monitor simultaneously?
The TMP432BDGSR can monitor two remote diode sensors simultaneously using dedicated DXP1/DXN1 and DXP2/DXN2 input pairs. Each channel operates independently with its own beta compensation, series resistance cancellation, and programmable thresholds. This dual-channel capability distinguishes the TMP432BDGSR from the single-channel TMP431 and makes it ideal for multi-die thermal management in CPUs, FPGAs, and ASICs.
What SMBus interface features does the TMP432BDGSR support?
The TMP432BDGSR supports full SMBus 2.0 and 3.0 compliance, including write byte, read byte, send byte, and receive byte commands. It operates at up to 3.4 MHz clock frequency, includes built-in timeout detection (25–35 ms), and features open-drain SCL/SDA pins requiring external pullup resistors. The TMP432BDGSR also supports multiple slave addresses and SMBus Alert Response Address (ARA) functionality for interrupt-driven thermal event handling.
Can the ALERT and THERM2 pins on the TMP432BDGSR be used independently?
Yes, the ALERT/THERM2 pin on the TMP432BDGSR is reconfigurable via Configuration Register 1. By default, it functions as an active-low ALERT output triggered by any temperature exceeding programmed limits. It can be set to operate as a second independent thermal flag (THERM2) with separate threshold registers - enabling dual-level thermal response (e.g., warning at 95°C, shutdown at 105°C) without additional hardware.
TMP432BDGSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -64°C ~ 191°C
- Output Type:
- SMBus
- Voltage - Supply:
- 2.7V ~ 5.5V
- Resolution:
- 12 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±1°C (±2.5°C)
- Test Condition:
- 0°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 127°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 10-VSSOP
TMP432BDGSR FAQ
1.How can I place an order for TMP432BDGSR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP432BDGSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP432BDGSR reliable?
The price and inventory of TMP432BDGSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP432BDGSR is usually 5 days.
3.What payment methods are accepted for TMP432BDGSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP432BDGSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP432BDGSR?
TMP432BDGSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP432BDGSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP432BDGSR?
For technical support, including TMP432BDGSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP432BDGSR requirements.
6.How does Aetrix verify that TMP432BDGSR is sourced from the original manufacturer or authorized distributors?
All TMP432BDGSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP432BDGSR meets industry standards.
7.What is the process for return or replacement of TMP432BDGSR?
All TMP432BDGSR units undergo pre-shipment inspection (PSI). If there is an issue with TMP432BDGSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP432BDGSR part is unused and in its original packaging.
Return procedure for TMP432BDGSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMP432BDGSR Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
