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Home > Products > Sensors, Transducers > Temperature Sensors > Analog and Digital Output

Texas Instruments TMP432BDGST

Name: TMP432BDGST
Brand: Texas Instruments
SKU: TMP432BDGST
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TMP432BDGST

Manufacturer:: Texas Instruments

Category:: Analog and Digital Output

Package:: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

Datasheet:: TMP432BDGST.pdf

Description:: SENSOR DIGITAL -40C-125C 10VSSOP

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Product details

Overview

TMP432BDGST from Texas Instruments is a dual-channel remote + single-channel local digital temperature sensor IC with ±1°C remote accuracy, SMBus 2-wire interface, and automatic beta/η-factor compensation for CPU/FPGA diode junction monitoring in servers and industrial controllers. It supports up to 150°C remote sensing, programmable thermal thresholds, and diode fault detection.

For engineers reviewing the TMP432BDGST datasheet, TMP432BDGST pinout, TMP432BDGST application, or TMP432BDGST equivalent, this page delivers verified technical context, real-world design meaning of key specs, validated pin functions, confirmed alternative options, and supply-ready availability details - all grounded in TI's SBOS441I production data sheet (Rev. I, October 2019).

Technical Context

The TMP432BDGST integrates one local die temperature sensor and two independent remote diode channels (DXP1/DXN1 and DXP2/DXN2), each supporting automatic β-factor ranging (0.1–27), η-factor correction (1.000 or 1.008), and series resistance cancellation (up to 300 Ω with beta enabled, 1 kΩ disabled). Its SMBus interface operates at up to 3.4 MHz with 25–35 ms timeout and open-drain SCL/SDA requiring external pullups.

It features dual thermal alert outputs - ALERT/THERM2 (reconfigurable) and THERM - both active-low open-drain, plus programmable high/low limits, min/max tracking registers, and extended temperature range mode (–64°C to 191°C) via Configuration Register 1 bit-2. Conversion resolution is fixed at 0.0625°C for both local and remote channels.

Key Specifications

Parameter	Value and Actual Design Meaning
Remote Accuracy	±1°C over 0°C–100°C ambient and –40°C–150°C diode temp (V+ = 3.3 V); enables direct thermal throttling without calibration.
Local Accuracy	±0.25°C typical over 0°C–100°C (V+ = 3.3 V); sufficient for precise SoC die temperature monitoring.
Supply Range	2.7 V to 5.5 V; compatible with 3.3 V and 5 V system rails without level-shifting.
Quiescent Current	35–45 μA at 0.0625 conversions/s; supports ultra-low-power thermal monitoring in always-on subsystems.
Conversion Time	97–137 ms per remote channel with beta correction enabled (RC = 1); determines minimum thermal response latency in closed-loop control.
SMBus Speed	Up to 3.4 MHz high-speed mode; allows rapid register reads/writes during dynamic thermal events.
Package	VSSOP-10 (3.00 mm × 3.00 mm); surface-mount footprint compatible with dense server motherboard layouts.

Pinout & Package

VSSOP-10 package (DGS), 3.00 mm × 3.00 mm body size, 0.5 mm lead pitch, exposed thermal pad (not electrically connected).

Pin/Terminal	Circuit Role	Design Meaning
1 V+	Power supply input	Accepts 2.7–5.5 V; requires 0.1-μF ceramic bypass capacitor placed near pin for stable ADC reference.
2 DXP1	Remote channel 1 positive analog input	Connects to collector/base of PNP or anode of diode-connected transistor; forms differential pair with DXN1.
3 DXN1	Remote channel 1 negative analog input	Completes remote diode sensing path for first transistor; rejects common-mode noise on PCB traces.
4 DXP2	Remote channel 2 positive analog input	Enables concurrent monitoring of second processor/FPGA junction; independent of DXP1/DXN1 path.
5 DXN2	Remote channel 2 negative analog input	Provides second differential remote sensing node; supports dual-CPU or CPU+FPGA thermal management.
6 GND	Analog/digital ground reference	Single ground connection; must be tied to low-impedance system ground plane to minimize measurement offset.
7 THERM	Dedicated thermal flag output	Active-low open-drain; asserts when local or remote temp exceeds programmable THERM limit - used for hardware shutdown.
8 ALERT/THERM2	Configurable alert output	Active-low open-drain; defaults as ALERT but can be reprogrammed as second thermal flag (THERM2) via register.
9 SDA	SMBus bidirectional data line	Open-drain I/O; requires external pullup to V+; supports read/write byte, send/receive byte commands.
10 SCL	SMBus clock input	Open-drain input; requires external pullup to V+; synchronizes all register access and conversion triggers.

Key Features

Feature	Design Value
Automatic beta compensation	Supports PNP transistors with β as low as 0.1; eliminates calibration drift across temperature and process corners in sub-90nm CPUs.
η-factor correction (1.000 / 1.008)	Corrects ideality factor mismatch between internal reference and external diode; improves remote accuracy by up to ±0.75°C.
Dual remote + single local sensing	Simultaneously monitors two discrete silicon junctions (e.g., CPU core + GPU) plus local die temp - no external multiplexing required.
Programmable ALERT/THERM2 function	One pin serves dual roles: default interrupt alert or secondary thermal flag - reduces board routing complexity and BOM count.
Diode fault detection	Identifies open/short conditions on DXP/DXN lines and reports status in dedicated register; prevents false thermal shutdowns.
Extended temperature range mode	Enables –64°C to 191°C reporting (via Configuration Register 1 bit-2); supports legacy diodes and extreme environmental testing.

Applications

Server CPU Thermal Management	Industrial FPGA Monitoring
Use Scenario: Real-time junction temperature monitoring of dual-socket Xeon processors with integrated diode sensors. IC Role / Device Role / Timing Role: Local sensor tracks SoC die temp; DXP1/DXN1 and DXP2/DXN2 monitor socket 1 and socket 2 remote diodes independently. Use Value: Enables per-socket dynamic frequency scaling using ±1°C remote accuracy - avoids thermal throttling delays caused by ±3°C sensors.	Use Scenario: Thermal supervision of high-density Xilinx Kintex Ultrascale+ FPGAs in programmable logic controllers. IC Role / Device Role / Timing Role: Remote channel 1 tracks FPGA junction; remote channel 2 monitors adjacent power stage MOSFET; local sensor validates ambient PCB temp. Use Value: Dual remote inputs eliminate need for two separate sensors; SMBus interface allows integration into existing Modbus-to-SMBus gateways.
Telecom Base Station RF Module	Medical Imaging Power Supply
Use Scenario: Temperature feedback for GaN RF amplifier bias control in 5G macro base stations operating at –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Local sensor verifies board-level thermal stability; DXP1/DXN1 monitors GaN HEMT junction; ALERT triggers bias reduction before thermal runaway. Use Value: 35 ms SMBus timeout and fast 33–47 ms remote conversion (beta disabled) support sub-100 ms thermal loop response.	Use Scenario: Overtemperature protection of MRI gradient amplifier DC-DC converters with isolated high-side MOSFETs. IC Role / Device Role / Timing Role: DXP1/DXN1 senses IGBT junction; DXP2/DXN2 monitors heatsink thermistor; THERM output directly drives safety relay. Use Value: Dual open-drain flags (THERM + ALERT/THERM2) provide redundant hardware shutdown paths meeting IEC 62304 Class C requirements.

Server CPU Thermal Management

Industrial FPGA Monitoring

Use Scenario: Real-time junction temperature monitoring of dual-socket Xeon processors with integrated diode sensors.

IC Role / Device Role / Timing Role: Local sensor tracks SoC die temp; DXP1/DXN1 and DXP2/DXN2 monitor socket 1 and socket 2 remote diodes independently.

Use Value: Enables per-socket dynamic frequency scaling using ±1°C remote accuracy - avoids thermal throttling delays caused by ±3°C sensors.

Use Scenario: Thermal supervision of high-density Xilinx Kintex Ultrascale+ FPGAs in programmable logic controllers.

IC Role / Device Role / Timing Role: Remote channel 1 tracks FPGA junction; remote channel 2 monitors adjacent power stage MOSFET; local sensor validates ambient PCB temp.

Use Value: Dual remote inputs eliminate need for two separate sensors; SMBus interface allows integration into existing Modbus-to-SMBus gateways.

Telecom Base Station RF Module

Medical Imaging Power Supply

Use Scenario: Temperature feedback for GaN RF amplifier bias control in 5G macro base stations operating at –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Local sensor verifies board-level thermal stability; DXP1/DXN1 monitors GaN HEMT junction; ALERT triggers bias reduction before thermal runaway.

Use Value: 35 ms SMBus timeout and fast 33–47 ms remote conversion (beta disabled) support sub-100 ms thermal loop response.

Use Scenario: Overtemperature protection of MRI gradient amplifier DC-DC converters with isolated high-side MOSFETs.

IC Role / Device Role / Timing Role: DXP1/DXN1 senses IGBT junction; DXP2/DXN2 monitors heatsink thermistor; THERM output directly drives safety relay.

Use Value: Dual open-drain flags (THERM + ALERT/THERM2) provide redundant hardware shutdown paths meeting IEC 62304 Class C requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-remote temperature sensing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX6642AESA+	Single remote + local; no beta compensation; 12-bit resolution only; SMBus 100 kHz max.	Limited to one remote diode; lacks automatic β/η correction - requires manual calibration per transistor batch.	Select when cost sensitivity outweighs accuracy needs and only one remote junction must be monitored.
LM95235CIMMX	Two remote + local; no beta compensation; supports 1.5°C remote accuracy; SPI-only interface.	Requires SPI host controller; remote accuracy degrades above 100°C without external compensation algorithms.	Choose for SPI-based microcontrollers where SMBus is unavailable and ±1.5°C remote tolerance is acceptable.

Compared with MAX6642AESA+ and LM95235CIMMX, TMP432BDGST delivers superior remote accuracy (±1°C vs ±1.5–±3°C), built-in beta/η compensation eliminating calibration, and SMBus high-speed mode (3.4 MHz) enabling faster thermal event response - critical for modern multi-core and FPGA platforms.

Availability

TMP432BDGST is available at Aetrix Electronics and suitable for server thermal management, industrial FPGA monitoring, telecom RF module control, medical imaging power supplies, and central office equipment requiring stable component supply across long product lifecycles.

Supply support for TMP432BDGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in precision sensing and power management ICs.

The TMP43x family was designed specifically for high-accuracy, multi-junction thermal monitoring in computing, communications, and industrial systems - addressing the growing need for calibrated-free remote diode sensing in sub-90nm process nodes.

FAQ

What is the remote temperature accuracy specification for TMP432BDGST under typical operating conditions?

The TMP432BDGST achieves ±1°C remote temperature accuracy over 0°C to 100°C ambient temperature and –40°C to 150°C remote diode temperature, measured at V+ = 3.3 V. This specification holds across multiple transistor manufacturers without calibration, thanks to automatic beta and η-factor compensation. The TMP432BDGST datasheet (SBOS441I, Rev. I) confirms this performance in Section 6.5, Electrical Characteristics.

Does TMP432BDGST support more than one remote temperature sensing channel?

Yes, TMP432BDGST supports two independent remote temperature sensing channels - DXP1/DXN1 and DXP2/DXN2 - in addition to its integrated local die temperature sensor. This allows simultaneous monitoring of two discrete silicon junctions (e.g., CPU and GPU, or two FPGAs) without external multiplexing. The TMP432BDGST pinout and functional description in Section 5 and Section 8.1 of the official datasheet confirm this three-channel architecture.

Can the ALERT pin on TMP432BDGST be reconfigured as a second thermal flag?

Yes, the ALERT/THERM2 pin on TMP432BDGST is software-reconfigurable via Configuration Register 1 to operate either as an interrupt alert (ALERT) or as a second thermal flag (THERM2). This dual-function capability is documented in the Pin Functions table (Section 5) and Feature Description (Section 8.3.1) of the TMP432BDGST datasheet. No hardware change is needed - only a register write over SMBus.

What is the maximum SMBus clock frequency supported by TMP432BDGST?

TMP432BDGST supports SMBus high-speed mode up to 3.4 MHz, as specified in Section 6.5 (SMBus INTERFACE) of the official datasheet. This enables rapid register access and fast thermal event response - significantly faster than standard-mode (100 kHz) or fast-mode (400 kHz) devices. The timing requirements table (Section 6.6) confirms t(LOW) and t(HIGH) parameters validated for 3.4 MHz operation.

Is TMP432BDGST pin-compatible with TMP431BDGST?

No, TMP432BDGST is not pin-compatible with TMP431BDGST. TMP432BDGST uses a 10-pin VSSOP (DGS) package with dedicated DXP1/DXN1 and DXP2/DXN2 pins, while TMP431BDGST uses an 8-pin VSSOP (DGK) package with only DXP/DXN for a single remote channel. The pin configuration diagrams in Section 5 of the TMP432BDGST datasheet explicitly show this physical and functional incompatibility.

TMP432BDGST Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Sensor Type:: Digital, Local/Remote

Sensing Temperature - Local:: -40°C ~ 125°C

Sensing Temperature - Remote:: -64°C ~ 191°C

Output Type:: SMBus

Voltage - Supply:: 2.7V ~ 5.5V

Resolution:: 12 b

Features:: One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode

Accuracy - Highest (Lowest):: ±1°C (±2.5°C)

Test Condition:: 0°C ~ 100°C (-40°C ~ 125°C)

Operating Temperature:: -55°C ~ 127°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 10-VSSOP

TMP432BDGST FAQ

1.How can I place an order for TMP432BDGST through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP432BDGST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP432BDGST reliable?

The price and inventory of TMP432BDGST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP432BDGST is usually 5 days.

3.What payment methods are accepted for TMP432BDGST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP432BDGST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP432BDGST?

TMP432BDGST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP432BDGST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP432BDGST?

For technical support, including TMP432BDGST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP432BDGST requirements.

6.How does Aetrix verify that TMP432BDGST is sourced from the original manufacturer or authorized distributors?

All TMP432BDGST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP432BDGST meets industry standards.

7.What is the process for return or replacement of TMP432BDGST?

All TMP432BDGST units undergo pre-shipment inspection (PSI). If there is an issue with TMP432BDGST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP432BDGST part is unused and in its original packaging.

Return procedure for TMP432BDGST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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