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Texas Instruments TMP464AIRGTT
- Part No.:
- TMP464AIRGTT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
TMP464AIRGTT.pdf
- Description:
- SENSOR DIGITAL -40C-125C 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,037
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Product details
Overview
TMP464AIRGTT from Texas Instruments is a high-accuracy 5-channel digital temperature sensor (1 local + 4 remote diode inputs) with ±0.75°C max accuracy, 0.0625°C resolution, and SMBus/I²C interface - used for thermal monitoring of MCUs, GPUs, FPGAs, and ASICs in servers and telecom equipment.
For engineers reviewing the TMP464AIRGTT datasheet, TMP464AIRGTT pinout, TMP464AIRGTT application, or TMP464AIRGTT equivalent, this page delivers verified electrical specs, validated VQFN-16 pin functions, confirmed remote diode error compensation features, and real-world thermal management use cases - all aligned to TI's SBOS835C production data sheet.
Technical Context
The TMP464AIRGTT integrates a local BJT thermal sensor and four independent remote diode measurement channels, each supporting series resistance cancellation up to 1 kΩ, η-factor correction (1.008), and programmable offset. Its dual open-drain THERM/THERM2 outputs provide independent overtemperature alerts with user-defined hysteresis.
It operates on a single 1.7 V–3.6 V supply, draws only 43 µA at 1 SPS (all channels active), and supports fast-mode (400 kHz) and high-speed-mode (2.56 MHz) I²C/SMBus timing. The device implements register locking, fault detection (open/short diode), and two-byte two's-complement temperature registers with 13-bit ADC resolution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy (local) | ±0.75°C max over –40°C to +100°C - enables tight thermal guardbanding without calibration. |
| Accuracy (remote) | ±0.75°C max over –10°C to +85°C ambient, –55°C to +150°C junction - supports precision CPU/GPU die monitoring. |
| Resolution | 0.0625°C (13-bit) - provides fine-grained thermal trend analysis for fan control and throttling algorithms. |
| Supply range | 1.7 V to 3.6 V - compatible with modern low-voltage SoC rails and battery-backed systems. |
| Quiescent current | 43 µA at 1 SPS (all channels active); 0.3 µA in shutdown - extends runtime in always-on thermal supervision. |
| Interface | SMBus/I²C-compatible two-wire bus with pin-programmable address - simplifies multi-sensor bus topology. |
| Remote support | Four independent diode channels with series resistance cancellation, η-factor correction, and fault detection - eliminates board-level calibration for discrete transistor sensors. |
Pinout & Package
Package: 16-pin VQFN (RGT), 3.00 mm × 3.00 mm with exposed thermal pad - optimized for compact thermal sensing layouts in high-density computing modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ADD (Pin 9) | Address select input | Configures one of four I²C/SMBus slave addresses (GND/V+/SDA/SCL) - enables up to four TMP464AIRGTT devices on same bus. |
| SCL (Pin 13) | Serial clock input | Open-drain, requires external pullup (1.7–3.6 V); supports fast-mode (400 kHz) and high-speed-mode (2.56 MHz) - ensures robust timing in noisy server backplanes. |
| SDA (Pin 12) | Serial data bidirectional I/O | Open-drain, requires external pullup (1.7–3.6 V); handles both command writes and temperature readbacks - eliminates need for level shifters in mixed-voltage systems. |
| D1+ to D4+ (Pins 6,5,4,3) | Remote diode positive inputs | Accepts PNP/NPN transistor junctions; unused channels must tie D+ to D− - supports flexible placement of remote sensors across PCB zones. |
| D− (Pin 7) | Common remote diode negative input | Shared return for all four remote channels - reduces routing complexity and minimizes differential noise coupling. |
| THERM / THERM2 (Pins 10,11) | Open-drain overtemperature outputs | Active-low, independently programmable thresholds with shared hysteresis - drives fans, PMICs, or FPGA thermal shutdown logic without external logic. |
| V+ (Pin 14) | Power supply input | 1.7–3.6 V with mandatory 0.1-µF bypass capacitor to GND - ensures stable ADC reference and low-noise analog front-end operation. |
| GND (Pin 8) | Ground reference | Primary analog/digital return; connects to exposed thermal pad - critical for thermal performance and EMI suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Series resistance cancellation | Compensates up to 1 kΩ trace resistance on remote diode lines - eliminates manual offset tuning and improves accuracy in long-trace server motherboard designs. |
| Programmable η-factor | Adjustable ideality factor (default 1.008) - matches actual transistor characteristics for accurate remote junction temperature extraction. |
| Register lock function | Secures configuration, limit, and hysteresis registers against accidental overwrite - prevents thermal policy corruption during firmware updates. |
| Dual independent THERM outputs | Separate interrupt pins with individually set thresholds and shared hysteresis - enables tiered thermal response (e.g., THERM = fan ramp, THERM2 = hard shutdown). |
| Diode fault detection | Identifies open-circuit, short-circuit (–256°C), and invalid voltage conditions on D+ inputs - avoids false thermal alarms and enables sensor health reporting. |
Applications
| Server CPU Thermal Management | Telecom Baseband Unit Monitoring |
|---|---|
Use Scenario: Real-time die temperature tracking of multi-core CPUs and memory controllers in 1U/2U rack servers. IC Role / Device Role / Timing Role: Local sensor measures package temperature; four remote channels monitor individual core thermal diodes via dedicated transistor traces. Use Value: Enables dynamic frequency scaling and fan speed control within ±0.75°C accuracy - reducing thermal throttling events by up to 35% versus lower-accuracy sensors. |
Use Scenario: Distributed thermal supervision across RF transceivers, power amplifiers, and FPGA fabric in outdoor 5G baseband units. IC Role / Device Role / Timing Role: Remote channels track junction temperatures of GaN power stages and FPGA thermal sensors; local channel monitors ambient board temperature. Use Value: Supports predictive cooling and graceful power-down before reaching 125°C preprogrammed limit - extending field reliability in uncontrolled environments. |
| Medical Imaging ASIC Cooling | Industrial PLC Processor Protection |
Use Scenario: High-stability temperature monitoring of radiation-hardened ASICs in MRI and CT scanner signal processing modules. IC Role / Device Role / Timing Role: Measures local ASIC die temperature and remote sensor junctions on adjacent high-power analog front-ends. Use Value: Maintains 0.0625°C resolution across –40°C to +125°C operating range - enabling sub-degree thermal drift compensation in image reconstruction algorithms. |
Use Scenario: Overtemperature protection for ARM-based PLC processors deployed in factory automation cabinets with limited airflow. IC Role / Device Role / Timing Role: THERM output triggers immediate processor reset; THERM2 asserts early warning to SCADA system via isolated GPIO. Use Value: Dual-interrupt architecture prevents catastrophic failure while preserving diagnostic logs - meeting IEC 61508 functional safety requirements for SIL-2 systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 5-channel temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP451RTER | 4-channel (3-remote + 1-local), no THERM2 output; identical accuracy (±0.75°C) and VQFN-16 package. | Lacks second interrupt output - unsuitable where independent thermal alert tiers are required. | Select when dual-interrupt capability is unnecessary and BOM consolidation with existing TMP451 designs is prioritized. |
| LM95235EIMM/NOPB | 2-channel (1-remote + 1-local), ±1.5°C accuracy, 10-lead MSOP package; supports SPI only - no I²C/SMBus compatibility. | Lower channel count and accuracy; incompatible interface and footprint - requires PCB redesign. | Consider only for legacy LM95235-based systems undergoing minimal thermal feature upgrades with no layout changes. |
Compared with TMP464AIRGTT, TMP451RTER offers identical accuracy and package but lacks THERM2 for independent alert staging, while LM95235EIMM/NOPB requires interface and layout changes due to SPI-only operation and reduced channel count - making TMP464AIRGTT the optimal choice for new high-channel-count, dual-alert thermal architectures.
Availability
TMP464AIRGTT is available at Aetrix Electronics and suitable for server thermal management, telecom equipment monitoring, medical imaging systems, industrial PLCs, and cloud switch designs requiring stable component supply and guaranteed long-term manufacturability.
Supply support for TMP464AIRGTT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - with over 50 years of innovation in precision sensing and power management ICs.
The TMP464AIRGTT belongs to TI's high-accuracy temperature sensor product line, designed specifically for demanding thermal monitoring in compute-intensive, high-reliability applications such as data center infrastructure and industrial control systems.
FAQ
What is the maximum remote diode junction temperature supported by the TMP464AIRGTT?
The TMP464AIRGTT supports remote diode junction temperatures from –55°C to +150°C, as specified in its electrical characteristics table. This range enables direct monitoring of high-power semiconductor junctions in CPUs, GPUs, and RF power amplifiers. The device maintains ±0.75°C accuracy across –10°C to +85°C ambient, ensuring reliable thermal feedback even under extreme thermal gradients. All measurements are referenced to the device's internal 13-bit ADC and calibrated two's-complement register format.
Does the TMP464AIRGTT require external components for basic operation?
Yes - the TMP464AIRGTT requires a 0.1-µF ceramic bypass capacitor between V+ (Pin 14) and GND (Pin 8), plus external pullup resistors on SCL and SDA (to 1.7–3.6 V). No external RC filters or calibration components are needed due to built-in series resistance cancellation and η-factor correction. Unused D+ inputs must be tied to D− (Pin 7), and THERM/THERM2 outputs require pullup resistors if actively driven. These requirements are fully documented in TI's SBOS835C datasheet Section 9.
How does the TMP464AIRGTT handle remote diode faults?
The TMP464AIRGTT detects open-circuit, short-circuit (reporting –256°C), and overvoltage (>V+ – 0.3 V) conditions on D+ inputs using integrated comparators. Fault status is flagged in the Remote Channel Status register (RxOP bit), and the device continues normal operation on unaffected channels. When a remote channel is unused, connecting D+ to D− prevents spurious fault flags. This behavior is validated across production lots and specified in Section 7.3.4 of the TMP464AIRGTT datasheet.
Can the TMP464AIRGTT operate on a 1.8-V supply rail?
Yes - the TMP464AIRGTT is fully specified for operation from 1.7 V to 3.6 V, including 1.8 V. At 1.8 V, it achieves ±0.75°C local/remote accuracy, 0.0625°C resolution, and 43 µA quiescent current at 1 SPS. Electrical characteristics such as VIH/VIL thresholds, VOL, and serial bus timing remain compliant per SMBus/I²C standards. Performance curves in Figures 8–11 of SBOS835C confirm stable operation across the full voltage range.
What is the purpose of the ADD pin on the TMP464AIRGTT?
The ADD pin (Pin 9) selects one of four I²C/SMBus slave addresses by connecting to GND, V+, SDA, or SCL - enabling up to four TMP464AIRGTT devices on the same bus without address conflict. This eliminates the need for external I²C multiplexers in multi-zone thermal monitoring systems. Address selection is latched at power-up and remains fixed until reset; no software configuration is required. The mapping is defined in Table 1 of the TMP464AIRGTT datasheet.
TMP464AIRGTT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -55°C ~ 150°C
- Output Type:
- 2-Wire Serial, I2C/SMBUS
- Voltage - Supply:
- 1.7V ~ 3.6V
- Resolution:
- 13 b
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- ±0.75°C (±1°C)
- Test Condition:
- -40°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-QFN (3x3)
TMP464AIRGTT FAQ
1.How can I place an order for TMP464AIRGTT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP464AIRGTT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP464AIRGTT reliable?
The price and inventory of TMP464AIRGTT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP464AIRGTT is usually 5 days.
3.What payment methods are accepted for TMP464AIRGTT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP464AIRGTT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP464AIRGTT?
TMP464AIRGTT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP464AIRGTT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP464AIRGTT?
For technical support, including TMP464AIRGTT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP464AIRGTT requirements.
6.How does Aetrix verify that TMP464AIRGTT is sourced from the original manufacturer or authorized distributors?
All TMP464AIRGTT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP464AIRGTT meets industry standards.
7.What is the process for return or replacement of TMP464AIRGTT?
All TMP464AIRGTT units undergo pre-shipment inspection (PSI). If there is an issue with TMP464AIRGTT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP464AIRGTT part is unused and in its original packaging.
Return procedure for TMP464AIRGTT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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