Texas Instruments TMP468AIRGTR
- Part No.:
- TMP468AIRGTR
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
TMP468AIRGTR.pdf
- Description:
- SENSOR DIGITAL -40C-125C 16VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMP468AIRGTR from Texas Instruments is a 9-channel (1-local + 8-remote) high-accuracy digital temperature sensor in a 16-pin VQFN package, operating from 1.7 V to 3.6 V supply, delivering ±0.75°C remote accuracy and 0.0625°C resolution for thermal monitoring of multi-core processors and FPGAs in servers and telecom equipment.
For engineers reviewing the TMP468AIRGTR datasheet, TMP468AIRGTR pinout, TMP468AIRGTR application, or TMP468AIRGTR equivalent, this page provides verified pin functions, real-world thermal zone mapping, SMBus/I²C interface timing constraints, and validated alternative parts for system-level thermal management design.
Technical Context
The TMP468AIRGTR integrates a local BJT sensor and eight independent remote diode measurement channels with programmable η-factor correction, series resistance cancellation up to 1 kΩ, and dual open-drain THERM/THERM2 outputs for overtemperature event signaling. It supports two-wire communication at up to 2.56 MHz (high-speed mode) with 0.0625°C resolution across all nine zones.
Each channel features independently configurable high/low temperature thresholds and hysteresis registers, enabling zone-specific thermal throttling decisions without host processor intervention. The device uses a 13-bit ADC with two's-complement output format and includes register lock functionality to prevent accidental configuration changes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Channels | 9 total: 1 local + 8 remote diode inputs - enables simultaneous thermal profiling across CPU, GPU, memory, and ASIC zones |
| Accuracy (Remote) | ±0.75°C max over –55°C to +150°C junction range - meets tight guard-band requirements for server thermal control |
| Resolution | 0.0625°C per LSB - supports fine-grained temperature trending and predictive fan speed control |
| Supply Range | 1.7 V to 3.6 V - compatible with modern low-voltage I/O domains and eliminates need for level-shifting |
| Interface | SMBus/I²C-compatible two-wire bus with pin-programmable address - allows up to four devices on same bus without address conflict |
| Quiescent Current | 67 µA at 1 SPS (all channels active) - minimizes impact on system power budget during continuous monitoring |
| Shutdown Current | 0.3 µA - enables ultra-low-power thermal supervision during system sleep states |
Pinout & Package
Package: 16-pin VQFN (RGT), 3.0 mm × 3.0 mm body size, exposed thermal pad - optimized for thermal dissipation and PCB space efficiency in dense compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1+ to D8+ | Analog input (positive) | Eight dedicated remote diode anode connections - each supports independent η-factor, offset, and series resistance compensation |
| D− | Analog input (common cathode) | Shared negative terminal for all eight remote channels - simplifies PCB routing and reduces component count |
| V+ | Power supply | 1.7–3.6 V analog/digital supply requiring 0.1 µF bypass capacitor - powers internal reference, ADC, and logic |
| GND | Ground | Primary return path for analog and digital circuits - must be connected to low-impedance system ground plane |
| SCL | Digital input | I²C/SMBus clock line - requires external pullup resistor to 1.7–3.6 V; supports fast-mode (400 kHz) and high-speed mode (2.56 MHz) |
| SDA | Bidirectional I/O | I²C/SMBus data line - open-drain, requires external pullup; handles command writes and temperature register reads |
| THERM / THERM2 | Digital output | Active-low, open-drain overtemperature alerts - each configurable to trigger on local or any remote zone exceeding programmed limit |
| ADD | Digital input | Address select pin - sets one of four I²C addresses by connecting to GND, V+, SDA, or SCL |
Key Features
| Feature | Design Value |
|---|---|
| Series resistance cancellation | Compensates up to 1 kΩ trace resistance on remote diode lines - eliminates calibration overhead and improves accuracy in long-trace applications |
| Programmable η-factor | Adjusts ideality factor per remote channel (default 1.008) - corrects for transistor non-ideality across process/voltage/temperature variations |
| Dual independent THERM outputs | Two open-drain outputs with separate threshold/hysteresis registers - enables prioritized thermal responses (e.g., THERM for shutdown, THERM2 for fan ramp) |
| Register lock function | Hardware-enforced write protection for critical configuration registers - prevents unintended modification during runtime or firmware updates |
| Remote diode fault detection | Automatically flags open-circuit, short-circuit, or reverse-biased conditions on D+/D− lines - improves system reliability and diagnostics |
Applications
| Server CPU Thermal Monitoring | GPU and FPGA Junction Sensing |
|---|---|
Use Scenario: Real-time temperature tracking of multiple cores and cache units within a single x86 CPU die using embedded diodes. IC Role / Device Role / Timing Role: Local sensor measures die temperature; remote channels monitor individual core junctions via dedicated diode outputs. Use Value: Enables dynamic voltage/frequency scaling (DVFS) with ±0.75°C accuracy, reducing thermal throttling latency and improving compute throughput. |
Use Scenario: Simultaneous thermal profiling of GPU shader clusters and FPGA fabric regions in AI accelerators. IC Role / Device Role / Timing Role: Eight remote channels map to discrete transistor junctions across heterogeneous compute units; local sensor tracks package ambient. Use Value: Supports per-unit thermal capping with 0.0625°C resolution, preventing localized hotspots while maximizing performance density. |
| Telecom Baseband Unit Cooling | Data Center SSD Controller Thermal Guarding |
Use Scenario: Monitoring power amplifier (PA) bias transistors and baseband ASIC junctions in 5G massive MIMO radio units. IC Role / Device Role / Timing Role: Remote channels track PA transistor junctions; THERM output drives cooling fans via PWM controller. Use Value: Maintains RF linearity under thermal stress by triggering fan response within 100 ms of threshold breach, using hardware-based alert path. |
Use Scenario: Thermal supervision of NVMe SSD controller ICs and NAND flash packages in high-density storage arrays. IC Role / Device Role / Timing Role: Local sensor monitors SSD board ambient; remote channels track controller die and NAND package junctions. Use Value: Prevents write endurance degradation by initiating thermal throttling before NAND junction exceeds 85°C, using dual THERM outputs for staged response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-zone temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP451AIRTER | 8-channel (0-local + 8-remote), ±0.75°C accuracy, 1.7–3.6 V, but lacks local sensor and THERM2 output | Requires external local sensor for ambient reference; unsuitable where on-die local measurement is mandatory | Select when only remote junction monitoring is needed and board space is constrained - smaller 12-pin WSON package |
| LM95235EIMMX/NOPB | 2-channel (1-local + 1-remote), ±1.0°C accuracy, 3.0–3.6 V supply, no series resistance cancellation or η-factor tuning | Limited to dual-zone monitoring; cannot scale to multi-processor systems requiring >2 thermal zones | Choose for cost-sensitive industrial controllers where single-CPU thermal management suffices and advanced compensation is unnecessary |
Compared with TMP468AIRGTR, TMP451AIRTER offers higher channel density per mm² but omits local sensing and dual-alert capability, while LM95235EIMMX/NOPB provides simpler integration at the expense of accuracy, flexibility, and scalability - making TMP468AIRGTR optimal for complex, high-reliability thermal architectures.
Availability
TMP468AIRGTR is available at Aetrix Electronics and suitable for server thermal management, telecom baseband unit cooling, and high-performance computing applications requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for TMP468AIRGTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision sensing, power management, and signal chain solutions.
The TMP468AIRGTR belongs to TI's high-accuracy temperature sensor product line, designed specifically for thermal monitoring in multi-processor systems where tight accuracy, low power, and robust remote diode compensation are critical.
FAQ
What is the maximum remote junction temperature supported by the TMP468AIRGTR?
The TMP468AIRGTR supports remote diode junction temperatures from –55°C to +150°C, as specified in the Recommended Operating Conditions table. This range enables reliable thermal monitoring of high-power components such as CPUs, GPUs, and RF power amplifiers under extreme operational conditions. The device maintains ±0.75°C accuracy across this full range when used with appropriate remote transistor selection and layout practices.
Does the TMP468AIRGTR require external components for basic operation?
Yes, the TMP468AIRGTR requires a 0.1 µF ceramic bypass capacitor between V+ and GND, plus pullup resistors on SCL and SDA lines (to 1.7–3.6 V). The THERM and THERM2 outputs also require external pullup resistors if used. No external compensation components are needed for series resistance cancellation or η-factor correction - these functions are fully integrated and programmable within the TMP468AIRGTR.
How many unique I²C addresses does the TMP468AIRGTR support?
The TMP468AIRGTR supports four unique I²C addresses, selected via the ADD pin tied to GND, V+, SDA, or SCL. This allows up to four TMP468AIRGTR devices to share the same two-wire bus without address conflict - essential for large-scale thermal monitoring in multi-slot servers or modular telecom chassis where each slot requires independent temperature visibility.
Can the TMP468AIRGTR measure temperature without a remote diode?
Yes, the TMP468AIRGTR can operate using only its local BJT temperature sensor even when all eight remote channels are unused. In this configuration, D1+ through D8+ must be left unconnected or tied to D− as specified, and the device delivers ±0.75°C local accuracy over –40°C to +125°C ambient. The local sensor remains fully functional for ambient or package-level thermal monitoring without any remote diode present.
What is the conversion time per channel for the TMP468AIRGTR in one-shot mode?
In one-shot conversion mode, the TMP468AIRGTR requires 16–17 ms per channel (local or remote), as documented in the Electrical Characteristics table. This timing applies to each individual measurement cycle and is consistent across all nine channels. For continuous monitoring of all channels, total conversion time scales linearly - e.g., measuring all eight remote channels plus local takes approximately 152–153 ms at default settings.
TMP468AIRGTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -64°C ~ 191°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 1.7V ~ 3.6V
- Resolution:
- 0.0625°C
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±0.75°C
- Test Condition:
- -40°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-VQFN (3x3)
TMP468AIRGTR FAQ
1.How can I place an order for TMP468AIRGTR through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP468AIRGTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP468AIRGTR reliable?
The price and inventory of TMP468AIRGTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP468AIRGTR is usually 5 days.
3.What payment methods are accepted for TMP468AIRGTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP468AIRGTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP468AIRGTR?
TMP468AIRGTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP468AIRGTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP468AIRGTR?
For technical support, including TMP468AIRGTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP468AIRGTR requirements.
6.How does Aetrix verify that TMP468AIRGTR is sourced from the original manufacturer or authorized distributors?
All TMP468AIRGTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP468AIRGTR meets industry standards.
7.What is the process for return or replacement of TMP468AIRGTR?
All TMP468AIRGTR units undergo pre-shipment inspection (PSI). If there is an issue with TMP468AIRGTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP468AIRGTR part is unused and in its original packaging.
Return procedure for TMP468AIRGTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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