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Texas Instruments TMP468AIRGTT
- Part No.:
- TMP468AIRGTT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
TMP468AIRGTT.pdf
- Description:
- SENSOR DIGITAL -40C-125C 16VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,080
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Product details
Overview
TMP468AIRGTT from Texas Instruments is a 9-channel (1-local + 8-remote) high-accuracy digital temperature sensor in a 16-pin VQFN package, operating from 1.7 V to 3.6 V supply. It delivers ±0.75°C remote and local accuracy over –40°C to +125°C ambient, 0.0625°C resolution, and supports SMBus/I²C interface with pin-programmable address for thermal monitoring of multi-core processors and FPGAs in servers and telecom equipment.
For engineers reviewing the TMP468AIRGTT datasheet, TMP468AIRGTT pinout, TMP468AIRGTT application, or TMP468AIRGTT equivalent, this page provides verified technical context, validated pin functions, confirmed remote diode measurement capabilities across eight zones, and real-world thermal management use cases in high-density computing systems.
Technical Context
The TMP468AIRGTT integrates a local BJT sensor and eight independent remote diode channels with series resistance cancellation (up to 1 kΩ), η-factor correction (1.008), and programmable offset per channel. Its dual THERM/THERM2 open-drain outputs support independent overtemperature shutdown or fan control based on zone-specific thresholds with hysteresis.
It uses a 13-bit ADC with 0.0625°C resolution per channel, operates at conversion rates up to 16 Hz per channel, and achieves 67 µA typical active current (1 SPS, all channels active) and 0.3 µA shutdown current - enabling low-power thermal supervision in space-constrained embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy (local) | ±0.75°C max over –40°C to +125°C ambient; enables tight thermal guard-banding in CPU/GPU thermal throttling. |
| Accuracy (remote) | ±0.75°C max over –55°C to +150°C junction range; supports reliable die-level sensing for ASICs and FPGAs. |
| Resolution | 0.0625°C per LSB; allows precise threshold setting for fine-grained thermal event detection. |
| Supply range | 1.7 V to 3.6 V; compatible with modern low-voltage SoC rails and battery-backed systems. |
| Interface | SMBus/I²C-compatible two-wire bus with pin-selectable address; eliminates bus contention in multi-sensor configurations. |
| Power consumption | 67 µA typical active current (1 SPS, all 9 channels); reduces system-level power budget impact in always-on monitoring. |
| Remote channels | 8 independent diode inputs (D1+ to D8+) with shared D–; supports distributed thermal mapping across complex PCBs. |
Pinout & Package
Package: 16-pin VQFN (RGT), 3.0 mm × 3.0 mm body, exposed thermal pad. Compatible with standard reflow profiles and high-density layout requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1+ to D8+ | Analog input (positive) | Eight dedicated remote diode anode connections; each supports independent η-factor, offset, and limit programming. |
| D– | Analog input (negative) | Common cathode return for all 8 remote channels; simplifies routing and minimizes crosstalk. |
| V+ | Power supply | 1.7–3.6 V input requiring 0.1 µF bypass capacitor; powers internal ADC, oscillator, and interface logic. |
| GND | Ground | Reference for analog and digital circuits; must be connected to low-impedance system ground plane. |
| SCL / SDA | Digital I/O (I²C/SMBus) | Open-drain bus lines requiring external pullups; support fast-mode (400 kHz) and high-speed mode (2.56 MHz). |
| ADD | Digital input | Address select pin; sets one of four I²C addresses by connecting to GND, V+, SDA, or SCL. |
| THERM / THERM2 | Digital output | Active-low open-drain thermal alert outputs; independently configurable for local/remote zone overtemperature events. |
Key Features
| Feature | Design Value |
|---|---|
| Series resistance cancellation | Compensates up to 1 kΩ series resistance in remote diode traces, eliminating calibration overhead and improving field accuracy. |
| Programmable η-factor | Adjustable ideality factor (default 1.008) per remote channel to match transistor characteristics of diverse ICs (e.g., CPUs, GPUs, ASICs). |
| Dual independent thermal alerts | THERM and THERM2 outputs support separate trip thresholds and hysteresis, enabling tiered response (e.g., fan ramp vs. hard shutdown). |
| Register lock function | Hardware-protected write access to critical configuration registers prevents accidental modification during system operation. |
| Low quiescent current | 67 µA active (1 SPS, all channels), 0.3 µA shutdown - extends battery life in portable thermal monitors and IoT edge nodes. |
Applications
| Server CPU Thermal Management | Telecom Baseband Unit Monitoring |
|---|---|
Use Scenario: Real-time temperature tracking across multiple CPU cores, memory controllers, and PCIe switches within a 1U rack server. IC Role / Device Role / Timing Role: Local sensor measures die temperature; eight remote channels monitor discrete voltage regulators, FPGA junctions, and ASIC hotspots via external diodes. Use Value: Enables dynamic frequency scaling and fan speed control with ±0.75°C accuracy, reducing thermal derating and improving compute density. |
Use Scenario: Distributed thermal supervision of RF transceivers, power amplifiers, and baseband processors in 5G macro cell sites. IC Role / Device Role / Timing Role: Remote channels track junction temperatures of GaN power stages and FPGA accelerators; local sensor monitors ambient board temperature. Use Value: Prevents thermal runaway under sustained transmit load by triggering THERM2-based power reduction before reaching 125°C ambient limit. |
| Medical Imaging FPGA Thermal Control | Industrial PLC Processor Safety Monitoring |
Use Scenario: High-precision thermal feedback loop for cooling control in MRI/FPGA-based image reconstruction modules. IC Role / Device Role / Timing Role: Eight remote channels monitor individual FPGA banks and ADC/DAC signal chain ICs; local sensor validates cold plate interface. Use Value: Maintains <±0.5°C stability across imaging acquisition cycles, preventing thermal drift-induced image artifacts. |
Use Scenario: Redundant thermal safety monitoring for dual-core ARM processors in SIL-2-rated industrial PLCs. IC Role / Device Role / Timing Role: Local sensor verifies processor package temperature; remote channels monitor isolated I/O driver junctions and power supply MOSFETs. Use Value: Dual THERM outputs feed independent safety controllers, satisfying IEC 61508 fault coverage requirements for thermal failure detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-zone temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMP451RGTT | 8-channel (no local sensor), ±0.75°C remote accuracy, same VQFN-16 package and I²C interface. | Lacks local temperature measurement; requires external local sensor for full-system coverage. | Select when only remote diode monitoring is needed and board space is constrained - identical footprint but reduced functionality. |
| LM95235EVAL/NOPB | 2-channel (1 local + 1 remote), ±1.0°C accuracy, 10-bit resolution, SOIC-8 package. | Supports only one remote zone; lower resolution (0.25°C) and accuracy limit use in precision multi-processor systems. | Choose for cost-sensitive, low-channel-count applications where single-point remote monitoring suffices and higher accuracy is not required. |
Compared with TMP468AIRGTT, TMP451RGTT omits local sensing but retains identical remote performance and footprint, while LM95235EVAL/NOPB trades channel count, resolution, and accuracy for lower cost and simpler integration in basic thermal protection roles.
Availability
TMP468AIRGTT is available at Aetrix Electronics and suitable for server thermal management, telecom baseband units, medical imaging systems, and industrial PLCs requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for TMP468AIRGTT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision sensing and power management ICs.
The TMP468AIRGTT belongs to TI's high-accuracy temperature sensor product line, designed specifically for thermal monitoring in high-performance computing, networking, and industrial systems where multi-point, sub-degree accuracy is mission-critical.
FAQ
What is the maximum remote diode junction temperature supported by the TMP468AIRGTT?
The TMP468AIRGTT supports remote diode junction temperatures from –55°C to +150°C, as specified in the Recommended Operating Conditions table. This range enables direct monitoring of high-power components such as GaN FETs, GPU dies, and RF power amplifiers without external signal conditioning. The device maintains ±0.75°C accuracy across this full range when used with appropriate diode selection and PCB layout per TI's design guidelines.
Does the TMP468AIRGTT require external components for basic operation?
Yes - the TMP468AIRGTT requires a 0.1 µF ceramic bypass capacitor between V+ and GND, plus pullup resistors on SCL and SDA lines (typically 2.2–10 kΩ to 1.7–3.6 V). THERM and THERM2 outputs also need pullup resistors if actively used. No external RC networks or calibration components are needed due to built-in series resistance cancellation and η-factor correction - simplifying bill-of-materials and layout.
How many unique I²C addresses does the TMP468AIRGTT support?
The TMP468AIRGTT supports four unique I²C addresses, selected via the ADD pin: tied to GND (0x48), V+ (0x49), SDA (0x4A), or SCL (0x4B). This enables up to four TMP468AIRGTT devices on a single bus without address conflict - ideal for large-scale thermal monitoring in multi-board server chassis or modular telecom systems.
Can the TMP468AIRGTT measure temperature without a remote diode connected?
Yes - the TMP468AIRGTT provides accurate local temperature measurement using its integrated BJT sensor even with all remote channels unconnected. Unused remote inputs (D1+ to D8+) must be tied to D– per datasheet guidance, but the local channel remains fully functional. This allows standalone ambient monitoring or use as a backup sensor in fail-safe thermal architectures.
What is the conversion time per channel for the TMP468AIRGTT?
The TMP468AIRGTT requires 16–17 ms per channel for a complete ADC conversion in one-shot mode, as specified in the Electrical Characteristics table. With all nine channels (1 local + 8 remote) enabled sequentially, a full system scan takes approximately 153 ms. Conversion rate is programmable down to 1 SPS per channel to optimize power versus update rate trade-offs in battery-powered applications.
TMP468AIRGTT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local/Remote
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -64°C ~ 191°C
- Output Type:
- I2C/SMBus
- Voltage - Supply:
- 1.7V ~ 3.6V
- Resolution:
- 0.0625°C
- Features:
- One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±0.75°C
- Test Condition:
- -40°C ~ 100°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-VQFN (3x3)
TMP468AIRGTT FAQ
1.How can I place an order for TMP468AIRGTT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP468AIRGTT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP468AIRGTT reliable?
The price and inventory of TMP468AIRGTT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP468AIRGTT is usually 5 days.
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TMP468AIRGTT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP468AIRGTT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP468AIRGTT?
For technical support, including TMP468AIRGTT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP468AIRGTT requirements.
6.How does Aetrix verify that TMP468AIRGTT is sourced from the original manufacturer or authorized distributors?
All TMP468AIRGTT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP468AIRGTT meets industry standards.
7.What is the process for return or replacement of TMP468AIRGTT?
All TMP468AIRGTT units undergo pre-shipment inspection (PSI). If there is an issue with TMP468AIRGTT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP468AIRGTT part is unused and in its original packaging.
Return procedure for TMP468AIRGTT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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