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Texas Instruments TMP468AIYFFR

Part No.:
TMP468AIYFFR
Manufacturer:
Texas Instruments
Category:
Analog and Digital Output
Package:
16-UFBGA, DSBGA
Datasheet:
AetrixTMP468AIYFFR.pdf
Description:
SENSOR DIGITAL -40C-125C 16DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,327

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Product details

Overview

TMP468AIYFFR from Texas Instruments is a 9-channel (1-local + 8-remote) high-accuracy digital temperature sensor in a 16-bump DSBGA package (1.6 mm × 1.6 mm), operating from 1.7 V to 3.6 V supply, delivering ±0.75°C remote accuracy and 0.0625°C resolution for thermal monitoring of MCUs, GPUs, and FPGAs in servers and telecom equipment.

For engineers reviewing the TMP468AIYFFR datasheet, TMP468AIYFFR pinout, TMP468AIYFFR application, or TMP468AIYFFR equivalent, this page provides verified pin functions, real-world thermal measurement performance, SMBus/I²C interface timing constraints, series resistance cancellation capability up to 1 kΩ, and validated alternative options for multi-zone system thermal management.

Technical Context

The TMP468AIYFFR integrates a local BJT sensor and eight independent remote diode channels with dedicated analog front-end circuitry per channel, including η-factor correction (1.008), offset calibration, and programmable thresholds with hysteresis. Its two-wire interface supports I²C/SMBus fast mode (400 kHz) and high-speed mode (2.56 MHz), with pin-programmable address via ADD pin.

Each remote channel uses differential sensing across D+ and D– terminals, with built-in series resistance cancellation (up to 1 kΩ) and fault detection logic. The device implements register locking to secure configuration registers and supports shutdown current as low as 0.3 µA while maintaining bus activity awareness.

Key Specifications

Parameter Value and Actual Design Meaning
Temperature Channels9 total: 1 local + 8 remote diode zones - enables simultaneous thermal mapping across CPU, GPU, ASIC, and memory subsystems
Accuracy (Remote)±0.75°C max over –10°C to 50°C ambient, –55°C to 150°C remote junction - meets tight guard-band requirements in high-performance computing
Resolution0.0625°C (13-bit) - supports fine-grained thermal throttling decisions and precise fan-speed control
Supply Range1.7 V to 3.6 V - compatible with modern low-voltage SoC rails and battery-backed systems
Operating Current67 µA at 1 SPS (all channels active) - minimizes impact on system power budget during continuous monitoring
Shutdown Current0.3 µA - enables ultra-low-power thermal supervision in always-on standby modes
InterfaceSMBus/I²C-compatible two-wire, pin-selectable address - simplifies integration into existing bus architectures without address conflicts
Series Resistance CancellationUp to 1 kΩ - eliminates PCB trace resistance-induced error without external calibration or compensation firmware

Pinout & Package

Package: 16-bump DSBGA (YFF), 1.60 mm × 1.60 mm, bottom-side ball layout with thermal pad.

Pin/Terminal Circuit Role Design Meaning
ADDDigital inputAddress select: sets I²C/SMBus slave address to one of four values (GND/V+/SDA/SCL) - enables multiple sensors on same bus
D1+ to D8+Analog input (x8)Positive inputs for remote diode sensors - each connects to emitter/base of external NPN/PNP transistor or diode-connected MOSFET
D−Analog inputCommon negative reference for all 8 remote channels - must be connected to collector/source of all remote sensors
GNDGroundSupply return path - requires low-inductance connection to system ground plane for noise immunity
SCLDigital inputSerial clock line - open-drain, requires external pull-up to 1.7–3.6 V; supports fast/high-speed modes up to 2.56 MHz
SDABidirectional I/OSerial data line - open-drain, requires external pull-up; handles command writes and temperature register reads
THERM / THERM2Digital output (x2)Active-low, open-drain overtemperature alerts - independently configurable per zone with hysteresis to prevent chatter
V+Power supply1.7–3.6 V main supply - requires 0.1 µF ceramic bypass capacitor placed adjacent to pin for ADC stability
THERM2Digital outputSecond independent thermal alert output - allows separate fan control and system shutdown signaling paths

Key Features

Feature Design Value
8-remote + 1-local channel architectureEnables full-system thermal profiling without external multiplexing or multiple discrete sensors
Programmable η-factor (1.008)Compensates for non-ideal transistor behavior in remote diodes - improves accuracy across process/voltage/temperature corners
Per-channel dual temperature thresholdsSupports hierarchical thermal response: warning (THERM2), critical shutdown (THERM), with user-defined hysteresis
Register lock functionPrevents accidental overwrite of critical configuration registers (e.g., limits, η-factor, offset) during runtime
Diode fault detectionIdentifies open-circuit, short-circuit, or reversed diode connections - avoids false temperature readings in field deployments
Low-voltage operation (1.7 V)Allows direct interfacing with 1.8 V I/O domains and battery-powered edge devices without level-shifting

Applications

Server CPU Thermal Management Telecom Baseband Unit Monitoring

Use Scenario: Real-time temperature tracking of multi-core CPUs, memory controllers, and PCIe switches in 1U/2U rack servers.

IC Role / Device Role / Timing Role: Local sensor monitors die temperature; 8 remote channels track VRM hotspots, DIMM banks, and FPGA accelerators.

Use Value: Enables dynamic frequency scaling and fan speed control with ±0.75°C accuracy - reduces thermal derating and extends component lifetime.

Use Scenario: Thermal supervision of RF transceivers, power amplifiers, and baseband processors in 5G macrocells and small cells.

IC Role / Device Role / Timing Role: Remote channels monitor discrete GaN HEMTs and SiGe MMICs; local sensor tracks SoC junction temperature.

Use Value: Supports adaptive RF power back-off before thermal shutdown - maintains link reliability under sustained transmit load.

Medical Imaging FPGA Thermal Control Industrial PLC Processor Monitoring

Use Scenario: High-resolution CT/MRI scanner subsystems where FPGA-based image reconstruction engines generate localized heat spikes.

IC Role / Device Role / Timing Role: Dedicated remote channels assigned to FPGA banks, DDR4 PHYs, and power delivery stages; local sensor tracks FPGA die.

Use Value: 0.0625°C resolution enables predictive thermal margining - prevents image artifact generation due to timing skew from thermal drift.

Use Scenario: Temperature surveillance of ARM Cortex-A cores, industrial Ethernet PHYs, and isolated I/O drivers in DIN-rail mounted PLCs.

IC Role / Device Role / Timing Role: Remote channels monitor field-side analog front-ends and isolated power supplies; local sensor tracks processor junction.

Use Value: Dual THERM/THERM2 outputs drive independent cooling fans and safety cutoff relays - satisfies IEC 61508 functional safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-zone temperature sensing applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMP451RTVT8-channel remote + 1-local, but only ±1.0°C remote accuracy; 16-pin WQFN (3 mm × 3 mm); no series resistance cancellationLacks 1 kΩ series resistance cancellation and η-factor tuning - requires manual calibration for PCB trace resistanceChoose when cost sensitivity outweighs need for highest accuracy and automated compensation.
LM95235CIMMX2-channel remote + 1-local; ±1.5°C remote accuracy; 8-pin MSOP; SMBus-only interface; no THERM2 outputHalf the channel count and no second thermal alert output - insufficient for complex multi-processor systemsChoose only for simple dual-sensor applications where footprint and bill-of-materials are primary constraints.

Compared with TMP468AIYFFR, TMP451RTVT trades accuracy and compensation features for lower cost, while LM95235CIMMX offers minimal channel count and no redundancy in thermal alert signaling - neither matches the integrated 9-zone precision, series resistance immunity, or dual-alert capability required for high-reliability compute platforms.

Availability

TMP468AIYFFR is available at Aetrix Electronics and suitable for server thermal management, 5G infrastructure, medical imaging electronics, and industrial PLCs requiring stable component supply across extended product lifecycles.

Supply support for TMP468AIYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of thermal sensing innovation.

The TMP468AIYFFR belongs to TI's high-accuracy temperature sensor product line, designed specifically for multi-point thermal monitoring in space-constrained, high-performance computing and communications systems.

FAQ

What is the maximum remote junction temperature supported by the TMP468AIYFFR?

The TMP468AIYFFR supports remote diode junction temperatures from –55°C to +150°C, as specified in the Recommended Operating Conditions table. This range enables reliable thermal monitoring of high-power components such as GaN transistors, GPU voltage regulators, and RF power amplifiers without sensor saturation or measurement clipping. The TMP468AIYFFR maintains its ±0.75°C accuracy specification across this full remote junction range when used within the stated ambient conditions.

Does the TMP468AIYFFR require external components for basic operation?

Yes - the TMP468AIYFFR requires a 0.1 µF ceramic bypass capacitor between V+ and GND, pull-up resistors on SCL and SDA lines (to 1.7–3.6 V), and pull-up resistors on THERM/THERM2 outputs if actively used. No external RC filters or calibration components are needed due to built-in series resistance cancellation and η-factor correction. The TMP468AIYFFR operates fully functional with only these minimal passive components.

How does the series resistance cancellation feature work in the TMP468AIYFFR?

The TMP468AIYFFR measures voltage drop across both D+ and D− terminals during remote diode conversion and digitally subtracts the error contribution from trace resistance up to 1 kΩ. This eliminates the need for board-level characterization or firmware compensation routines. The feature is automatic and transparent - no register configuration is required. It directly improves remote accuracy in real-world layouts where PCB routing adds parasitic resistance, and is validated across temperature and supply voltage ranges in the datasheet.

Can the TMP468AIYFFR be used with a 1.8 V I²C bus?

Yes - the TMP468AIYFFR supports I²C/SMBus operation with V+ as low as 1.7 V, making it fully compatible with standard 1.8 V I/O domains. Its VIH threshold is 0.7 × V+, so at 1.8 V supply, the minimum high-level input voltage is 1.26 V, well within typical 1.8 V logic high margins. The device also specifies 4 pF input capacitance and 1 μA leakage on SCL/SDA, ensuring robust signal integrity on 1.8 V buses without additional level shifters.

What is the purpose of the ADD pin on the TMP468AIYFFR?

The ADD pin on the TMP468AIYFFR selects one of four I²C/SMBus slave addresses by connecting it to GND, V+, SDA, or SCL. This enables up to four TMP468AIYFFR devices on the same two-wire bus without address conflict. The address mapping is fixed per connection state and requires no software configuration - it is a hardware-level addressing mechanism that simplifies multi-sensor thermal monitoring in dense PCB layouts like server motherboards or telecom line cards.

TMP468AIYFFR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
16-UFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Sensor Type:
Digital, Local/Remote
Sensing Temperature - Local:
-40°C ~ 125°C
Sensing Temperature - Remote:
-55°C ~ 150°C
Output Type:
I2C/SMBus
Voltage - Supply:
1.7V ~ 3.6V
Resolution:
0.0625°C
Features:
Programmable Limit, Selectable Hysteresis, Shutdown Mode
Accuracy - Highest (Lowest):
±0.1°C (±0.5°C)
Test Condition:
-40°C ~ 125°C
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
16-DSBGA

TMP468AIYFFR FAQ

1.How can I place an order for TMP468AIYFFR through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP468AIYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP468AIYFFR reliable?

The price and inventory of TMP468AIYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP468AIYFFR is usually 5 days.

3.What payment methods are accepted for TMP468AIYFFR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP468AIYFFR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP468AIYFFR?

TMP468AIYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP468AIYFFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP468AIYFFR?

For technical support, including TMP468AIYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP468AIYFFR requirements.

6.How does Aetrix verify that TMP468AIYFFR is sourced from the original manufacturer or authorized distributors?

All TMP468AIYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP468AIYFFR meets industry standards.

7.What is the process for return or replacement of TMP468AIYFFR?

All TMP468AIYFFR units undergo pre-shipment inspection (PSI). If there is an issue with TMP468AIYFFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP468AIYFFR part is unused and in its original packaging.

Return procedure for TMP468AIYFFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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