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Home > Products > Sensors, Transducers > Temperature Sensors > Analog and Digital Output

Texas Instruments TMP4718BDGKR

Name: TMP4718BDGKR
Brand: Texas Instruments
SKU: TMP4718BDGKR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: TMP4718BDGKR

Manufacturer:: Texas Instruments

Category:: Analog and Digital Output

Package:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Datasheet:: TMP4718BDGKR.pdf

Description:: HIGH-ACCURACY REMOTE AND LOCAL T

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Product details

Overview

TMP4718BDGKR from Texas Instruments is a high-accuracy dual-channel digital temperature sensor with integrated local thermal BJT and remote diode interface, delivering ±1°C local and ±1°C remote (MMBT3904-optimized) accuracy across –40°C to 125°C, 0.125°C remote resolution, I²C/SMBus compatibility, and series resistance cancellation up to 1 kΩ - deployed in FPGA and microprocessor die temperature monitoring.

For engineers reviewing the TMP4718BDGKR datasheet, TMP4718BDGKR pinout, TMP4718BDGKR application, or TMP4718BDGKR equivalent, key selection considerations include its programmable ALERT/T_CRIT thresholds, 1.2-V logic-compatible inputs independent of VDD, fault-queue–enabled remote alert debouncing, and resistor-decoded power-up default limits for server motherboard thermal management.

Technical Context

The TMP4718BDGKR implements a dual-sensor architecture: an on-die bipolar junction transistor (BJT) for local ambient sensing and a current-source–based remote channel supporting external NPN diodes (e.g., MMBT3904) for IC junction monitoring. Its ADC employs series resistance cancellation logic that dynamically compensates for up to 1 kΩ routing resistance without calibration.

It operates in either continuous conversion or one-shot mode, supports I²C/SMBus at 1 MHz (Fast Mode Plus), features open-drain ALERT/T_CRIT outputs with pullup-resistor–configured default T_CRIT limits (77°C–125°C), and includes a programmable digital filter (4- or 8-sample moving average) for remote noise suppression.

Key Specifications

Parameter	Value and Actual Design Meaning
Local Accuracy	±1°C over –40°C to 125°C - enables reliable ambient thermal monitoring without per-unit calibration.
Remote Accuracy	±1°C over –40°C to 125°C with MMBT3904 - ensures precise die-temperature tracking for FPGAs and processors.
Remote Resolution	0.125°C (11-bit) - supports fine-grained thermal throttling decisions in high-performance compute systems.
Supply Range	1.62 V to 5.5 V - allows direct integration with 1.8 V, 3.3 V, and 5 V rails without LDOs.
I²C/SMBus Speed	Up to 1 MHz - compatible with high-speed system management buses in rack servers and NICs.
Series Resistance Cancellation	Up to 1 kΩ - eliminates PCB trace resistance-induced error without layout constraints or firmware compensation.
Power Consumption	1.5 μA standby, 4.5 μA avg (2 s conv.), 320 μA active remote - extends battery life in always-on thermal supervision.

Pinout & Package

DGK package: 8-pin VSSOP (3.00 mm × 4.90 mm), thermally enhanced for PCB-mounted thermal sensing applications.

Pin/Terminal	Circuit Role	Design Meaning
VDD	Power supply input	Bypassed to GND with 0.1 µF capacitor; powers internal regulator and logic; supports 1.62–5.5 V operation.
DP	Remote diode positive terminal	Current-source output for remote NPN diode bias; connects to collector/emitter of MMBT3904 or ASIC thermal diode.
DN	Remote diode negative terminal	Sense input for remote junction voltage; paired with DP for differential remote measurement and series resistance cancellation.
T_CRIT	Open-drain critical alert output	Asserts low when local/remote exceeds programmable T_CRIT limit; pullup resistor sets default power-up threshold (77–125°C).
GND	Ground reference	Common return for analog and digital circuitry; must be low-impedance for accurate remote sensing.
ALERT	Open-drain general alert output	Asserts low on high/low limit violation; shares same pullup resistor decoding scheme as T_CRIT for default configuration.
SDA	I²C/SMBus data line	Open-drain bidirectional bus line requiring external pullup; 1.2-V logic compatible regardless of VDD.
SCL	I²C/SMBus clock input	Open-drain clock input (no stretching); supports 100 kHz–1 MHz timing; includes 50 ns spike filter for I³C coexistence.

Key Features

Feature	Design Value
1.2-V logic-compatible I/O thresholds	Independent of VDD supply - enables direct interfacing with 1.2-V MCUs without level shifters or auxiliary supplies.
Programmable digital filter (4× or 8× averaging)	Reduces EMI-induced remote measurement noise in high-speed digital environments like NICs and BBUs.
Fault queue (3-consecutive-out-of-limit)	Prevents false alerts from transient spikes on remote diode channels while preserving responsiveness on sustained overtemps.
Resistor-decoded default T_CRIT/ALERT limits	Eliminates boot-time register writes - default thermal shutdown thresholds auto-configured via two external resistors.
Remote diode open-circuit detection	Flags broken or disconnected thermal diode paths - prevents silent failure in mission-critical base station thermal protection.

Applications

Rack Server Motherboard	FPGA Temperature Monitoring
Use Scenario: Real-time thermal mapping of CPU socket, VRM, and memory DIMM zones on dual-socket 1U/2U servers. IC Role / Device Role / Timing Role: Local sensor monitors ambient board temperature; remote channel tracks die temperature of Xilinx Versal or Intel Stratix 10 FPGAs via integrated substrate diodes. Use Value: Enables dynamic fan speed control and graceful throttling before thermal shutdown, leveraging ±1°C accuracy and 0.125°C resolution for precision margining.	Use Scenario: Closed-loop thermal management of reconfigurable compute accelerators in AI inference servers and edge data centers. IC Role / Device Role / Timing Role: Remote diode interface measures FPGA junction temperature; local sensor validates heatsink attachment integrity and airflow sufficiency. Use Value: Supports adaptive clock gating and partial reconfiguration based on real-time die temp, using programmable ALERT/T_CRIT to trigger hardware-level responses within 32 ms.
Small Cell Base Station	Smart Network Interface Card (NIC)
Use Scenario: Thermal supervision of RF front-end ICs and baseband processing units in outdoor 4G/5G small cells operating from –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Remote channel monitors PA die temperature; local sensor tracks enclosure ambient to compensate for self-heating effects. Use Value: Maintains RF output stability by triggering power backoff at 101°C T_CRIT, enabled by series resistance cancellation across long PCB traces to remote diodes.	Use Scenario: Thermal safety monitoring of 100G/400G Ethernet controllers, SerDes PHYs, and packet processors on OCP-compliant NICs. IC Role / Device Role / Timing Role: Dual-channel sensing provides independent thermal validation of host-side SoC and network-side transceiver dies. Use Value: Prevents link flapping and packet loss by asserting ALERT on >89°C remote die temp, with fault queue filtering burst noise from high-speed serial lanes.

Rack Server Motherboard

FPGA Temperature Monitoring

Use Scenario: Real-time thermal mapping of CPU socket, VRM, and memory DIMM zones on dual-socket 1U/2U servers.

IC Role / Device Role / Timing Role: Local sensor monitors ambient board temperature; remote channel tracks die temperature of Xilinx Versal or Intel Stratix 10 FPGAs via integrated substrate diodes.

Use Value: Enables dynamic fan speed control and graceful throttling before thermal shutdown, leveraging ±1°C accuracy and 0.125°C resolution for precision margining.

Use Scenario: Closed-loop thermal management of reconfigurable compute accelerators in AI inference servers and edge data centers.

IC Role / Device Role / Timing Role: Remote diode interface measures FPGA junction temperature; local sensor validates heatsink attachment integrity and airflow sufficiency.

Use Value: Supports adaptive clock gating and partial reconfiguration based on real-time die temp, using programmable ALERT/T_CRIT to trigger hardware-level responses within 32 ms.

Small Cell Base Station

Smart Network Interface Card (NIC)

Use Scenario: Thermal supervision of RF front-end ICs and baseband processing units in outdoor 4G/5G small cells operating from –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Remote channel monitors PA die temperature; local sensor tracks enclosure ambient to compensate for self-heating effects.

Use Value: Maintains RF output stability by triggering power backoff at 101°C T_CRIT, enabled by series resistance cancellation across long PCB traces to remote diodes.

Use Scenario: Thermal safety monitoring of 100G/400G Ethernet controllers, SerDes PHYs, and packet processors on OCP-compliant NICs.

IC Role / Device Role / Timing Role: Dual-channel sensing provides independent thermal validation of host-side SoC and network-side transceiver dies.

Use Value: Prevents link flapping and packet loss by asserting ALERT on >89°C remote die temp, with fault queue filtering burst noise from high-speed serial lanes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar temperature sensing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TMP451RTER	Single remote channel only; no local sensor; 12-bit remote resolution (0.0625°C); SMBus-only interface; 6-pin WSON package.	Lacks local sensing and ALERT/T_CRIT dual-output capability; suited for space-constrained remote-only use cases.	Select when only remote die monitoring is required and board area is critical; not suitable for ambient + junction dual monitoring.
LM95235EIMM/NOPB	±2°C remote accuracy (vs. ±1°C); no series resistance cancellation; 10-bit remote resolution; supports 2-wire and 3-wire remote configurations.	Higher thermal error margin reduces margining headroom in high-density compute; requires external calibration for trace resistance.	Choose for legacy designs already using LM952xx family; avoid where ±1°C accuracy and automatic R_SERIES compensation are mandatory.

Compared with TMP4718BDGKR, TMP451RTER omits local sensing and dual-alert outputs but saves board space, while LM95235EIMM/NOPB trades accuracy and automated compensation for broader legacy support - making TMP4718BDGKR optimal for new high-precision dual-channel thermal management in servers and telecom infrastructure.

Availability

TMP4718BDGKR is available at Aetrix Electronics and suitable for rack server motherboard thermal management, FPGA die monitoring, small cell base station protection, and smart NIC temperature supervision requiring stable component supply and long-term industrial lifecycle support.

Supply support for TMP4718BDGKR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of leadership in precision sensing and power management ICs.

The TMP4718 product line delivers high-accuracy, dual-channel thermal monitoring for demanding compute and communications infrastructure - designed specifically for FPGA, processor, and ASIC junction temperature tracking with minimal system-level calibration.

FAQ

What is the remote temperature accuracy specification for TMP4718BDGKR over its full operating range?

The TMP4718BDGKR achieves ±1.5°C remote temperature accuracy over –40°C to 125°C ambient when used with an MMBT3904 NPN transistor. At the optimized range of –10°C to 85°C, accuracy tightens to ±0.8°C. This is confirmed in Section 7.5 of the SBOSA41A datasheet under TERR_R parameter testing conditions. The device maintains this performance with built-in series resistance cancellation up to 1 kΩ.

How does the TMP4718BDGKR decode default T_CRIT limits at power-up?

The TMP4718BDGKR decodes default T_CRIT and ALERT high-temperature limits during initialization by measuring the resistance values on its T_CRIT and ALERT pins within the first 50 ms after VDD rises above 1.4 V. Pullup resistors of 2 kΩ, 7.5 kΩ, 10.5 kΩ, 14 kΩ, or >18.7 kΩ select discrete thresholds from 77°C to 125°C, as defined in Table 8-1. The TMP4718BDGKR uses this resistor-decoding scheme to set nonvolatile defaults before any I²C communication occurs.

Does TMP4718BDGKR support both I²C and SMBus interfaces simultaneously?

Yes, the TMP4718BDGKR natively supports both I²C and SMBus protocols on the same SDA/SCL pins. It complies with I²C Fast Mode Plus (1 MHz) timing and SMBus 3.0 electrical specifications, including timeout detection and 50 ns spike filtering on both lines. The TMP4718BDGKR does not require mode selection - protocol behavior adapts automatically based on host controller signaling, and it accepts standard I²C START/STOP sequences and SMBus Alert Response Address (ARA) commands.

What is the function of the DP and DN pins on the TMP4718BDGKR?

The DP (diode positive) and DN (diode negative) pins form a dedicated remote junction temperature sensing interface. DP sources a constant current into the base-emitter junction of an external NPN transistor (e.g., MMBT3904) or integrated ASIC diode, while DN measures the resulting forward voltage. The TMP4718BDGKR computes remote temperature from this V_BE delta, applying automatic series resistance cancellation. If no remote diode is used, DP and DN are shorted together per datasheet guidance.

Can the TMP4718BDGKR operate with a 1.2-V I/O supply while powered from a higher VDD rail?

Yes, the TMP4718BDGKR features static 1.2-V logic-compatible input thresholds on SCL and SDA that are independent of VDD. This allows direct connection to 1.2-V microcontrollers or FPGAs without level-shifting circuitry, even when VDD is 3.3 V or 5 V. Input high (VIH) is guaranteed at 0.9 V and input low (VIL) at 0.4 V across the full operating range - a key design feature explicitly documented in Section 7.5 of the TMP4718BDGKR datasheet.

TMP4718BDGKR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Sensor Type:: Local, Remote

Sensing Temperature - Local:: -40°C ~ 125°C

Sensing Temperature - Remote:: -55°C ~ 125°C

Output Type:: I2C/SMBus

Voltage - Supply:: 1.62V ~ 5.5V

Resolution:: 8 b (Local), 11 b (Remote)

Features:: One-Shot, Shutdown Mode

Accuracy - Highest (Lowest):: 1°C

Test Condition:: 0°C ~ 85°C (-40°C ~ 125°C)

Operating Temperature:: -40°C ~ 125°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 8-VSSOP

TMP4718BDGKR FAQ

1.How can I place an order for TMP4718BDGKR through Aetrix?

Please submit a Request for Quotation (RFQ) for TMP4718BDGKR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMP4718BDGKR reliable?

The price and inventory of TMP4718BDGKR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP4718BDGKR is usually 5 days.

3.What payment methods are accepted for TMP4718BDGKR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP4718BDGKR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMP4718BDGKR?

TMP4718BDGKR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMP4718BDGKR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMP4718BDGKR?

For technical support, including TMP4718BDGKR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP4718BDGKR requirements.

6.How does Aetrix verify that TMP4718BDGKR is sourced from the original manufacturer or authorized distributors?

All TMP4718BDGKR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP4718BDGKR meets industry standards.

7.What is the process for return or replacement of TMP4718BDGKR?

All TMP4718BDGKR units undergo pre-shipment inspection (PSI). If there is an issue with TMP4718BDGKR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMP4718BDGKR part is unused and in its original packaging.

Return procedure for TMP4718BDGKR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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