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Texas Instruments TMP75BIDGKT
- Part No.:
- TMP75BIDGKT
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
TMP75BIDGKT.pdf
- Description:
- SENSOR DIGITAL -55C-125C 8VSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:787
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Product details
Overview
TMP75BIDGKT from Texas Instruments is a 12-bit digital temperature sensor with two-wire (I²C/SMBus) interface, operating from 1.4 V to 3.6 V supply, delivering ±0.5°C accuracy from –20°C to +85°C and ±1°C over –55°C to +125°C, with 0.0625°C resolution - used for thermal protection in server power supplies and embedded motor drivers.
For engineers reviewing the TMP75BIDGKT datasheet, TMP75BIDGKT pinout, TMP75BIDGKT application, or TMP75BIDGKT equivalent, key selection considerations include its VSSOP-8 package, programmable ALERT threshold behavior, shutdown current of 0.3 μA (typ), one-shot conversion mode, and SMBus alert response compatibility.
Technical Context
The TMP75BIDGKT integrates a band-gap BJT temperature-sensing element digitized by a 12-bit ADC, with on-chip voltage regulation and spike-suppression filters on SDA/SCL lines. Its register-mapped architecture supports THIGH/TLOW limit storage and configuration via pointer-based read/write sequences.
It operates in comparator or interrupt mode via TM bit control, with hysteresis enforced by TLOW/THIGH difference and fault counter debouncing. The ALERT pin is open-drain, polarity-configurable (POL bit), and supports SMBus alert response protocol for multi-device bus arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.4 V to 3.6 V - enables direct interface with 1.8-V and 3.3-V logic domains without level shifters. |
| Temperature Range | –55°C to +125°C - validated for industrial and automotive under-hood thermal monitoring. |
| Accuracy | ±0.5°C (–20°C to +85°C), ±1°C (–55°C to +125°C) - factory-calibrated, eliminating system-level calibration overhead. |
| Resolution | 0.0625°C (12-bit) - supports fine-grained thermal throttling decisions in CPU/GPU power management. |
| Quiescent Current | 45 μA (typ, active), 0.3 μA (typ, shutdown) - extends battery life in portable thermal monitors. |
| Conversion Time | 20–35 ms (one-shot) - deterministic update timing for real-time thermal loop control. |
| Bus Compatibility | I²C/SMBus fast-mode (up to 400 kHz) and high-speed mode (up to 3 MHz) - interoperable with legacy and modern host controllers. |
| Address Options | 8 pin-programmable addresses (A2/A1/A0) - allows daisy-chaining up to eight sensors on single bus without address conflict. |
Pinout & Package
VSSOP-8 package (3.00 mm × 3.00 mm), thermally optimized for PCB-mounted local temperature sensing with low-junction-to-board resistance (ψJB = 108 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0 | Address select input | Configures LSB of 7-bit slave address; tied to GND or VS to set device address among 8 options. |
| A1 | Address select input | Configures middle bit of slave address; enables multi-drop bus topology without external address decoding. |
| A2 | Address select input | Configures MSB of slave address; supports scalable thermal monitoring across dense PCB layouts. |
| ALERT | Open-drain output | Asserts on temperature violation; requires external pull-up; configurable as comparator or interrupt with hysteresis. |
| GND | Ground reference | Primary thermal path to PCB; defines 0 V reference for internal regulator and ADC. |
| SCL | Serial clock input | Accepts I²C/SMBus clock up to 3 MHz; includes Schmitt trigger and spike suppression for noisy environments. |
| SDA | Serial data I/O | Open-drain bidirectional line; supports standard/fast/high-speed modes; requires external pull-up. |
| VS | Power supply input | Accepts 1.4–3.6 V; powers internal regulator, ADC, and logic; no external decoupling capacitor required per datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| Factory-calibrated accuracy | Eliminates need for end-system calibration; reduces test time and BOM cost in volume production. |
| Programmable ALERT trip points | Enables autonomous thermal shutdown without host intervention - critical for safety-critical motor driver protection. |
| One-shot conversion mode | Allows precise timing control of temperature reads - avoids bus contention in time-sensitive real-time systems. |
| Shutdown mode (0.3 μA) | Permits ultra-low-power wake-on-temperature functionality in battery-powered environmental sensors. |
| SMBus alert response support | Enables priority-based fault resolution in multi-sensor systems - essential for server rack thermal management. |
| Band-gap BJT sensing element | Delivers stable, repeatable die temperature measurement - directly correlates to PCB hotspot thermal behavior. |
Applications
| Server Thermal Management | Motor Driver Protection |
|---|---|
Use Scenario: Monitoring VRM and CPU socket temperatures in 1U rack servers to trigger dynamic frequency scaling. IC Role / Device Role / Timing Role: Local die-temperature sensor providing 0.0625°C-resolution readings every 25 ms via one-shot mode. Use Value: Prevents thermal throttling instability by enabling hysteresis-controlled ALERT assertion with ±0.5°C accuracy at 85°C junction. | Use Scenario: Detecting MOSFET junction overheating in BLDC motor inverters to initiate safe shutdown before failure. IC Role / Device Role / Timing Role: Standalone thermostat using comparator-mode ALERT with programmable THIGH/TLOW registers. Use Value: Achieves <100 ms fault response with no host polling - meets IEC 60730 Class B thermal safety requirements. |
| Portable Battery Monitoring | Office Equipment HVAC Control |
Use Scenario: Measuring Li-ion battery pack temperature during charging cycles in cordless power tools. IC Role / Device Role / Timing Role: Low-power temperature monitor operating in shutdown mode between 2-second wake intervals. Use Value: Draws only 0.3 μA in shutdown - extends tool standby time by >3× versus comparable sensors. | Use Scenario: Sensing ambient air temperature near print engine in laser multifunction printers for fan speed control. IC Role / Device Role / Timing Role: Ambient temperature node on shared I²C bus with 8 other TMP75BIDGKT units. Use Value: Pin-programmable addressing eliminates address conflicts - reduces firmware complexity in multi-zone HVAC firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIMM/NOPB | 5V-tolerant I²C interface; ±2°C accuracy over –55°C to +125°C; no shutdown mode; SOIC-8 only. | Lacks 1.8-V operation and ultra-low-power shutdown - unsuitable for battery-powered designs. | Select when interfacing with 5-V microcontrollers and cost sensitivity outweighs accuracy/power needs. |
| MAX31875RASD+T | 16-bit resolution; ±0.25°C accuracy (–40°C to +125°C); integrated EEPROM; 1.7–3.6 V supply. | Higher accuracy and resolution but larger VQFN-8 package (3.1 mm × 3.1 mm) and no SMBus alert response. | Choose for precision thermal compensation in optical transceivers where sub-0.5°C error is mandatory. |
Compared with LM75BIMM/NOPB and MAX31875RASD+T, the TMP75BIDGKT uniquely balances 1.8-V operation, 0.3 μA shutdown, SMBus alert response, and VSSOP-8 footprint - making it optimal for space-constrained, battery-aware industrial thermal nodes.
Availability
TMP75BIDGKT is available at Aetrix Electronics and suitable for server thermal management, motor driver protection, portable battery monitoring, and office equipment HVAC control requiring stable component supply across extended product lifecycles.
Supply support for TMP75BIDGKT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision sensing and low-power design.
The TMP75B product line was engineered for high-accuracy, low-voltage thermal monitoring in space- and power-constrained systems - targeting server, industrial motor control, and portable electronics applications.
FAQ
What is the operating temperature range of the TMP75BIDGKT?
The TMP75BIDGKT is specified from –55°C to +125°C. It maintains ±1°C total accuracy across this full range and improves to ±0.5°C between –20°C and +85°C. This range is validated per JEDEC JESD22-A104 thermal cycling standards and supports deployment in under-hood automotive, industrial motor drives, and telecom base station environments where ambient extremes occur.
Does the TMP75BIDGKT require external components for basic operation?
No, the TMP75BIDGKT requires no external components for core temperature sensing. Only two external pull-up resistors (on SDA and ALERT lines) are needed for open-drain operation, and a bypass capacitor is optional per TI's SBOS706B datasheet. Its integrated voltage regulator, band-gap sensor, and 12-bit ADC eliminate discrete signal-conditioning circuitry - reducing bill-of-materials cost and PCB area versus thermistor+ADC solutions.
How does the ALERT pin function in comparator versus interrupt mode on the TMP75BIDGKT?
In comparator mode (TM = 0, default), the TMP75BIDGKT's ALERT pin asserts when temperature ≥ THIGH and clears only after temperature falls below TLOW - implementing hardware hysteresis. In interrupt mode (TM = 1), ALERT remains asserted until any register is read or SMBus alert response completes. Both modes use the same THIGH/TLOW registers and fault counter, but interrupt mode enables prioritized fault handling in multi-sensor systems without continuous host polling.
Can multiple TMP75BIDGKT devices share the same I²C bus?
Yes, up to eight TMP75BIDGKT devices can operate on a single I²C bus using pin-strapped addresses (A2/A1/A0). Each combination of GND/VS on those pins sets a unique 7-bit slave address (1001000 to 1001111). No software address reconfiguration is needed - simplifying firmware for distributed thermal monitoring in servers or industrial PLCs where multiple hotspots must be tracked simultaneously.
What is the conversion time and power consumption of the TMP75BIDGKT in one-shot mode?
In one-shot mode, the TMP75BIDGKT completes a 12-bit temperature conversion in 20–35 ms (typical 27 ms), drawing 45 μA during conversion. After completion, it automatically returns to low-power idle (still 45 μA) unless placed in shutdown mode (0.3 μA). This deterministic timing enables precise synchronization with host MCU thermal control loops - unlike continuous-conversion sensors that introduce variable latency.
TMP75BIDGKT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SMBus
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 11 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -20°C ~ 85°C (-55°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-VSSOP
TMP75BIDGKT FAQ
1.How can I place an order for TMP75BIDGKT through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP75BIDGKT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP75BIDGKT reliable?
The price and inventory of TMP75BIDGKT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP75BIDGKT is usually 5 days.
3.What payment methods are accepted for TMP75BIDGKT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP75BIDGKT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP75BIDGKT?
TMP75BIDGKT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP75BIDGKT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP75BIDGKT?
For technical support, including TMP75BIDGKT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP75BIDGKT requirements.
6.How does Aetrix verify that TMP75BIDGKT is sourced from the original manufacturer or authorized distributors?
All TMP75BIDGKT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP75BIDGKT meets industry standards.
7.What is the process for return or replacement of TMP75BIDGKT?
All TMP75BIDGKT units undergo pre-shipment inspection (PSI). If there is an issue with TMP75BIDGKT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP75BIDGKT part is unused and in its original packaging.
Return procedure for TMP75BIDGKT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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