My Inquiry
My Account
Texas Instruments TMP75BQDQ1
- Part No.:
- TMP75BQDQ1
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TMP75BQDQ1.pdf
- Description:
- SENSOR DIGITAL -40C-125C 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:157
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMP75BQDQ1 from Texas Instruments is an AEC-Q100 Grade 1 qualified automotive digital temperature sensor with 12-bit ADC, 0.0625°C resolution, ±1°C accuracy from –40°C to 125°C, and 1.4V–3.6V supply operation - used for thermal protection in ADAS domain controllers and battery systems.
For engineers reviewing the TMP75BQDQ1 datasheet, TMP75BQDQ1 pinout, TMP75BQDQ1 application, or TMP75BQDQ1 equivalent, key selection criteria include SMBus/two-wire compatibility, programmable ALERT threshold, shutdown current of 0.3μA (typ), tri-temp test option availability, and SOIC-8 package suitability for automotive PCB thermal management.
Technical Context
The TMP75BQDQ1 integrates a bipolar junction transistor (BJT) in band-gap configuration for on-die temperature sensing, digitized by a 12-bit ADC with left-justified output format (1 LSB = 0.0625°C). It supports comparator and interrupt modes via the open-drain ALERT pin, with hysteresis controlled by TLOW/THIGH registers and fault counter filtering noise.
Its two-wire interface implements SMBus protocol compliance including general-call reset, alert response, timeout recovery (54ms typical), and high-speed mode support up to 3MHz. Addressing uses three hardware pins (A0–A2) enabling eight devices on one bus, with pin-latched address sampling at communication start.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.4 V to 3.6 V - enables direct integration with 1.8V and 3.3V automotive microcontroller domains without level-shifting. |
| Operating Temperature | –40°C to 125°C - meets AEC-Q100 Grade 1 requirements for under-hood and powertrain thermal monitoring. |
| Temperature Accuracy | ±1°C (typ) over full range - ensures reliable thermal throttling decisions in battery management and motor control systems. |
| Resolution | 0.0625°C (12-bit) - supports fine-grained compensation of sensor drift and analog front-end gain errors. |
| Quiescent Current | 45 μA (typ) active, 0.3 μA (typ) shutdown - extends runtime in always-on vehicle subsystems like telematics gateways. |
| Conversion Time | 20–35 ms (one-shot mode) - balances responsiveness and power in periodic thermal polling applications. |
| Bus Address Options | 8 unique addresses via A0/A1/A2 pins - simplifies multi-sensor thermal mapping on shared SMBus lines in cockpit ECUs. |
Pinout & Package
Package: SOIC-8 (D package), 4.9 mm × 6 mm footprint, surface-mount, leaded plastic body with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VS (Pin 8) | Power supply input | Accepts 1.4–3.6 V; powers internal regulator, ADC, and logic - decoupling capacitor required per layout guidelines. |
| GND (Pin 4) | Ground reference | Primary thermal path to PCB; defines temperature measurement baseline for local board hotspot detection. |
| SDA (Pin 1) | Two-wire serial data I/O | Open-drain, requires external pullup; transmits register reads and receives writes - integrated Schmitt trigger rejects bus noise. |
| SCL (Pin 2) | Serial clock input | Controls timing of data transfer; supports fast-mode (400 kHz) and high-speed mode (3 MHz) - spike suppression filters prevent false triggers. |
| ALERT (Pin 3) | Overtemperature alert output | Open-drain, active-low by default; asserts when temperature exceeds THIGH - drives MCU interrupts or hardware shutdown circuits directly. |
| A0, A1, A2 (Pins 7,6,5) | Address select inputs | Hardwired to GND or VS to set 3-bit slave address - latched at bus start, enabling static configuration without firmware overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Functional Safety-Capable | Documentation available for ISO 26262 ASIL-B system integration - supports diagnostic coverage analysis for thermal monitoring safety mechanisms. |
| Tri-Temp Tested Variant | TMP75BTQDGKRQ1 undergoes production testing at –40°C, 25°C, and 125°C - improves confidence in parametric stability across automotive thermal extremes. |
| Programmable ALERT Threshold | THIGH/TLOW registers define hysteresis window - eliminates chattering in fan control or power-gating logic during transient thermal events. |
| One-Shot Conversion Mode | Initiated via register write; completes in ≤35 ms - enables precise timing control for synchronized thermal snapshots in multi-sensor clusters. |
| Shutdown Mode | Reduces current to 0.3 μA (typ) - allows background thermal monitoring in low-power sleep states of infotainment head units. |
Applications
| ADAS Domain Controller | Onboard Charger |
|---|---|
Use Scenario: Real-time die temperature monitoring of SoC and power delivery stages during sensor fusion processing. IC Role / Device Role / Timing Role: Standalone thermal watchdog feeding ALERT signal to safety MCU for dynamic voltage/frequency scaling or graceful shutdown. Use Value: Prevents thermal runaway using ±1°C accuracy and hysteresis-controlled ALERT, avoiding system-level crashes during sustained compute loads. | Use Scenario: Monitoring power MOSFET junction temperature and heatsink interface in 11kW AC-to-DC conversion stage. IC Role / Device Role / Timing Role: Local temperature sensor providing feedback to charger controller for derating and thermal foldback algorithms. Use Value: Enables 0.0625°C resolution tracking of rapid thermal transients during charging cycles, improving efficiency and lifetime prediction. |
| Body Control Module | Battery Management System |
Use Scenario: Cabin ambient and HVAC actuator motor temperature supervision in centralized body ECU. IC Role / Device Role / Timing Role: Dual-role sensor: ambient reference for climate control and motor winding overtemp detector via PCB conduction. Use Value: Single SOIC-8 device replaces discrete thermistor + signal conditioning, reducing BOM count and calibration complexity. | Use Scenario: Cell module temperature sensing adjacent to prismatic Li-ion cells in traction battery pack. IC Role / Device Role / Timing Role: High-accuracy node in distributed thermal network - communicates via SMBus to master BMS controller. Use Value: ±1°C accuracy over –40°C to 125°C ensures safe charge/discharge envelope enforcement, meeting UN38.3 thermal safety thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BIDR | Non-automotive grade; no AEC-Q100 qualification; ±2°C accuracy over –25°C to 100°C; same SOIC-8 pinout and register map. | Limited to industrial or consumer applications; unsuitable for safety-critical automotive use cases. | Select only for cost-sensitive non-automotive designs where AEC-Q100 and extended temperature range are not required. |
| TMP117MDDCR | Higher accuracy (±0.1°C typ), 16-bit resolution, 1.71–3.6V supply, but no ALERT pin or tri-temp option; VSSOP-8 package. | Better precision for calibration-critical roles, but lacks hardware interrupt capability for real-time thermal protection. | Choose when ultra-high accuracy outweighs need for autonomous ALERT-driven shutdown in battery or power systems. |
Compared with LM75BIDR and TMP117MDDCR, TMP75BQDQ1 uniquely combines AEC-Q100 Grade 1 qualification, programmable ALERT with hysteresis, and tri-temp test readiness - making it the only option among the three validated for functional safety–aware thermal management in ADAS and powertrain ECUs.
Availability
TMP75BQDQ1 is available at Aetrix Electronics and suitable for autonomous driving modules, onboard chargers, and battery management systems requiring stable component supply across automotive production lifecycles.
Supply support for TMP75BQDQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in automotive-grade IC design and manufacturing.
The TMP75B-Q1 product line delivers AEC-Q100 qualified digital temperature sensors optimized for thermal protection and compensation in automotive electronics - targeting ADAS, electrification, and digital cockpit applications.
FAQ
What is the operating supply voltage range for the TMP75BQDQ1?
The TMP75BQDQ1 operates from 1.4 V to 3.6 V, with typical performance specified at 1.8 V. This wide range supports direct interfacing with both 1.8V logic domains and legacy 3.3V automotive microcontrollers without external level shifters. The device maintains full functionality-including 12-bit resolution and ±1°C accuracy-across this entire supply range, as verified in TI's SBOS721B datasheet Section 6.3.
Does the TMP75BQDQ1 support SMBus protocol features beyond basic two-wire communication?
Yes, the TMP75BQDQ1 supports full SMBus functionality including Alert Response, General Call Reset (00000110), and Timeout Recovery (54 ms typical). It also implements SMBus-specific timing and electrical requirements such as spike suppression filters on SDA/SCL and Schmitt-trigger inputs. These features enable robust integration into automotive SMBus networks used in body control and gateway modules, as detailed in Section 7.3.3 of the official datasheet.
How does the ALERT pin function in comparator versus interrupt mode on the TMP75BQDQ1?
In comparator mode (TM = 0, default), the TMP75BQDQ1's ALERT pin asserts when temperature ≥ THIGH and clears only after falling below TLOW - providing hysteresis to prevent chatter. In interrupt mode (TM = 1), ALERT remains asserted until any register is read or SMBus Alert Response is acknowledged. Both modes use the same POL bit to configure active-low/high polarity. This dual-mode flexibility allows the TMP75BQDQ1 to serve either as a self-contained thermostat or as an interrupt source for safety-critical thermal events.
Is the TMP75BQDQ1 pin-compatible with legacy LM75-family sensors?
Yes, the TMP75BQDQ1 is explicitly designed to be pin- and register-compatible with the industry-standard LM75 and TMP75, sharing identical SOIC-8 pinout, address scheme (A0–A2), and register map. This allows drop-in replacement in existing designs while upgrading to AEC-Q100 qualification, improved accuracy (±1°C vs ±2°C), and lower quiescent current (45 μA vs 250 μA). No PCB or firmware changes are required for migration, per TI's device description in Section 3.
What packaging options are available for the TMP75BQDQ1, and which one corresponds to this part number?
The TMP75BQDQ1 is supplied in the SOIC-8 (D) package, measuring 4.9 mm × 6 mm. While the TMP75B-Q1 family also offers a VSSOP-8 (DGK) variant (e.g., TMP75BQDGKRQ1), the "QD" suffix in TMP75BQDQ1 specifically denotes the SOIC-8 package per TI's orderable information in Section 12 of SBOS721B. This package provides higher thermal mass and easier reworkability - preferred for under-hood and powertrain applications where mechanical robustness is critical.
TMP75BQDQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SMBus
- Voltage - Supply:
- 1.4V ~ 3.6V
- Resolution:
- 11 b
- Features:
- One-Shot, Output Switch, Programmable Limit, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -25°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 8-SOIC
TMP75BQDQ1 FAQ
1.How can I place an order for TMP75BQDQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP75BQDQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP75BQDQ1 reliable?
The price and inventory of TMP75BQDQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP75BQDQ1 is usually 5 days.
3.What payment methods are accepted for TMP75BQDQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP75BQDQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP75BQDQ1?
TMP75BQDQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP75BQDQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP75BQDQ1?
For technical support, including TMP75BQDQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP75BQDQ1 requirements.
6.How does Aetrix verify that TMP75BQDQ1 is sourced from the original manufacturer or authorized distributors?
All TMP75BQDQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP75BQDQ1 meets industry standards.
7.What is the process for return or replacement of TMP75BQDQ1?
All TMP75BQDQ1 units undergo pre-shipment inspection (PSI). If there is an issue with TMP75BQDQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP75BQDQ1 part is unused and in its original packaging.
Return procedure for TMP75BQDQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMP75BQDQ1 Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
