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Texas Instruments TMP9A00MDCKREP
- Part No.:
- TMP9A00MDCKREP
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 5-TSSOP, SC-70-5, SOT-353
- Datasheet:
-
TMP9A00MDCKREP.pdf
- Description:
- ENHANCED PRODUCT, LOW-POWER, ANA
- Quantity:
- Payment:
- Shipping:
Inventory:973
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Product details
Overview
TMP9A00MDCKREP from Texas Instruments is a radiation-tolerant, precision analog-output temperature sensor in a 5-pin SC70 package, delivering ±2.5 °C accuracy from –55 °C to +130 °C, 4 µA max supply current, and –11.77 mV/°C output slope - deployed in defense radio, radar, and avionics thermal monitoring.
For engineers reviewing the TMP9A00MDCKREP datasheet, TMP9A00MDCKREP pinout, TMP9A00MDCKREP application, or TMP9A00MDCKREP equivalent, this page provides verified electrical characteristics, thermal performance limits, SC70 layout guidance, and EP-grade reliability documentation for aerospace and medical system integration.
Technical Context
The TMP9A00MDCKREP implements a CMOS-based analog temperature sensing core with parabolic transfer function VO = (–3.88×10⁻⁶ × T²) + (–1.15×10⁻² × T) + 1.8639 V, supporting operation from –55 °C to +150 °C. Its inverse-slope analog output requires no external ADC reference and maintains linearity within ±0.4% over full range.
Functional mode is strictly analog output only - no digital interface, no shutdown control logic beyond V+ < 0.5 V inducing <20 nA quiescent state. Thermal response is optimized via direct die-to-GND thermal path through Pin 2, requiring grounded substrate connection per TI layout guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Accuracy | ±2.5 °C from –55 °C to +130 °C; ±3.5 °C up to +150 °C - defines calibration tolerance band for mission-critical thermal monitoring. |
| Supply Voltage Range | 1.8 V to 5.5 V; supports low-voltage systems down to 1.8 V above +15 °C ambient - enables integration into battery-powered avionics subsystems. |
| Quiescent Current | Max 4 µA at +25 °C; <7 µA across full –55 °C to +150 °C range - limits self-heating to <0.01 °C, preserving measurement integrity. |
| Output Slope | –11.77 mV/°C (typical); linearized slope referenced to 0 °C yields 1.8639 V output - allows direct voltage-to-temperature conversion without lookup tables. |
| Output Impedance | ≤10 Ω (sinking), <1 Ω (sourcing); stable up to 1 nF capacitive load - permits direct connection to MCU ADC inputs with minimal filtering. |
| ESD Rating | ±4000 V HBM, ±1000 V CDM - meets MIL-STD-883 Class 3B requirements for high-reliability board-level handling. |
| Operating Junction Temp | –65 °C to +150 °C - validated for extended life at 105 °C junction (100,000 power-on hours), supporting long-life defense platforms. |
Pinout & Package
Package: SC70-5 (DCK), body size 2.00 mm × 1.25 mm, 1.1 mm max height, moisture sensitivity level 3 (260 °C peak reflow), RoHS-compliant NiPdAu finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (NC) | No internal connection | Must be grounded or left floating; electrically isolated if not tied to GND - avoids noise coupling into thermal sensing path. |
| Pin 2 (GND) | Ground reference & thermal sink | Directly connected to die substrate; mandatory GND connection for optimal thermal response and EMI immunity. |
| Pin 3 (VOUT) | Analog output | Inversely proportional voltage output (–11.77 mV/°C); drives ≤1 nF load directly; requires 100 nF bypass near V+ for noisy supplies. |
| Pin 4 (V+) | Positive supply input | Accepts 1.8–5.5 V; device enters <20 nA shutdown when V+ < 0.5 V - enables ultra-low-power sleep modes. |
| Pin 5 (GND) | Secondary ground | Provides additional low-impedance return path; recommended to tie both GND pins to same ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| EP-grade reliability | Controlled baseline, single fab/assembly/test site, extended lifecycle, traceable lot tracking - satisfies DoD-STD-344 and NASA EEE-INST-002 requirements. |
| Low self-heating error | 4 µA max supply current limits thermal self-heating to <0.01 °C - preserves absolute accuracy in thermally isolated PCB locations. |
| Wide supply compatibility | Operates from 1.8 V (≥+15 °C) to 5.5 V - eliminates need for dedicated LDO in multi-rail avionics systems. |
| Parabolic transfer function | VO = (–3.88×10⁻⁶ × T²) + (–1.15×10⁻² × T) + 1.8639 V - enables <±0.004 °C residual error over narrow ranges (e.g., +20 °C to +30 °C). |
| Robust output drive | 10 Ω output impedance sinking, <1 Ω sourcing - sustains stable voltage under 600 µA load transients typical of SAR ADC sampling phases. |
Applications
| Defense Radio Thermal Management | Radar Front-End Monitoring |
|---|---|
|
Use Scenario: Real-time die temperature monitoring of GaN power amplifiers in SDR transceivers operating across –40 °C to +85 °C ambient. IC Role / Device Role / Timing Role: Analog temperature sensor providing continuous voltage output to FPGA ADC for closed-loop thermal derating. Use Value: ±2.5 °C accuracy ensures amplifier bias stability within spec across military temperature extremes; 4 µA current enables always-on monitoring without impacting battery runtime. |
Use Scenario: Junction temperature tracking of RF MMICs in airborne active electronically scanned array (AESA) radar modules. IC Role / Device Role / Timing Role: Precision analog sensor mounted adjacent to MMIC substrate, feeding temperature data to radar health management unit. Use Value: SC70 footprint minimizes thermal mass interference; –65 °C to +150 °C range covers full operational envelope including transient thermal spikes during pulse transmission. |
| Avionics Flight Control Unit | Medical Imaging Detector Array |
|
Use Scenario: Cold-junction compensation and thermal drift correction for inertial measurement unit (IMU) accelerometers and gyros. IC Role / Device Role / Timing Role: Reference temperature sensor co-located with MEMS sensors on same PCB layer to track local thermal gradients. Use Value: 0.4% nonlinearity ensures sub-0.1 °C error contribution to IMU bias calibration; EP-grade traceability supports DO-254 certification evidence. |
Use Scenario: Pixel-level thermal stabilization in CT detector modules where silicon photodiode leakage current must be compensated. IC Role / Device Role / Timing Role: Local analog temperature monitor placed beneath photodiode array to feed real-time gain correction algorithms. Use Value: 1.8639 V output at 0 °C provides stable offset reference; ±2.5 °C accuracy over –55 °C to +130 °C matches detector thermal operating window. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog-output temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM94022QDGKRQ1 | ±1.5 °C accuracy (–40 °C to +125 °C), 9 µA max current, SOT-23-6 package | Limited to automotive AEC-Q100 Grade 1; lacks EP qualification, extended temp range, and defense traceability | Select LM94022QDGKRQ1 only for cost-sensitive automotive designs where ±1.5 °C accuracy suffices and EP requirements are absent. |
| MAX6611ASA+ | ±3 °C accuracy (–55 °C to +125 °C), 12 µA current, SOIC-8 package; includes internal 2.5 V reference | Higher power, larger footprint, no extended +150 °C rating or defense-grade lifecycle controls | Choose MAX6611ASA+ only when integrated reference simplifies ADC interface and SC70 size constraint is relaxed. |
Compared with LM94022QDGKRQ1 and MAX6611ASA+, TMP9A00MDCKREP uniquely delivers EP-grade reliability, ±2.5 °C accuracy over –55 °C to +130 °C, and 4 µA operation in a 2.0 mm × 1.25 mm SC70 - making it the sole qualified option for space-constrained, long-life defense and medical thermal sensing.
Availability
TMP9A00MDCKREP is available at Aetrix Electronics and suitable for defense radio, radar, avionics, and medical imaging applications requiring stable component supply, extended lifecycle support, and traceable EP-grade manufacturing.
Supply support for TMP9A00MDCKREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs, with decades of heritage in aerospace, defense, and medical electronics.
The TMP9A00MDCKREP belongs to TI's Enhanced Product (EP) portfolio - engineered specifically for extended temperature operation, controlled manufacturing baselines, and full traceability to meet stringent defense, aerospace, and life-critical medical system requirements.
FAQ
What is the guaranteed accuracy specification for TMP9A00MDCKREP across its full operating range?
The TMP9A00MDCKREP guarantees ±2.5 °C accuracy from –55 °C to +130 °C and ±3.5 °C accuracy from +130 °C to +150 °C, as specified in Section 6.5 of the SBOSA26A datasheet. This accuracy includes all contributions from initial offset, sensitivity error, nonlinearity, and power supply rejection - verified across production lots under JEDEC JESD22 conditions.
Can TMP9A00MDCKREP operate from a 1.8 V supply across the entire –55 °C to +150 °C range?
No - TMP9A00MDCKREP requires ≥1.8 V supply only for operation between +15 °C and +150 °C. Below +15 °C, the output voltage approaches the 1.8 V rail and saturates; accurate measurement below +15 °C requires ≥2.7 V supply, which supports full –55 °C to +150 °C operation per Section 6.3 Recommended Operating Conditions.
How does the TMP9A00MDCKREP achieve such low self-heating error?
The TMP9A00MDCKREP achieves <0.01 °C self-heating error by limiting maximum supply current to 4 µA - verified across temperature and supply voltage in Figure 6-2. This ultra-low quiescent current minimizes resistive heating in the silicon die, ensuring measured temperature reflects ambient conditions rather than internal power dissipation.
What is the correct PCB layout practice for Pin 2 (GND) on the TMP9A00MDCKREP SC70 package?
Per TI Layout Guidelines (Section 10.1), Pin 2 must be connected directly to the PCB ground plane using multiple vias - it is electrically and thermally tied to the die substrate. Floating Pin 2 is permitted only if grounding is physically impossible, but introduces EMI susceptibility; never connect Pin 2 to any voltage other than GND.
Does TMP9A00MDCKREP support digital communication or configuration?
No - TMP9A00MDCKREP is a fixed-function analog-output temperature sensor with no digital interface, registers, or programmability. Its output is a continuous, inversely proportional voltage (–11.77 mV/°C) that must be digitized externally via an ADC; all functionality is defined by its analog transfer function and electrical specifications.
TMP9A00MDCKREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 5-TSSOP, SC-70-5, SOT-353
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Analog, Local
- Sensing Temperature - Local:
- -55°C ~ 150°C
- Sensing Temperature - Remote:
- -
- Output Type:
- Ratiometric, Voltage
- Voltage - Supply:
- 1.8V ~ 5.5V
- Resolution:
- -
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2.5°C (±3.5°C)
- Test Condition:
- -55°C ~ 130°C (-55°C ~ 150°C)
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- SC-70-5
TMP9A00MDCKREP FAQ
1.How can I place an order for TMP9A00MDCKREP through Aetrix?
Please submit a Request for Quotation (RFQ) for TMP9A00MDCKREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMP9A00MDCKREP reliable?
The price and inventory of TMP9A00MDCKREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMP9A00MDCKREP is usually 5 days.
3.What payment methods are accepted for TMP9A00MDCKREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMP9A00MDCKREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMP9A00MDCKREP?
TMP9A00MDCKREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMP9A00MDCKREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMP9A00MDCKREP?
For technical support, including TMP9A00MDCKREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMP9A00MDCKREP requirements.
6.How does Aetrix verify that TMP9A00MDCKREP is sourced from the original manufacturer or authorized distributors?
All TMP9A00MDCKREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMP9A00MDCKREP meets industry standards.
7.What is the process for return or replacement of TMP9A00MDCKREP?
All TMP9A00MDCKREP units undergo pre-shipment inspection (PSI). If there is an issue with TMP9A00MDCKREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMP9A00MDCKREP part is unused and in its original packaging.
Return procedure for TMP9A00MDCKREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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