Texas Instruments TMP9A00MDCKTEP

Overview

TMP9A00MDCKTEP from Texas Instruments is a precision analog-output CMOS temperature sensor in a 5-pin SC70 package, delivering ±2.5 °C accuracy from –55 °C to +130 °C, operating from 1.8 V to 5.5 V supply, with 4 µA max quiescent current and –11.77 mV/°C output slope - deployed in defense radio and avionics thermal monitoring.

For engineers reviewing the TMP9A00MDCKTEP datasheet, TMP9A00MDCKTEP pinout, TMP9A00MDCKTEP application, or TMP9A00MDCKTEP equivalent, key selection considerations include its extended-temperature (–55 °C to +150 °C) EP-grade qualification, microsize SC70 footprint, analog voltage output linearity, low self-heating (<0.01 °C), and shutdown mode (<20 nA).

Technical Context

The TMP9A00MDCKTEP implements a parabolic transfer function VO = (–3.88×10⁻⁶ × T²) + (–1.15×10⁻² × T) + 1.8639 V across –55 °C to +150 °C, with a typical linear approximation of –11.77 mV/°C and 1.8639 V at 0 °C. Its output is inversely proportional to temperature and requires no external components for basic operation.

It features dual operating modes: active analog sensing (4 µA max IDD) and shutdown (V+ < 0.5 V, <20 nA IDD). Thermal response is optimized via direct die-to-GND conduction through Pin 2, and layout mandates grounding Pin 2 for best thermal tracking - floating is permitted only if noise immunity can be assured.

Key Specifications

Pinout & Package

Package: 5-pin SC70 (DCK), body size 2.00 mm × 1.25 mm, 1.1 mm max height, moisture sensitivity level 3 (260 °C peak reflow), RoHS-compliant NiPdAu finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog-output temperature sensing applications.

Compared with LM94022QDGSRQ1 and MAX31820MUA+, the TMP9A00MDCKTEP uniquely balances EP-grade reliability, ultra-low power, micro SC70 size, and analog simplicity - making it optimal for space-constrained, safety-critical analog thermal loops where deterministic latency and minimal component count are essential.

Availability

TMP9A00MDCKTEP is available at Aetrix Electronics and suitable for defense radio, radar, avionics, and medical imaging applications requiring stable component supply, long-term obsolescence management, and extended-temperature performance.

Supply support for TMP9A00MDCKTEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability ICs, with decades of heritage in precision sensing and aerospace-grade components.

The TMP9A00MDCKTEP belongs to TI's EP (Enhanced Product) temperature sensor family, engineered specifically for mission-critical systems demanding controlled manufacturing, full traceability, extended life cycles, and operation across –55 °C to +150 °C.

FAQ

What is the operating temperature range of the TMP9A00MDCKTEP?

The TMP9A00MDCKTEP operates from –55 °C to +150 °C. Its ±2.5 °C accuracy is guaranteed over –55 °C to +130 °C; accuracy degrades to ±3.5 °C from +130 °C to +150 °C. At 1.8 V supply, the effective range is limited to +15 °C to +150 °C due to output voltage rail constraints - the TMP9A00MDCKTEP output cannot exceed V+.

How does the TMP9A00MDCKTEP achieve such low self-heating?

The TMP9A00MDCKTEP achieves <0.01 °C self-heating by limiting maximum supply current to 4 µA across its full temperature range. This ultra-low IDD minimizes resistive heating in the silicon die, preserving measurement fidelity - especially critical in thermally isolated PCB layouts where ambient conduction paths are weak.

Can the TMP9A00MDCKTEP be used with a 1.8 V supply across its full temperature range?

No - the TMP9A00MDCKTEP requires ≥1.8 V supply only for operation between +15 °C and +150 °C. Below +15 °C at 1.8 V, the output voltage approaches the rail and saturates; accurate readings resume above +15 °C. For full –55 °C to +150 °C operation, ≥2.7 V supply is required, as confirmed in the TMP9A00MDCKTEP datasheet Section 6.3.

What is the significance of Pin 2 being tied to the die substrate in the TMP9A00MDCKTEP?

In the TMP9A00MDCKTEP, Pin 2 is electrically and thermally bonded directly to the silicon die substrate. This makes it the optimal thermal conduction path to the PCB ground plane - grounding Pin 2 dramatically improves thermal response time and measurement accuracy. Leaving it floating is permitted but risks EMI-induced errors, per TI Layout Guidelines.

Does the TMP9A00MDCKTEP require external calibration or trimming?

No - the TMP9A00MDCKTEP is factory-calibrated and requires no external trimming. Its ±2.5 °C accuracy over –55 °C to +130 °C is achieved through on-die laser trimming of the bandgap reference and output amplifier. The parabolic transfer function is fully characterized and documented, enabling direct temperature calculation in firmware using Equation 2 from the TMP9A00MDCKTEP datasheet.