Texas Instruments TMS320C5534NZAY10

Overview

TMS320C5534NZAY10 from Texas Instruments is a low-power, fixed-point digital signal processor (DSP) built on the C55x CPU core, operating at 100 MHz (1.3-V core), delivering up to 200 MMACS, with 64KB DARAM, 192KB SARAM, and 128KB ROM. It integrates four I²S interfaces, dual SD/eMMC controllers, USB 2.0 high-speed device PHY, RTC, and 32 GPIO pins - deployed in wireless audio headsets and voice-enabled portable medical devices.

For engineers reviewing the TMS320C5534NZAY10 datasheet, TMS320C5534NZAY10 pinout, TMS320C5534NZAY10 application, or TMS320C5534NZAY10 equivalent, key selection criteria include its 100-MHz C55x DSP performance, USB 2.0 device-only support, 192KB on-chip SARAM capacity, and 144-pin ZHH BGA package with isolated power domains for analog, USB, and CPU subsystems.

Technical Context

The TMS320C5534NZAY10 implements the TMS320C55x DSP architecture with two MAC units, dual ALUs, and a 40-bit central ALU, enabling parallel 17×17-bit multiply-accumulate operations per cycle. Its internal bus structure supports up to four 16-bit data reads and two 16-bit writes per instruction cycle.

It features four independent DMA controllers (16 total channels), each capable of one 32-bit transfer per cycle without CPU intervention, and includes a software-programmable PLL supporting multipliers from ×4 to ×4099 for flexible clock generation across 50–100 MHz core operation.

Key Specifications

Pinout & Package

The TMS320C5534NZAY10 uses a 144-terminal Pb-free plastic BGA (ZHH suffix), 12.0 mm × 12.0 mm body size, with 0.8-mm ball pitch. Package supports thermal dissipation up to 1.2 W under continuous 100-MHz operation with proper PCB layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320C5535AZAY10, TMS320C5534NZAY10 removes the SAR ADC and LCD bridge to reduce cost and power, while retaining full USB 2.0, I²S, and SD functionality; versus TMS320C5517PGF, it trades peak clock speed and RAM for integrated USB and smaller 144-pin BGA - optimizing for compact, connected audio edge nodes.

Availability

TMS320C5534NZAY10 is available at Aetrix Electronics and suitable for wireless audio headsets, voice-controlled medical monitors, and industrial voice command terminals requiring stable component supply, long-term lifecycle support, and TI-qualified production-grade silicon.

Supply support for TMS320C5534NZAY10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation and broad industrial design-in support.

The TMS320C55x product line delivers ultra-low-power fixed-point signal processing for battery-operated audio, voice, and sensor-edge applications - emphasizing runtime efficiency, peripheral integration, and seamless toolchain compatibility with Code Composer Studio.

FAQ

What is the maximum operating frequency of the TMS320C5534NZAY10?

The TMS320C5534NZAY10 operates at a maximum frequency of 100 MHz when powered by a 1.3-V core supply. This is confirmed in Table 3-3 of SPRS737C, which specifies "1.3-V Core: 100 MHz (TMS320C5534A10 only)" - and the 'N' and 'Y' suffixes in TMS320C5534NZAY10 denote the 100-MHz industrial-grade variant. At 100 MHz, the device achieves up to 200 MMACS throughput.

Does the TMS320C5534NZAY10 include an integrated ADC?

No, the TMS320C5534NZAY10 does not include an integrated analog-to-digital converter. Unlike the TMS320C5535AZAY10, which features a 10-bit SAR ADC, the TMS320C5534NZAY10 omits this peripheral - as confirmed in Table 3-1 ("Differences Between Devices") where SAR ADC is marked "–" for all C5534 variants. External ADCs must be used for analog sensor interfacing.

What package type and dimensions does the TMS320C5534NZAY10 use?

The TMS320C5534NZAY10 uses a 144-terminal Pb-free plastic BGA package with ZHH suffix, measuring 12.0 mm × 12.0 mm with 0.8-mm ball pitch. This is explicitly stated in Table 1-1 and Section 8 (Mechanical Packaging) of SPRS737C. The ZHH package is compatible with standard micro-BGA assembly processes and supports thermal dissipation up to 1.2 W.

Can the TMS320C5534NZAY10 operate in USB host mode?

No, the TMS320C5534NZAY10 supports USB 2.0 device mode only - not host or OTG. As documented in Section 1.1 ("Features") and Table 3-1, it includes "Device USB Port with Integrated 2.0 High-Speed PHY that Supports: USB 2.0 Full- and High-Speed Device". No host controller logic, VBUS sensing, or ID pin is implemented; external USB host functionality requires a companion controller.

How many I²S interfaces does the TMS320C5534NZAY10 support?

The TMS320C5534NZAY10 supports four full-duplex Inter-IC Sound (I²S) interfaces - labeled I2S0 through I2S3 in the functional block diagram and pin descriptions. Each provides independent frame sync, bit clock, data transmit, and data receive signals, enabling simultaneous connection to multiple audio codecs or digital microphones, as verified in Tables 3-2 and 3-3 and Section 1.1.