My Inquiry
My Account
Texas Instruments TMS320C6202BGNZ250
.jpg)
- Part No.:
- TMS320C6202BGNZ250
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 352-BBGA, FCBGA
- Datasheet:
-
TMS320C6202BGNZ250.pdf
- Description:
- IC FIXED-POINT DSP 352-FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,340
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320C6202BGNZ250 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI™ VLIW architecture, delivering 2000 MIPS at 250 MHz with eight 32-bit instructions/cycle, 3M-bit on-chip SRAM (2M-bit program/cache + 1M-bit dual-access data), and 32-bit EMIF/Expansion Bus for glueless SDRAM/SBSRAM and PCI-bridge interfacing - deployed in multichannel telecom infrastructure and real-time audio processing systems.
For engineers reviewing the TMS320C6202BGNZ250 datasheet, TMS320C6202BGNZ250 pinout, TMS320C6202BGNZ250 application, or TMS320C6202BGNZ250 equivalent, key selection criteria include its 352-pin GNZ BGA package, 1.5-V core / 3.3-V I/O supply, PLL multiplier options (x1, x4, x8, x10), three McBSPs supporting AC97 and T1/E1 framing, and four-channel DMA with auxiliary channel - all critical for deterministic real-time signal flow in embedded DSP subsystems.
Technical Context
The TMS320C6202BGNZ250 implements an advanced 8-unit VelociTI™ VLIW core: six 32-/40-bit ALUs and two 16-bit multipliers (32-bit result), enabling two multiply-accumulates per cycle (500 MMACS). Its load-store architecture uses 32 general-purpose 32-bit registers split across two register files (A/B), with cross-path data access supporting concurrent execution across functional units.
It integrates a 32-bit external memory interface (EMIF) supporting synchronous (SDRAM, SBSRAM) and asynchronous (SRAM, EPROM) devices across 52M-byte address space, plus a 32-bit expansion bus (XBus) with master/slave capability for direct connection to PCI bridge chips (e.g., TI PCI2040) and microprocessor buses - both interfaces operate without glue logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clock Rate | 250 MHz - enables deterministic 4-ns instruction cycle time for hard real-time signal processing loops. |
| Performance | 2000 MIPS - supports parallel execution of eight 32-bit instructions per cycle for high-throughput algorithm acceleration. |
| On-Chip Memory | 3M-bit SRAM (256K-byte program/cache + 128K-byte dual-access data RAM) - eliminates external memory bottlenecks for tight inner-loop code and coefficient storage. |
| Supply Voltages | 1.5-V core / 3.3-V I/O - reduces dynamic power vs. earlier C6202 (1.8-V core) while maintaining legacy interface compatibility. |
| Peripheral Set | Three McBSPs (AC97/T1/E1 compatible), two 32-bit timers, four-channel DMA with auxiliary channel - provides full-featured I/O for multichannel voice/data streaming and timing-critical control. |
| Package | 352-pin GNZ BGA (18 × 18 mm) - matches pinout of C6202B GNY and C6203B GNZ/GNY packages for hardware reuse across speed grades. |
| Process Technology | 0.15-μm CMOS - enables higher clock rates and lower static power vs. 0.18-μm C6202 variant. |
Pinout & Package
352-pin GNZ Ball Grid Array (BGA), 18 mm × 18 mm body, 1.27-mm ball pitch, bottom-view layout matching C6202B GNY and C6203B GNZ/GNY packages per TI SPRS104I documentation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock reference | Accepts external oscillator or crystal; feeds PLL with selectable multipliers (x1, x4, x8, x10) to generate 250-MHz core clock. |
| VDD_CORE | Core power supply | 1.5-V regulated supply for CPU and internal logic; requires low-noise decoupling due to high-speed switching current. |
| VDD_IO | I/O power supply | 3.3-V supply for all digital I/O including EMIF, XBus, McBSP, and GPIO; tolerant of standard LVTTL levels. |
| RESET | Asynchronous reset input | Active-low signal that initializes CPU, peripherals, and memory controllers; sampled synchronously to CLKIN domain. |
| BOOTMODE[4:0] | Boot configuration inputs | Five pins sampled at reset to select memory map (MAP0/MAP1), boot source (EMIF CE0, XBus XCE0), and peripheral initialization. |
| XD[31:0] | External memory data bus | 32-bit bidirectional data path for EMIF CE0–CE3 spaces; supports byte/half-word/word transfers with programmable wait states. |
Key Features
| Feature | Design Value |
|---|---|
| VelociTI™ VLIW Core | Eight independent functional units (6 ALUs + 2 multipliers) enable true parallelism - critical for FFT, FIR, and codec execution without pipeline stalls. |
| 3M-bit On-Chip SRAM | 256K-byte program space + 128K-byte dual-access data RAM organized as two 64K-byte blocks - allows simultaneous instruction fetch and data access for zero-wait-state operation. |
| Glueless EMIF | Direct interface to SDRAM, SBSRAM, SRAM, and EPROM with programmable timing - eliminates address latches, buffers, and glue logic in memory subsystem design. |
| Three McBSPs | Each supports up to 256 channels, ST-Bus switching, AC97, SPI, and T1/E1 framing - enables single-chip support for multiport voice gateways and audio codecs. |
| Flexible PLL Clock Generator | CLKIN multipliers (x1, x4, x8, x10) and bypass mode allow precise clock synthesis from low-frequency crystals - simplifies board-level clock tree and reduces EMI. |
Applications
| Voice Gateway Systems | Real-Time Audio Processing |
|---|---|
|
Use Scenario: Multiport VoIP gateway handling concurrent G.711/G.729 calls with echo cancellation and DTMF detection. IC Role / Device Role / Timing Role: Primary DSP executing real-time codecs, packetization, and jitter buffer management with deterministic sub-100-μs latency. Use Value: 2000 MIPS and dual-access 128K-byte data RAM enable simultaneous execution of four G.729 channels plus background tasks without external memory contention. |
Use Scenario: Professional audio mixer with 32-channel input, effects processing (reverb, EQ), and AES/EBU output. IC Role / Device Role / Timing Role: Central signal processor managing sample-rate conversion, FIR filtering, and multichannel serial I/O via three McBSPs. Use Value: AC97-compatible McBSPs and 32-bit EMIF allow direct connection to audio ADC/DACs and external SDRAM for large effect buffers - no FPGA glue logic required. |
| Wireless Baseband Modem | Industrial Motor Control |
|
Use Scenario: TDMA base station transceiver performing channel coding, modulation (π/4-DQPSK), and burst synchronization. IC Role / Device Role / Timing Role: Fixed-point DSP executing symbol-rate timing recovery, Viterbi decoding, and pulse shaping with strict cycle-accurate interrupt response. Use Value: Four-channel DMA with auxiliary channel offloads data movement from CPU, freeing 80% of cycles for algorithm computation under burst-mode constraints. |
Use Scenario: High-precision servo drive implementing field-oriented control (FOC), current loop regulation, and PWM generation for PMSM motors. IC Role / Device Role / Timing Role: Real-time controller executing 10-kHz FOC loops with synchronized ADC sampling and PWM update via timer-triggered McBSP transfers. Use Value: Two 32-bit timers with capture/compare and McBSP frame sync enable sub-microsecond timing coordination between analog sensing and digital actuation paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6202BGNZ300 | 300-MHz clock (3.33-ns cycle), 2400 MIPS, same GNZ package and pinout - requires 1.5-V core supply with tighter regulation. | Higher throughput for compute-intensive algorithms (e.g., wideband speech coding); identical peripheral set and memory map. | Select when application demands >2000 MIPS and board supports enhanced core voltage stability. |
| TMS320C6203BGNZ250 | Same 250-MHz speed and GNZ package, but 384K-byte program memory (vs. 256K) and 512K-byte data memory (vs. 128K). | Better suited for large-code applications (e.g., multi-protocol stacks) requiring more on-chip memory - no change to PCB or firmware porting effort. | Choose when firmware size exceeds 256K-byte program space or data working sets exceed 128K-byte dual-access RAM. |
Compared with TMS320C6202BGNZ250, the TMS320C6202BGNZ300 delivers 20% higher MIPS within identical thermal and layout constraints, while the TMS320C6203BGNZ250 trades raw speed for 1.5× more on-chip memory - making the former optimal for latency-bound tasks and the latter for memory-bound workloads.
Availability
TMS320C6202BGNZ250 is available at Aetrix Electronics and suitable for voice gateway systems, real-time audio processing, wireless baseband modems, and industrial motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production programs.
Supply support for TMS320C6202BGNZ250 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of DSP innovation rooted in the TMS320 platform.
The TMS320C6202BGNZ250 belongs to the C62x™ fixed-point DSP family, designed specifically for cost-sensitive, high-throughput real-time signal processing in telecom, audio, and industrial control - emphasizing parallel execution, on-chip memory efficiency, and glueless peripheral interfacing.
FAQ
What is the core supply voltage requirement for the TMS320C6202BGNZ250?
The TMS320C6202BGNZ250 requires a 1.5-V ±0.075-V core supply (VDD_CORE) per TI SPRS104I specifications. This is distinct from the 1.8-V core used by the non-B variant (TMS320C6202). The 1.5-V rail must be well-regulated with low noise and adequate decoupling to ensure stable 250-MHz operation of the VelociTI™ VLIW core. TMS320C6202BGNZ250 does not tolerate undervoltage or overvoltage beyond this range during active operation.
Does the TMS320C6202BGNZ250 support SDRAM interfacing without external logic?
Yes, the TMS320C6202BGNZ250 integrates a glueless 32-bit external memory interface (EMIF) with dedicated SDRAM control (SDCTL) and refresh timing (SDTIM) registers. It directly drives standard 16-/32-bit SDRAM components using programmable burst lengths, CAS latency, and refresh intervals - eliminating address latches, bus transceivers, or FPGA glue logic. TMS320C6202BGNZ250 supports up to 128M-byte SDRAM space per CE region.
How many multichannel buffered serial ports (McBSPs) does the TMS320C6202BGNZ250 include?
The TMS320C6202BGNZ250 includes three fully independent multichannel buffered serial ports (McBSP0–McBSP2), each supporting up to 256 channels, AC97 compliance, SPI mode, T1/E1 framing, and ST-Bus switching. These McBSPs provide dedicated serial I/O for connecting to audio codecs, telephony framers, and digital sensors - with separate clock, frame sync, and data lines per port. TMS320C6202BGNZ250 does not share McBSP resources with other peripherals.
Is the TMS320C6202BGNZ250 pin-compatible with other C62x devices?
Yes, the TMS320C6202BGNZ250 is pin-compatible with the TMS320C6202B GNY package and the TMS320C6203B GNZ/GNY packages, as confirmed in TI SPRS104I Section "C62x device compatibility". This allows drop-in replacement across speed grades (250/300 MHz) and memory variants without PCB redesign. However, it is not pin-compatible with the C6202 GJL (352-pin) or GLS (384-pin) packages due to differing ball counts and layouts.
What boot modes are supported by the TMS320C6202BGNZ250?
The TMS320C6202BGNZ250 supports configurable boot modes selected via BOOTMODE[4:0] pins sampled at reset, enabling boot from EMIF CE0 (asynchronous memory), XBus XCE0 (PCI or host bus), or internal ROM. Memory map configuration (MAP0/MAP1) and peripheral initialization state are determined by these pins. TMS320C6202BGNZ250 implements boot mode decoding in hardware - no firmware intervention is required to establish initial memory mapping.
TMS320C6202BGNZ250 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C62x
- Package/Case:
- 352-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- McBSP
- Clock Rate:
- 250MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.50V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 352-FCBGA (27x27)
TMS320C6202BGNZ250 FAQ
1.How can I place an order for TMS320C6202BGNZ250 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6202BGNZ250 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6202BGNZ250 reliable?
The price and inventory of TMS320C6202BGNZ250 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6202BGNZ250 is usually 5 days.
3.What payment methods are accepted for TMS320C6202BGNZ250?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6202BGNZ250 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6202BGNZ250?
TMS320C6202BGNZ250 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6202BGNZ250 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6202BGNZ250?
For technical support, including TMS320C6202BGNZ250 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6202BGNZ250 requirements.
6.How does Aetrix verify that TMS320C6202BGNZ250 is sourced from the original manufacturer or authorized distributors?
All TMS320C6202BGNZ250 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6202BGNZ250 meets industry standards.
7.What is the process for return or replacement of TMS320C6202BGNZ250?
All TMS320C6202BGNZ250 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6202BGNZ250, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6202BGNZ250 part is unused and in its original packaging.
Return procedure for TMS320C6202BGNZ250:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMS320C6202BGNZ250 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
