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Texas Instruments TMS320C6202BZNY250

Part No.:
TMS320C6202BZNY250
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
384-FBGA, FCCSPBGA
Datasheet:
AetrixTMS320C6202BZNY250.pdf
Description:
IC FIXED-POINT DSP 384-FC/CSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,639

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Product details

Overview

TMS320C6202BZNY250 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI™ VLIW architecture, delivering 2000 MIPS at 250 MHz with eight 32-bit instructions/cycle, 3M-bit on-chip SRAM (2M-bit program/cache + 1M-bit dual-access data), and 32-bit EMIF/Expansion Bus for glueless SDRAM/SBSRAM and PCI bridge interfacing. It targets real-time multichannel audio, telecom infrastructure, and industrial control systems requiring deterministic high-throughput signal processing.

For engineers reviewing the TMS320C6202BZNY250 datasheet, TMS320C6202BZNY250 pinout, TMS320C6202BZNY250 application, or TMS320C6202BZNY250 equivalent, this page provides verified functional identity, package-specific pin mapping (384-pin GNY BGA), clock PLL configuration options (x1/x4/x8/x10), memory organization details, and validated alternative parts for migration planning.

Technical Context

The TMS320C6202BZNY250 implements a dual-data-path VelociTI™ CPU with two register files (A/B, 32 × 32-bit), six ALUs, two 16-bit multipliers (32-bit result), and conditional instruction execution - enabling up to two multiply-accumulates per cycle (500 MMACS). Its load-store architecture isolates computation from memory access, with .D1/.D2 addressing units handling all data transfers.

It integrates three McBSPs supporting T1/E1 framing, AC97, and SPI protocols; a four-channel DMA controller with auxiliary channel; two 32-bit general-purpose timers; IEEE-1149.1 JTAG boundary-scan; and a flexible PLL generating internal clocks from 1× to 10× CLKIN. Core voltage is 1.5 V; I/O voltage is 3.3 V.

Key Specifications

Parameter Value and Actual Design Meaning
Clock Rate 250 MHz - enables deterministic 4-ns instruction cycle time for hard real-time DSP loops
Performance 2000 MIPS - supports concurrent execution of eight 32-bit instructions per cycle in VLIW packets
On-Chip Memory 3M-bit total SRAM: 256K-byte program space (128K mapped + 128K cache/mapped) + 128K-byte dual-access data RAM (two 64K blocks)
External Interface 32-bit EMIF with glueless SDRAM/SBSRAM support and 52M-byte address space - eliminates external logic for memory expansion
Peripherals Three McBSPs (T1/E1/AC97/SPI), four-channel DMA with auxiliary channel, two 32-bit timers, 32-bit XBus (PCI/host bus compatible)
Power Supply 1.5-V core / 3.3-V I/O - requires separate low-noise LDOs; enables lower dynamic power vs. C6202's 1.8-V core
Process Technology 0.15-μm CMOS - improves density and reduces leakage vs. 0.18-μm C6202, supporting higher clock stability

Pinout & Package

384-pin GNY ball grid array (BGA) package, 18 mm × 18 mm, 1.0-mm ball pitch, RoHS-compliant. Pinout conforms to TI's C6202B GNY mechanical drawing (SPRS104I, p.5).

Pin/Terminal Circuit Role Design Meaning
CLKIN Input clock reference Accepts external crystal or oscillator (1–50 MHz); feeds PLL for internal 250-MHz core clock generation
CLKOUT Output clock monitor Provides buffered copy of internal PLL output for system timing verification and synchronization
VDD_CORE (1.5 V) Core power supply Must be decoupled with ≥10 μF ceramic + 100 nF near each power ball group; critical for VLIW pipeline stability
VDD_IO (3.3 V) I/O power supply Supplies all EMIF, McBSP, XBus, and GPIO pins; tolerant of 3.3-V LVTTL/LVCMOS interfaces
RESET Asynchronous reset input Active-low; initiates boot sequence via BOOTMODE[4:0] pins; must be held low for ≥100 ns after power stabilization
EMIF CE0–CE3 External memory chip enables Four independent 256M-byte address spaces; CE0 maps to on-chip program RAM in MAP 0 configuration
McBSP0–2 DX/RX Serial data I/O Three independent full-duplex channels; support TDM, I2S, AC97, and SPI frame formats without software overhead

Key Features

Feature Design Value
VelociTI™ VLIW Architecture Eight parallel functional units (6 ALUs + 2 multipliers) enable true single-cycle MAC and complex loop unrolling
Dual-Access Data RAM Two 64K-byte blocks allow simultaneous read/write from independent functional units - eliminates memory bottlenecks in FFT/FIR kernels
Glueless EMIF Direct interface to SDRAM (CAS latency 2/3), SBSRAM, SRAM, EPROM - removes address latches, wait-state generators, and bus controllers
Flexible PLL Clock Generator CLKIN multipliers x1, x4, x8, x10 - supports multiple clock domains and jitter-tolerant system synchronization
Three McBSPs with Framing Logic Hardware T1/E1, MVIP, ST-Bus, AC97, and SPI protocol support - offloads framing, slot assignment, and bit-rate management from CPU

Applications

Telecom Line Card Processing Industrial Motor Control

Use Scenario: Real-time voice channel aggregation and echo cancellation in carrier-grade DSLAMs and VoIP gateways.

IC Role / Device Role / Timing Role: Primary DSP executing multi-channel G.729/G.723.1 codecs, DTMF detection, and adaptive filtering with sub-100-μs latency.

Use Value: 2000 MIPS and dual-access RAM sustain 128+ concurrent voice channels while maintaining deterministic interrupt response for signaling events.

Use Scenario: Closed-loop field-oriented control (FOC) of three-phase PMSM/BLDC motors in CNC drives and robotics.

IC Role / Device Role / Timing Role: Real-time execution of Park/Clarke transforms, PI current regulators, and SVM PWM generation at 20-kHz switching frequency.

Use Value: Two 32-bit timers with quadrature encoder input and McBSPs for position feedback interface reduce external component count and jitter in torque loop.

Medical Ultrasound Beamforming Audio Signal Processing Engine

Use Scenario: Digital beam synthesis and dynamic receive focusing in portable ultrasound systems with 64+ transducer elements.

IC Role / Device Role / Timing Role: High-throughput FIR filter bank and delay-and-sum processing across parallel data paths using DMA-driven ping-pong buffers.

Use Value: Four-channel DMA with auxiliary channel enables zero-CPU-overhead data movement between McBSP inputs and dual-access RAM for real-time 16-bit sample streams.

Use Scenario: Multi-band parametric EQ, loudspeaker protection, and active crossover in professional audio DSP amplifiers.

IC Role / Device Role / Timing Role: Fixed-point arithmetic engine running ANSI C-based audio algorithms with deterministic 128-sample frame processing at 48 kHz.

Use Value: 32-bit EMIF and XBus allow seamless integration of external flash (firmware), SDRAM (coefficient tables), and I2C DACs without glue logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6202BGNZ250 Same 250-MHz speed grade and 1.5-V core, but 352-pin GNZ BGA (22×22 mm) - smaller footprint, fewer power/ground balls Limited PCB routing density due to reduced ball count; less robust thermal dissipation than GNY Select when board space is constrained and thermal load remains below 1.2 W; verify EMIF timing margins with tighter trace lengths
TMS320C6203BGNZ300 Higher 300-MHz clock (3.33-ns cycle), same 0.15-μm process and 1.5-V core, but 384K-byte program memory (vs. 256K) Supports larger algorithm footprints (e.g., wideband acoustic echo cancellation) without external code fetch Choose for new designs needing >2000 MIPS headroom or extended on-chip program storage; requires updated PLL configuration and thermal validation

Compared with TMS320C6202BZNY250, the GNZ250 offers identical performance in a smaller package but reduced power integrity margin, while the GNZ300 delivers 50% more MIPS and 50% more on-chip program memory at the cost of higher power and thermal design complexity.

Availability

TMS320C6202BZNY250 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motor control, medical imaging, and professional audio systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TMS320C6202BZNY250 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in DSP and microcontroller platforms.

The TMS320C62x™ product line was engineered for high-throughput, low-latency fixed-point signal processing in multichannel communications and real-time control systems - prioritizing MIPS/Watt efficiency and peripheral integration for hardware-accelerated algorithm execution.

FAQ

What is the core supply voltage requirement for TMS320C6202BZNY250?

The TMS320C6202BZNY250 requires a regulated 1.5-V ±0.075-V core supply (VDD_CORE) with low-noise, high-PSRR regulation. This differs from the 1.8-V core of the earlier TMS320C6202 and enables lower dynamic power consumption at 250 MHz. The TMS320C6202BZNY250 datasheet specifies strict sequencing: VDD_CORE must be stable before VDD_IO (3.3 V) ramps, and both must meet minimum ramp rates to avoid latch-up.

Does TMS320C6202BZNY250 support boot from external SDRAM?

No, the TMS320C6202BZNY250 does not support direct boot from external SDRAM. Boot mode is selected via BOOTMODE[4:0] pins at reset and supports only internal program RAM (MAP 0/1), external asynchronous memory (CE0–CE3), or XBus peripherals. SDRAM initialization requires firmware executed from internal RAM or flash loaded via EMIF CE0 after reset - a two-stage boot process documented in SPRU642.

How many McBSPs does TMS320C6202BZNY250 include, and what protocols do they support?

The TMS320C6202BZNY250 integrates three fully independent multichannel buffered serial ports (McBSP0–2). Each supports T1/E1 framing, AC97 audio codec interface, Motorola SPI-compatible mode, ST-Bus switching, and MVIP protocols. Hardware registers enable automatic frame sync, clock polarity control, and bit-rate generation - eliminating CPU overhead for serial data streaming in telecom and audio applications.

Is TMS320C6202BZNY250 pin-compatible with TMS320C6204GLW200?

No, TMS320C6202BZNY250 is not pin-compatible with TMS320C6204GLW200. While C6202B (GNY) and C6204 (GLW) share the same 384-ball footprint geometry, the GLW package has an inner row of additional power/ground balls removed in GNY - resulting in incompatible ball assignments for VDD/VSS, EMIF, and McBSP signals. Migration requires PCB redesign and signal reassignment per TI's SPRS104I and SPRS152 documentation.

What is the maximum external memory address space supported by TMS320C6202BZNY250's EMIF?

The TMS320C6202BZNY250's 32-bit External Memory Interface (EMIF) supports a total of 52M bytes (54,525,952 bytes) of directly addressable external memory space across four chip-enable regions (CE0–CE3). CE0 and CE1 each provide up to 16M bytes, CE2 and CE3 each provide 16M bytes, and reserved regions accommodate memory-mapped peripherals. This allows connection to multiple SDRAM banks, flash devices, and FPGA co-processors without address decoding logic.

TMS320C6202BZNY250 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C62x
Package/Case:
384-FBGA, FCCSPBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Fixed Point
Interface:
McBSP
Clock Rate:
250MHz
Non-Volatile Memory:
External
On-Chip RAM:
384kB
Voltage - I/O:
3.30V
Voltage - Core:
1.50V
Operating Temperature:
0°C ~ 90°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
384-FC/CSP (18x18)

TMS320C6202BZNY250 FAQ

1.How can I place an order for TMS320C6202BZNY250 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6202BZNY250 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6202BZNY250 reliable?

The price and inventory of TMS320C6202BZNY250 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6202BZNY250 is usually 5 days.

3.What payment methods are accepted for TMS320C6202BZNY250?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6202BZNY250 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320C6202BZNY250?

TMS320C6202BZNY250 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6202BZNY250 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6202BZNY250?

For technical support, including TMS320C6202BZNY250 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6202BZNY250 requirements.

6.How does Aetrix verify that TMS320C6202BZNY250 is sourced from the original manufacturer or authorized distributors?

All TMS320C6202BZNY250 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6202BZNY250 meets industry standards.

7.What is the process for return or replacement of TMS320C6202BZNY250?

All TMS320C6202BZNY250 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6202BZNY250, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6202BZNY250 part is unused and in its original packaging.

Return procedure for TMS320C6202BZNY250:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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