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Texas Instruments TMS320C6202GJL250
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- Part No.:
- TMS320C6202GJL250
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 352-BBGA, FCBGA Exposed Pad
- Datasheet:
-
TMS320C6202GJL250.pdf
- Description:
- IC FIXED-POINT DSP 352-FC/CSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,322
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Product details
Overview
TMS320C6202GJL250 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI™ VLIW architecture, delivering 2000 MIPS at 250 MHz with eight 32-bit instructions/cycle, 3M-bit on-chip SRAM (2M-bit program/cache + 1M-bit dual-access data), and 32-bit external memory interface supporting SDRAM, SBSRAM, SRAM, and EPROM - deployed in multichannel telecom infrastructure and real-time audio processing systems.
For engineers reviewing the TMS320C6202GJL250 datasheet, TMS320C6202GJL250 pinout, TMS320C6202GJL250 application, or TMS320C6202GJL250 equivalent, key selection criteria include its 352-pin GJL BGA package, 1.8-V core / 3.3-V I/O supply scheme, 4-ns instruction cycle time, three McBSPs for T1/E1 framing, and PLL clock generation with x1/x4 multipliers - all critical for deterministic real-time DSP firmware deployment.
Technical Context
The TMS320C6202GJL250 implements an eight-unit VelociTI™ VLIW core: six 32-/40-bit ALUs and two 16-bit multipliers yielding 600 MMACS, with load-store architecture, 32 general-purpose 32-bit registers split across two register files (A/B), and conditional execution for every instruction. Its memory subsystem comprises two 128K-byte program blocks (one cache/mapped, one memory-mapped) and two 64K-byte dual-access data RAM blocks enabling concurrent access.
Peripheral integration includes a four-channel DMA controller with auxiliary channel, flexible 32-bit expansion bus (XBus) supporting master/slave PCI-bridge interfacing, IEEE-1149.1 JTAG boundary-scan, two 32-bit timers, and three multichannel buffered serial ports (McBSPs) compliant with AC97, SPI, ST-Bus, and T1/E1 framing - all mapped to dedicated address ranges within the 52M-byte EMIF space and 2G-byte XBus space.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | VelociTI™ VLIW with eight functional units (six ALUs, two 16-bit multipliers); enables up to eight parallel 32-bit instructions per cycle. |
| Clock Rate / Cycle Time | 250 MHz / 4 ns; determines maximum sustained instruction throughput of 2000 MIPS and 600 MMACS. |
| On-Chip Memory | 3M-bit total SRAM: 2M-bit program space (64K × 32-bit instructions) + 1M-bit dual-access data RAM (128K bytes, split into two 64K-byte blocks). |
| External Interface | 32-bit EMIF with glueless support for SDRAM, SBSRAM, SRAM, EPROM; 52M-byte addressable space; plus 32-bit XBus for PCI bridge and microprocessor bus interfacing. |
| Serial Peripherals | Three McBSPs supporting T1/E1, MVIP, SCSA, AC97, and SPI protocols; each configurable for up to 256 channels with frame synchronization. |
| Power Supply | 1.8-V core voltage / 3.3-V I/O voltage; requires separate regulated supplies and controlled power sequencing per TI specification SPRS104I. |
| Package | 352-pin GJL BGA (27 mm × 27 mm); pin-compatible with C6203B GLS package except inner-row power/ground balls are omitted. |
Pinout & Package
352-pin GJL Ball Grid Array (BGA) package, 27 mm × 27 mm footprint, 1.27-mm ball pitch, designed for high-density PCB layouts in telecom and industrial DSP applications. Thermal and mechanical data per TI SPRS104I Section 100.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock source | Accepts external oscillator or crystal input; feeds PLL module with selectable multipliers (x1, x4) for internal 250-MHz core clock generation. |
| CLKOUT | Output clock signal | Provides buffered version of internal CPU clock or PLL output; used for system synchronization and external peripheral timing. |
| EMIF Address/Data Bus (EA[22:0], ED[31:0]) | External memory interface | 32-bit multiplexed data and 23-bit address bus for glueless connection to SDRAM, SBSRAM, SRAM, or EPROM devices. |
| McBSP0–2 Serial I/O (DX0–2, DR0–2, FSX0–2, FSR0–2, CLKX0–2, CLKR0–2) | Multi-channel serial interface | Dedicated pins per McBSP for transmit/receive data, frame sync, and bit clocks; supports TDM, AC97, and SPI framing without software overhead. |
| XBUS Signals (XD[31:0], XA[23:0], XCE0–3, XWE, XOE, XRE) | Expansion bus interface | 32-bit data, 24-bit address, and control lines enabling direct connection to PCI bridges (e.g., TI PCI2040) or synchronous FIFOs with no glue logic. |
| VDD_CORE, VDD_IO, VSS | Power and ground terminals | Separate 1.8-V core and 3.3-V I/O supply domains; multiple VDD/VSS balls distributed across package per TI thermal guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Eight-unit VLIW execution | Enables true parallelism: six ALUs handle arithmetic/logic while two multipliers execute simultaneous MAC operations - essential for real-time FIR/IIR filtering and FFT kernels. |
| Dual-access 128K-byte data RAM | Two independent 64K-byte blocks allow concurrent read/write access by CPU and DMA, eliminating memory bottlenecks in streaming audio or baseband processing. |
| Four-channel DMA with auxiliary channel | Offloads data movement from CPU during ADC/DAC transfers, McBSP buffering, or EMIF/XBus transactions - preserving full 2000-MIPS compute bandwidth for algorithm execution. |
| Three McBSPs with T1/E1 framing | Hardware-accelerated time-division multiplexing supports up to 256 voice/data channels per port, directly interfacing with framers like TI TCM8200 or IDT 82V2041. |
| Flexible PLL clock generator | Configurable CLKIN multipliers (x1, x4) and bypass mode enable precise clock tree design for jitter-sensitive telecom applications while simplifying board-level clock distribution. |
Applications
| Telecom Base Station Channel Processing | Professional Audio Digital Mixer |
|---|---|
Use Scenario: Real-time processing of 64+ concurrent T1/E1 voice channels in wireless access gateways, performing echo cancellation, compression, and packetization. IC Role / Device Role / Timing Role: Primary fixed-point DSP executing time-critical LMS adaptive filters and G.729/G.723 codecs with deterministic sub-10-μs interrupt latency. Use Value: 2000 MIPS throughput and three McBSPs eliminate external framing logic and reduce BOM count versus dual-CPU solutions. |
Use Scenario: Low-latency mixing, EQ, dynamics processing, and effects rendering for 32-channel live sound consoles with 96-kHz sampling. IC Role / Device Role / Timing Role: Central audio DSP handling sample-accurate routing, 24-bit fixed-point arithmetic, and AC97-compliant serial I/O to codec ICs. Use Value: Dual-access 128K-byte data RAM enables simultaneous buffer reads/writes for zero-gap audio streaming across all channels. |
| Industrial Motor Control Gateway | Medical Ultrasound Beamformer |
Use Scenario: Protocol translation and real-time motion profiling between EtherCAT fieldbus and proprietary servo drives in CNC machinery. IC Role / Device Role / Timing Role: Deterministic real-time controller managing PWM generation, position loop closure, and safety monitoring via GPIO and timers. Use Value: Two 32-bit timers with capture/compare and XBus interface to FPGA-based encoder interfaces ensure <1-μs timing resolution for closed-loop control. |
Use Scenario: Digital beamforming of 128-channel ultrasound transducer arrays, applying delay-and-sum algorithms with sub-sample interpolation. IC Role / Device Role / Timing Role: High-throughput fixed-point accelerator performing 1024-point FFTs and FIR filtering on RF echo data streams. Use Value: 600 MMACS capability and 32-bit EMIF enable direct connection to high-speed ADCs and DDR2 memory for real-time image reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6202GLS250 | 384-pin GLS BGA package; identical core, memory, peripherals, and 250-MHz speed; adds inner-row power/ground balls for improved thermal dissipation. | Preferred for thermally constrained designs requiring higher power delivery stability; not drop-in compatible due to different ball map and footprint. | Select when board layout allows larger 18×18 mm package and enhanced thermal performance is required over compact 27×27 mm GJL. |
| TMS320C6202BGNZ250 | Same 352-pin GNZ BGA footprint but 1.5-V core / 3.3-V I/O; 0.15-μm process; supports x1/x4/x8/x10 PLL multipliers; rated for extended temperature range. | Lower core voltage reduces dynamic power by ~30%; additional PLL options improve clock tree flexibility; qualified for -40°C to 105°C operation. | Choose for new designs targeting lower power, wider temperature range, or advanced PLL configuration - requires updated power supply design. |
Compared with TMS320C6202GJL250, the GLS250 variant offers better thermal headroom in larger packages, while the C6202BGNZ250 delivers lower power and broader temperature operation at the cost of revised core supply and PLL configuration - neither is pin-compatible without PCB revision.
Availability
TMS320C6202GJL250 is available at Aetrix Electronics and suitable for telecom infrastructure, professional audio equipment, industrial motor control gateways, and medical ultrasound systems requiring stable component supply and long-term production continuity.
Supply support for TMS320C6202GJL250 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation rooted in the TMS320 platform.
The TMS320C62x™ product line was engineered for high-throughput, low-latency fixed-point signal processing in multichannel communications and real-time control - emphasizing parallel execution, on-chip memory bandwidth, and hardware-accelerated peripherals.
FAQ
What is the maximum operating frequency of the TMS320C6202GJL250?
The TMS320C6202GJL250 operates at a guaranteed maximum clock rate of 250 MHz, corresponding to a 4-ns instruction cycle time and 2000 MIPS performance. This rating is validated under recommended operating conditions: 1.8-V core supply, 3.3-V I/O supply, and case temperature ≤ 90°C per TI SPRS104I.
Does the TMS320C6202GJL250 support SDRAM interfacing without external logic?
Yes, the TMS320C6202GJL250 integrates a glueless 32-bit external memory interface (EMIF) with dedicated SDRAM control (SDCTL) and timing (SDTIM) registers. It directly drives standard 64-Mbit or 128-Mbit SDRAM components using programmable refresh and burst parameters defined in SPRS104I Section 59.
How many McBSPs does the TMS320C6202GJL250 include, and what protocols do they support?
The TMS320C6202GJL250 includes three multichannel buffered serial ports (McBSPs), each supporting T1/E1 framing, AC97 audio codec interfacing, SPI (Motorola format), ST-Bus switching, and MVIP/SCSA protocols. Each McBSP handles up to 256 time slots with independent clock and frame sync generation.
What are the power supply requirements for the TMS320C6202GJL250?
The TMS320C6202GJL250 requires two independent supplies: 1.8 V ± 0.1 V for the core (VDD_CORE) and 3.3 V ± 0.3 V for I/O (VDD_IO). Power sequencing must assert VDD_IO before VDD_CORE and maintain both within specification during operation, as detailed in SPRS104I Section 43.
Is the TMS320C6202GJL250 pin-compatible with other C62x devices?
The TMS320C6202GJL250 shares the 352-pin GJL BGA footprint with the C6202B GNZ variant but is not pin-compatible with GLS or GNY packages. TI confirms pin compatibility only between C6202 and C6203B GLS packages (excluding inner-row balls), not across GJL/GNZ/GLS/GNY families.
TMS320C6202GJL250 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C62x
- Package/Case:
- 352-BBGA, FCBGA Exposed Pad
- Packaging:
- Tube
- Product Status:
- Not For New Designs
- Type:
- Fixed Point
- Interface:
- McBSP
- Clock Rate:
- 250MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.80V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 352-FCBGA (27x27)
TMS320C6202GJL250 FAQ
1.How can I place an order for TMS320C6202GJL250 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6202GJL250 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6202GJL250 reliable?
The price and inventory of TMS320C6202GJL250 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6202GJL250 is usually 5 days.
3.What payment methods are accepted for TMS320C6202GJL250?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6202GJL250 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6202GJL250?
TMS320C6202GJL250 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6202GJL250 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6202GJL250?
For technical support, including TMS320C6202GJL250 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6202GJL250 requirements.
6.How does Aetrix verify that TMS320C6202GJL250 is sourced from the original manufacturer or authorized distributors?
All TMS320C6202GJL250 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6202GJL250 meets industry standards.
7.What is the process for return or replacement of TMS320C6202GJL250?
All TMS320C6202GJL250 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6202GJL250, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6202GJL250 part is unused and in its original packaging.
Return procedure for TMS320C6202GJL250:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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