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Texas Instruments TMS320C6202GJL250X

Part No.:
TMS320C6202GJL250X
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
352-BBGA, FCBGA Exposed Pad
Datasheet:
AetrixTMS320C6202GJL250X.pdf
Description:
IC FIXED-POINT DSP 352-FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,346

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Product details

Overview

TMS320C6202GJL250X from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI™ VLIW architecture, delivering 2000 MIPS at 250 MHz with eight 32-bit instructions/cycle, 3M-bit on-chip SRAM (2M-bit program/cache + 1M-bit dual-access data), and 32-bit EMIF supporting SDRAM/SBSRAM. It targets real-time multichannel audio processing, telecom infrastructure, and industrial control systems requiring deterministic low-latency computation.

For engineers reviewing the TMS320C6202GJL250X datasheet, TMS320C6202GJL250X pinout, TMS320C6202GJL250X application, or TMS320C6202GJL250X equivalent, key selection criteria include its 352-pin GJL BGA package, 1.8-V core / 3.3-V I/O voltage scheme, 250-MHz clock rate, and compatibility with TI's C6000™ development tools including C compiler and assembly optimizer.

Technical Context

The TMS320C6202GJL250X implements an eight-functional-unit VelociTI™ VLIW core: six 32-/40-bit ALUs and two 16-bit multipliers producing 32-bit results, enabling two multiply-accumulates (MACs) per cycle for 500 MMACS. Its load-store architecture uses 32 general-purpose 32-bit registers split across two register files (A/B), with cross-path data access supporting concurrent execution.

It integrates a 32-bit external memory interface (EMIF) with glueless support for SDRAM, SBSRAM, SRAM, and EPROM across 52M-byte address space; three McBSPs supporting T1/E1 framing, AC97, and SPI; two 32-bit timers; flexible PLL clock generator (x1, x4, x6, x7, x8, x9, x10, x11); and IEEE-1149.1 JTAG boundary-scan test capability.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture VelociTI™ VLIW DSP core with eight independent functional units (six ALUs, two 16-bit multipliers)
Clock Rate 250 MHz - enables deterministic real-time execution of 2000 MIPS and 500 MMACS
On-Chip Memory 3M-bit total SRAM: 2M-bit program/cache (64K × 32-bit instructions) + 1M-bit dual-access data RAM (128K bytes)
Package 352-pin GJL BGA (27 mm × 27 mm) - matches C6202 GLS pinout except inner power/ground ball removal
Supply Voltages 1.8-V core / 3.3-V I/O - requires separate regulated supplies; no internal voltage regulation
Peripherals 32-bit EMIF, 32-bit XBus, three McBSPs, four-channel DMA with auxiliary channel, two 32-bit timers, JTAG
Process Technology 0.18-μm CMOS - defines thermal profile and maximum junction temperature rating

Pinout & Package

352-pin GJL Ball Grid Array (BGA) package, 27 mm × 27 mm body size, 1.27-mm ball pitch, bottom-view layout per SPRS104I Figure 3. Package supports standard reflow profiles for lead-free assembly and provides dedicated power/ground ball distribution optimized for high-speed DSP signal integrity.

Pin/Terminal Circuit Role Design Meaning
CLKIN Input clock reference Accepts external oscillator or crystal; feeds PLL for internal clock generation at 250 MHz
RST Asynchronous reset input Active-low signal initiating boot sequence via BOOTMODE[4:0] pins; resets CPU, peripherals, and memory controllers
EMIF CE0–CE3 External memory chip enable outputs Four independent enables for up to 52M-byte address space partitioning across SDRAM, SRAM, EPROM
McBSP0–2 DX/RX Serial data I/O Three full-duplex buffered serial ports supporting T1/E1 framing, AC97, and SPI protocols
VDD_CORE / VDD_IO Power supply inputs Separate 1.8-V core and 3.3-V I/O rails - require local decoupling and sequencing per TI recommendations
TCK/TMS/TDO/TDI JTAG test port IEEE-1149.1-compliant boundary-scan interface for in-circuit emulation and production testing

Key Features

Feature Design Value
Eight-instruction/cycle VLIW execution Enables parallel arithmetic, logic, and memory operations without compiler-inserted stalls
Dual 64K-byte data RAM blocks Supports concurrent read/write access for pipelined FFT, FIR, and filter bank implementations
Glueless 32-bit EMIF Eliminates address latches and bus transceivers when interfacing to SDRAM or asynchronous peripherals
Three multichannel buffered serial ports Direct connection to T1/E1 framers, AC97 codecs, and SPI peripherals without external glue logic
Flexible PLL clock generator Configurable CLKIN multiplication (x1, x4, x6, x7, x8, x9, x10, x11) for precise system timing alignment

Applications

Voice-over-IP Gateway Industrial Motor Control

Use Scenario: Real-time echo cancellation, packetization, and jitter buffering in multi-channel VoIP gateways.

IC Role / Device Role / Timing Role: Primary DSP executing G.729/G.723.1 codecs and HDLC framing with sub-100 μs interrupt latency.

Use Value: 2000 MIPS throughput ensures simultaneous processing of ≥32 voice channels with headroom for security encryption.

Use Scenario: Closed-loop field-oriented control (FOC) of three-phase PMSM motors in factory automation drives.

IC Role / Device Role / Timing Role: Real-time PWM generation, Clarke/Park transforms, and PID loop execution at 20-kHz update rate.

Use Value: Dual 64K-byte data RAM blocks enable zero-wait-state coefficient storage and dual-buffered ADC sample handling.

Baseband Processing Unit Medical Ultrasound Beamformer

Use Scenario: Channel filtering, modulation/demodulation, and RACH detection in 2G/3G cellular base station subsystems.

IC Role / Device Role / Timing Role: Baseband signal processor handling burst-mode TDMA frames with deterministic 250-MHz cycle timing.

Use Value: Three McBSPs interface directly to RFICs and framer ASICs, eliminating FPGA bridging logic.

Use Scenario: Digital beamforming and dynamic focusing in portable ultrasound imaging systems.

IC Role / Device Role / Timing Role: High-throughput FIR filter engine applying time-delay compensation across 128 receive channels.

Use Value: 500 MMACS performance sustains >100-MFLOPS compute load for real-time scan conversion and image enhancement.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6202GLS250 384-pin GLS BGA; identical core, memory, and peripherals; differs only in package pinout and ball count Requires PCB redesign due to larger footprint (18 mm × 18 mm vs. 27 mm × 27 mm) and different power/ground ball layout Select when board layout accommodates GLS package and higher pin-count routing density is needed
TMS320C6202BGNZ250 0.15-μm process; 1.5-V core; same 250-MHz speed but lower power consumption and different PLL options (x1/x4 only) Not drop-in compatible: core voltage change requires power supply redesign; PLL restriction limits clock flexibility Choose for new designs prioritizing power efficiency over legacy voltage compatibility

Compared with TMS320C6202GJL250X, the GLS variant offers identical functionality in a smaller footprint but demands layout revision, while the C6202BGNZ250 reduces core power by ~30% at the cost of voltage and PLL compatibility - making the GJL version optimal for existing 1.8-V systems needing proven thermal margin and full PLL configuration.

Availability

TMS320C6202GJL250X is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial motor drives, and medical ultrasound systems requiring stable component supply across extended product lifecycles.

Supply support for TMS320C6202GJL250X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation rooted in the TMS320 family.

The TMS320C6202GJL250X belongs to the C62x™ fixed-point DSP generation within the broader C6000™ platform, designed specifically for cost-sensitive, high-MIPS real-time signal processing in telecom, industrial, and medical equipment.

FAQ

What is the maximum operating frequency of the TMS320C6202GJL250X?

The TMS320C6202GJL250X is rated for 250 MHz operation, corresponding to a 4-ns instruction cycle time. This speed is guaranteed under recommended operating conditions: 1.8-V core supply, 3.3-V I/O supply, and case temperature ≤ 90°C. The device achieves 2000 MIPS and 500 MMACS at this frequency, as specified in the SPRS104I datasheet revision March 2004.

Does the TMS320C6202GJL250X support external SDRAM interfacing without glue logic?

Yes, the TMS320C6202GJL250X includes a glueless 32-bit external memory interface (EMIF) that directly connects to standard SDRAM components. Its EMIF provides all necessary control signals - including RAS, CAS, WE, and DQM - with programmable timing registers (SDCTL, SDTIM) to match vendor-specific SDRAM timing requirements, eliminating the need for external address latches or bus transceivers.

How many multichannel buffered serial ports does the TMS320C6202GJL250X integrate?

The TMS320C6202GJL250X integrates three fully independent multichannel buffered serial ports (McBSP0, McBSP1, McBSP2). Each supports T1/E1 framing, AC97 audio codec interfacing, SPI protocol, and ST-Bus switching, with up to 256 channels per port. These are implemented in hardware and require no software emulation or external interface ICs.

What is the on-chip memory configuration of the TMS320C6202GJL250X?

The TMS320C6202GJL250X contains 3M-bit of on-chip SRAM: 2M-bit allocated to program memory (organized as two 128K-byte blocks - one mapped, one configurable as cache or mapped) and 1M-bit allocated to data memory (two 64K-byte dual-access RAM blocks). This structure enables concurrent instruction fetch and data access with no wait states under typical usage patterns.

Is the TMS320C6202GJL250X pin-compatible with other C62x devices?

The TMS320C6202GJL250X shares pin compatibility with the C6202 GLS package and the C6203B GLS package, but not with GNZ/GNY variants. Specifically, the GJL and GLS packages are pin-compatible except that the GLS includes additional inner-row power/ground balls absent in GJL. Migration to C6202B GNZ requires voltage and PLL revalidation due to 1.5-V core and reduced multiplier options.

TMS320C6202GJL250X Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C62x
Package/Case:
352-BBGA, FCBGA Exposed Pad
Packaging:
Tube
Product Status:
Not For New Designs
Type:
Fixed Point
Interface:
McBSP
Clock Rate:
250MHz
Non-Volatile Memory:
External
On-Chip RAM:
384kB
Voltage - I/O:
3.30V
Voltage - Core:
1.80V
Operating Temperature:
0°C ~ 90°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
352-FCBGA (27x27)

TMS320C6202GJL250X FAQ

1.How can I place an order for TMS320C6202GJL250X through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6202GJL250X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6202GJL250X reliable?

The price and inventory of TMS320C6202GJL250X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6202GJL250X is usually 5 days.

3.What payment methods are accepted for TMS320C6202GJL250X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6202GJL250X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320C6202GJL250X?

TMS320C6202GJL250X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6202GJL250X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6202GJL250X?

For technical support, including TMS320C6202GJL250X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6202GJL250X requirements.

6.How does Aetrix verify that TMS320C6202GJL250X is sourced from the original manufacturer or authorized distributors?

All TMS320C6202GJL250X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6202GJL250X meets industry standards.

7.What is the process for return or replacement of TMS320C6202GJL250X?

All TMS320C6202GJL250X units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6202GJL250X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6202GJL250X part is unused and in its original packaging.

Return procedure for TMS320C6202GJL250X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMS320C6202GJL250X Tags

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