Texas Instruments TMS320C6202GLS250
- Part No.:
- TMS320C6202GLS250
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 384-BFBGA, FCBGA
- Datasheet:
-
TMS320C6202GLS250.pdf
- Description:
- IC FIXED-POINT DSP 384-BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6202GLS250 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI™ VLIW architecture, delivering 2000 MIPS at 250 MHz with eight 32-bit instructions/cycle, 3M-bit on-chip SRAM (2M-bit program/cache + 1M-bit dual-access data), and 32-bit external memory interface supporting SDRAM, SBSRAM, SRAM, and EPROM for real-time telecom baseband processing.
For engineers reviewing the TMS320C6202GLS250 datasheet, TMS320C6202GLS250 pinout, TMS320C6202GLS250 application, or TMS320C6202GLS250 equivalent, key selection criteria include its 384-pin GLS BGA package, 1.8-V core / 3.3-V I/O voltage scheme, 3-channel McBSP support for T1/E1 framing, and 4-channel DMA with auxiliary channel - all critical for multichannel voice/data gateway designs.
Technical Context
The TMS320C6202GLS250 implements a dual-path VelociTI™ VLIW CPU with two register files (A/B, 32 × 32-bit), eight functional units (six ALUs, two 16-bit multipliers), and load-store architecture enabling two multiply-accumulates per cycle (500 MMACS). Its instruction set supports conditional execution, saturation, bit-field manipulation, and byte/half-word/word addressing.
It integrates a flexible PLL clock generator (x1, x4, x6, x7, x8, x9, x10, x11 multipliers), 32-bit expansion bus (XBus) with master/slave capability for PCI bridge interfacing, and three McBSPs compliant with AC97, SPI, ST-Bus, and T1/E1 framer standards - all operating within a 0.18-μm CMOS process.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | VelociTI™ VLIW DSP core with eight independent functional units (6 ALUs + 2 multipliers) enabling parallel 8-instruction execution per cycle. |
| Clock Rate / Cycle Time | 250 MHz / 4 ns - determines maximum deterministic throughput for real-time filtering and FFT operations in voice codecs. |
| Performance | 2000 MIPS / 500 MMACS - enables concurrent execution of multiple 64-tap FIR filters or 1024-point FFTs in telecom infrastructure. |
| On-Chip Memory | 3M-bit SRAM: 2M-bit program/cache (64K × 32-bit instructions) + 1M-bit dual-access data RAM (128K bytes, split into two 64K-byte blocks). |
| External Interface | 32-bit EMIF with glueless SDRAM/SBSRAM and asynchronous SRAM/EPROM support - eliminates address latching logic in memory subsystem design. |
| I/O Voltage / Core Voltage | 3.3-V I/Os / 1.8-V internal core - defines power domain partitioning and requires dual-rail supply sequencing during boot. |
| Package | 384-pin GLS BGA (18 × 18 mm) - pin-compatible with C6204 GLW package except inner-row power/ground balls are omitted. |
Pinout & Package
384-pin GLS Ball Grid Array (BGA) package, 18 mm × 18 mm footprint, 1.27-mm ball pitch, bottom-view layout with defined signal groups (EMIF, McBSP, XBus, PLL, power/ground). Pin mapping follows TI's standardized C62x GLS mechanical drawing SPRS104I.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock reference | Accepts external crystal or oscillator input feeding PLL; frequency multiplied to generate 250-MHz core clock. |
| CLKOUT | Output clock monitor | Provides buffered copy of internal CLKX for trace/debug synchronization or peripheral clocking. |
| EMIF Address/Data Bus (EA[22:0], ED[31:0]) | External memory interface | 32-bit multiplexed address/data bus supporting up to 52-Mbyte address space across CE0–CE3 zones. |
| McBSP0–2 Serial Pins (DX0–2, DR0–2, FSX0–2, FSR0–2) | Multi-channel serial I/O | Three independent full-duplex serial ports supporting T1/E1 framing, AC97 audio, and SPI peripherals without external glue logic. |
| XBUS Pins (XD[31:0], XA[23:0], XCS0–3) | Expansion bus interface | 32-bit synchronous/asynchronous host bus interface compatible with PCI bridges (e.g., TI PCI2040) and microprocessor buses. |
| VDD_CORE, VDD_IO | Power supply terminals | Dual-rail supply: 1.8 V ± 0.1 V for core logic; 3.3 V ± 0.3 V for I/O buffers - mandates separate LDO regulation and sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Eight-functional-unit VLIW core | Enables true parallelism across arithmetic, logical, and multiply operations - essential for deterministic real-time signal flow in voice gateways. |
| 32-bit EMIF with SDRAM support | Eliminates external address latches and timing glue logic when interfacing to high-density, low-cost DDR-capable SDRAM modules. |
| Three McBSPs with T1/E1 framing | Direct connection to line interface units (LIUs) and framer ICs (e.g., TI TSB12LV01) without protocol translation logic. |
| Four-channel DMA with auxiliary channel | Offloads CPU from memory-mapped peripheral transfers - sustains continuous data flow between McBSPs, EMIF, and internal RAM during active processing. |
| Flexible PLL clock generator | Supports multiple CLKIN multipliers (x1, x4, x6–x11) - allows single crystal source to drive both core and peripheral clocks at optimal frequencies. |
Applications
| Voice-over-IP Gateway | Wireless Base Station Transceiver |
|---|---|
|
Use Scenario: Real-time G.729/G.723.1 speech coding/decoding across 32+ concurrent VoIP channels. IC Role / Device Role / Timing Role: Primary fixed-point DSP executing codec algorithms, managing McBSP-linked CODECs, and buffering packetized voice via EMIF-connected SDRAM. Use Value: 2000 MIPS and dual-access 128K-byte data RAM enable simultaneous multi-channel encode/decode with sub-15-ms latency. |
Use Scenario: Digital downconversion (DDC) and upconversion (DUC) for 4-carrier GSM/EDGE transceivers. IC Role / Device Role / Timing Role: Baseband processor handling channel filtering, interpolation, and modulation/demodulation using internal multipliers and ALUs. Use Value: Two 16-bit multipliers delivering 500 MMACS sustain real-time 128-tap FIR filtering per carrier at 250 MHz clock rate. |
| Industrial Motor Control System | Medical Ultrasound Beamformer |
|
Use Scenario: Closed-loop field-oriented control (FOC) for 3-phase PMSM drives with sensorless position estimation. IC Role / Device Role / Timing Role: Real-time execution of Clarke/Park transforms, PI regulators, and SVM generation - synchronized to PWM timers and ADC triggers. Use Value: Deterministic 4-ns instruction cycle and conditional instruction support ensure jitter-free control loop execution at 20-kHz update rates. |
Use Scenario: Digital beamforming of 64-channel ultrasound echo data with dynamic focusing and apodization. IC Role / Device Role / Timing Role: High-throughput signal processor performing delay-and-sum operations, envelope detection, and log compression on raw RF samples. Use Value: 32 general-purpose registers and load-store architecture minimize memory bottlenecks during massive parallel sample processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6202GNZ250 | Same core, 352-pin GNZ BGA, 1.8-V core, but lacks inner-row power/ground balls - lower thermal dissipation margin. | Suitable for space-constrained PCBs where GLS footprint is prohibitive; reduced pin count limits EMIF/XBus routing flexibility. | Select when board area is constrained and full GLS I/O count is unnecessary; verify thermal derating under sustained 2000-MIPS load. |
| TMS320C6202BGLS250 | 1.5-V core (vs. 1.8 V), 0.15-μm process, identical GLS package - higher performance density but stricter supply sequencing. | Enables higher clock stability at 250 MHz with lower dynamic power; requires revised power-supply design and voltage-margin validation. | Choose for new designs targeting lower power-per-MIPS; avoid drop-in replacement due to core voltage and sequencing incompatibility. |
Compared with TMS320C6202GLS250, the GNZ variant trades pin count and thermal headroom for compactness, while the C6202BGLS250 delivers identical speed in a more power-efficient node but demands redesigned power delivery - neither is pin-compatible without electrical and layout review.
Availability
TMS320C6202GLS250 is available at Aetrix Electronics and suitable for voice-over-IP gateways, wireless base station transceivers, and industrial motor control systems requiring stable component supply across extended production lifecycles.
Supply support for TMS320C6202GLS250 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of DSP innovation rooted in the TMS320 family.
The TMS320C6202GLS250 belongs to the C62x™ fixed-point DSP product line, designed specifically for cost-sensitive, high-throughput real-time signal processing in telecom infrastructure, industrial automation, and medical imaging equipment.
FAQ
What is the maximum clock frequency supported by the TMS320C6202GLS250?
The TMS320C6202GLS250 operates at a maximum clock frequency of 250 MHz, corresponding to a 4-ns instruction cycle time. This rating is validated under recommended operating conditions (1.8-V core, 3.3-V I/O, case temperature ≤ 90°C) and enables 2000 MIPS throughput. Exceeding 250 MHz violates the device's production specifications and may cause timing violations or functional failure in the TMS320C6202GLS250.
Does the TMS320C6202GLS250 support SDRAM interfacing without external logic?
Yes, the TMS320C6202GLS250 features a glueless 32-bit external memory interface (EMIF) with dedicated SDRAM control signals (SDCTL, SDTIM) and burst-mode timing - enabling direct connection to standard SDRAM chips without address latches, bus transceivers, or custom timing logic. This capability is confirmed in the TMS320C6202GLS250 datasheet section "32-Bit External Memory Interface (EMIF)".
How many multichannel buffered serial ports (McBSPs) does the TMS320C6202GLS250 integrate?
The TMS320C6202GLS250 integrates three fully independent multichannel buffered serial ports (McBSP0, McBSP1, McBSP2), each supporting T1/E1 framing, AC97 audio, SPI, and ST-Bus protocols. Each McBSP provides up to 256 time slots and includes dedicated transmit/receive clocks, frame syncs, and data lines - all documented in the TMS320C6202GLS250 functional description and peripheral register tables.
What is the on-chip memory configuration of the TMS320C6202GLS250?
The TMS320C6202GLS250 contains 3M-bit of on-chip SRAM: 2M-bit allocated to program memory (64K × 32-bit instructions, configurable as cache or mapped program space) and 1M-bit allocated to dual-access data memory (128K bytes, organized as two 64K-byte blocks for concurrent read/write access). This structure is explicitly defined in the "3M-Bit On-Chip SRAM" section of the TMS320C6202GLS250 datasheet.
Is the TMS320C6202GLS250 pin-compatible with other C62x devices?
The TMS320C6202GLS250 is pin-compatible with the TMS320C6204 GLW package (340-pin BGA), differing only in the omission of the inner-row power/ground balls - a mechanical compatibility confirmed in the TMS320C6202GLS250 datasheet footnote. It is not pin-compatible with GNZ/GNY packages (352/384-pin) due to distinct ball maps and power distribution schemes.
TMS320C6202GLS250 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C62x
- Package/Case:
- 384-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- McBSP
- Clock Rate:
- 250MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.80V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 384-FCBGA (18x18)
TMS320C6202GLS250 FAQ
1.How can I place an order for TMS320C6202GLS250 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6202GLS250 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6202GLS250 reliable?
The price and inventory of TMS320C6202GLS250 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6202GLS250 is usually 5 days.
3.What payment methods are accepted for TMS320C6202GLS250?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6202GLS250 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6202GLS250?
TMS320C6202GLS250 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6202GLS250 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6202GLS250?
For technical support, including TMS320C6202GLS250 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6202GLS250 requirements.
6.How does Aetrix verify that TMS320C6202GLS250 is sourced from the original manufacturer or authorized distributors?
All TMS320C6202GLS250 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6202GLS250 meets industry standards.
7.What is the process for return or replacement of TMS320C6202GLS250?
All TMS320C6202GLS250 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6202GLS250, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6202GLS250 part is unused and in its original packaging.
Return procedure for TMS320C6202GLS250:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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